7WB383 Bus Exchange Switch The 7WB383 is an advanced high−speed low−power bus exchange switch in ultra−small footprints. Features • • • • • • • High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V 3 W Switch Connection Between 2 Ports Power Down Protection Provided on Inputs Zero Bounce TTL−Compatible Control Inputs Ultra−Small Pb−Free Packages These are Pb−Free Devices http://onsemi.com MARKING DIAGRAMS APM G 1 ULLGA8 1.45 x 1.0 CASE 613AA M G 1 ULLGA8 1.6 x 1.0 CASE 613AB AXM G 1 ULLGA8 1.95 x 1.0 CASE 613AC AXM G J 1 UDFN8 MU SUFFIX CASE 517AJ 8 8 Micro8] DM SUFFIX CASE 846A 383 AYWG G 1 A Y W M G = Assembly Location = Year = Work Week = Date Code = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2010 April, 2010 − Rev. 0 1 Publication Order Number: 7WB383/D 7WB383 OE A 8 1 2 7 VCC C B 3 6 D GND 4 5 EX OE 1 8 VCC A 2 7 C B 3 6 D GND 4 5 EX Figure 2. Micro8 (Top View) Figure 1. ULLