7SB385 Bus Switch The 7SB385 Bus Switch is an advanced high−speed line switch in ultra−small footprint. Features • • • • • High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V 3 W Switch Connection Between 2 Ports Power Down Protection Provided on Inputs Ultra−Small Packages These are Pb−Free Devices A http://onsemi.com MARKING DIAGRAMS 5 5 1 B SOT−353/SC70−5/SC−88A DF SUFFIX CASE 419A OE AF MG G 1 Figure 1. Logic Diagram 1 A B 2 GND 3 5 4 VCC OE 1 6 VCC B 2 5 NC GND 3 4 OE Figure 3. ULLGA6/UDFN6 (Top View) SOT23−5/TSOP−5/SC59−5 DT SUFFIX CASE 483 ULLGA6 1.0 x 1.0 CASE 613AD 1 Input OE Function L Disconnect H B=A 1 1 ULLGA6 1.2 x 1.0 CASE 613AE ULLGA6 1.45 x 1.0 CASE 613AF G M M G G F UDFN6 1.2 x 1.0 CASE 517AA 1 V Function Table AF MG G 1 4 Figure 2. TSOP−5/SC−88A (Top View) A 5 J 5 G M M 1 AF, 4, V, J, F = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 2 1 Publication Order Number: 7SB385/D 7SB385 Table 1. MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN Control Pin Input Voltage −0.5 to +7.0 V VI/O Switch Input / Output Voltage −0.5 to +7.0 V IIK Control Pin DC Input Diode Current VIN < GND −50 mA IOK Switch I/O Port DC Diode Current VI/O < GND −50 mA IO On−State Switch Current ±128 mA Continuous Current Through VCC or GND ±150 mA ICC DC Supply Current per Supply Pin ±150 mA IGND DC Ground Current per Ground Pin ±150 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C qJA Thermal Resistance SC70−5/SC−88A (Note 1) TSOP−5 ULLGA6/UDFN6 350 230 496 °C/W PD Power Dissipation in Still Air at 85°C SC70−5/SC−88A (Note 1) TSOP−5 ULLGA6/UDFN6 150 200 252 mW MSL Moisture Sensitivity FR Flammability Rating VESD ILATCHUP Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Mode (Note 2) Machine Mode (Note 3) Charged Device Mode (Note 4) Latchup Performance Above VCC and Below GND at 85°C (Note 5) >2000 >200 N/A V ±100 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/ JESD22−A114−A 3. Tested to EIA/ JESD22−A115−A 4. Tested to JESD22−C101−A 5. Tested to EIA / JESD78. Table 2. RECOMMENDED OPERATING CONDITIONS Symbol VCC VI VI/O Parameter Min Max Unit 4.0 5.5 V Control Pin Input Voltage 0 5.5 V Switch Input / Output Voltage 0 5.5 V −55 +125 °C 0 0 5 DC nS/V Positive DC Supply Voltage TA Operating Free−Air Temperature Dt / DV Input Transition Rise or Fall Rate Control Input Switch I/O http://onsemi.com 2 7SB385 Table 3. DC ELECTRICAL CHARACTERISTICS TA = 255C Symbol Parameter Conditions VCC (V) IIN = −18 mA 4.5 Min Typ TA = −555C to +1255C Max Min −1.2 Max Unit −1.2 V VIK Clamp Diode Voltage VIH High−Level Input Voltage (Control) 4.0 to 5.5 VIL Low−Level Input Voltage (Control) 4.0 to 5.5 0.8 0.8 V IIN Input Leakage Current 0 ≤ VIN ≤ 5.5 V 5.5 ±0.1 ±1.0 mA IOFF Power Off Leakage Current VI/O = 0 to 5.5 V 0 ±0.1 ±1.0 mA ICC Quiescent Supply Current IO = 0, VIN = VCC or 0 V 5.5 ±0.1 ±1.0 mA DICC Increase in Supply Current (Control Pin) One input at 3.4 V; Other inputs at VCC or GND 5.5 2.5 mA RON Switch ON Resistance VI/O = 0, II/O = 64 mA II/O = 30 mA 4.5 VI/O = 2.4, II/O = 15 mA 4.5 VI/O = 2.4, II/O = 15 mA 4.0 2.0 2.0 V W 3 3 7 7 7 7 6 15 15 10 20 20 Table 4. AC ELECTRICAL CHARACTERISTICS TA = −555C to +1255C TA = 255C Symbol Parameter VCC (V) Test Condition See Figure 3 Min Typ Max Min Max Unit 0.25 ns tPD Propagation Delay, A to B or B to A 4.0 to 5.5 tEN Output Enable Time 4.5 to 5.5 0.8 2.5 4.2 0.8 4.2 4.0 0.8 3.0 4.6 0.8 4.6 4.5 to 5.5 0.8 3.1 4.8 0.8 4.8 4.0 0.8 2.9 4.4 0.8 4.4 tDIS CIN Output Disable Time 0.25 0.25 Control Input Capacitance 5.0 CIO(ON) Switch On Capacitance 5.0 CIO(OFF) Switch Off Capacitance 5.0 VIN = 3 V or 0 0.25 ns ns 2.0 pF Switch ON 10 pF Switch OFF 3.5 pF http://onsemi.com 3 7SB385 AC Loading and Waveforms TEST S1 tPD tPLZ/tPZL tPHZ/tPZH Open 7V GND 7V 500 W From Output Under Test CL = 50 pF (see Note A) S1 Open GND 500 W Output Waveform 1 S1 at 7 V (see Note B) 3V Input 1.5 V 1.5 V 0V tPHL tPLH Output Waveform 2 S1 at Open (see Note B) VOH 1.5 V 1.5 V Output 3V Output Control LOAD CIRCUIT VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES 1.5 V 1.5 V 0V tPZL tPLZ 1.5 V 3.5 V VOL + 0.3 V tPZH VOL tPHZ 1.5 V VOH − 0.3 V VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 W, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The output is measured with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 4. Load Circuit and Voltage Waveforms DEVICE ORDERING INFORMATION Package Shipping† 7SB385DTT1G TSOP−5 (Pb−Free) 3000 / Tape & Reel 7SB385DFT2G SC−88A (Pb−Free) 3000 / Tape & Reel 7SB385AMX1TCG ULLGA6 − 0.5 mm Pitch (Pb−Free) 3000 / Tape & Reel 7SB385BMX1TCG ULLGA6 − 0.4 mm Pitch (Pb−Free) 3000 / Tape & Reel 7SB385CMX1TCG ULLGA6 − 0.35 mm Pitch (Pb−Free) 3000 / Tape & Reel UDFN6 − 0.4 mm Pitch (Pb−Free) 3000 / Tape & Reel Device 7SB385MUTCG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 7SB385 PACKAGE DIMENSIONS SC−88A, SOT−353, SC−70 CASE 419A−02 ISSUE J A G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N J C H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. K http://onsemi.com 5 INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 7SB385 PACKAGE DIMENSIONS TSOP−5 CASE 483−02 ISSUE H D NOTE 5 2X 0.10 T 2X 0.20 T NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. 5X 0.20 C A B M 5 1 4 2 L 3 B S K DETAIL Z G A DIM A B C D G H J K L M S DETAIL Z J C 0.05 SEATING PLANE H T MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 7SB385 PACKAGE DIMENSIONS UDFN6 1.2x1.0, 0.4P CASE 517AA−01 ISSUE C EDGE OF PACKAGE PIN ONE REFERENCE 2X 0.10 C L1 ÉÉÉ ÉÉÉ E DETAIL A Bottom View (Optional) TOP VIEW 2X (A3) 0.10 C A1 A 0.08 C A3 DETAIL B Side View (Optional) 5X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT* 6X 6X 0.42 C A1 DIM A A1 A3 b D E e L L1 L2 MOLD CMPD SEATING PLANE SIDE VIEW 1 ÉÉÉ ÉÉÉ EXPOSED Cu 0.10 C 10X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D 0.22 L 3 L2 6X b 0.10 C A B 0.05 C 6 0.40 PITCH 4 e NOTE 3 1.07 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW http://onsemi.com 7 7SB385 PACKAGE DIMENSIONS A B D PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ 0.10 C ULLGA6 1.0x1.0, 0.35P CASE 613AD−01 ISSUE A E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 5X 0.48 e 5X L NOTE 4 3 1 1.18 L1 0.53 6 4 6X 1 PKG OUTLINE b 0.05 C 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 6X 0.22 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 7SB385 PACKAGE DIMENSIONS ULLGA6 1.2x1.0, 0.4P CASE 613AE−01 ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.35 0.45 5X 0.49 e 5X L NOTE 4 3 1 1.24 L1 0.53 6 4 6X b 0.05 C 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 6X 0.26 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 9 7SB385 PACKAGE DIMENSIONS ULLGA6 1.45x1.0, 0.5P CASE 613AF−01 ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 5X C A1 e 5X L MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 0.49 NOTE 4 3 1 1.24 L1 0.53 6 4 BOTTOM VIEW 6X 0.30 6X b 0.10 C A B 0.05 C NOTE 3 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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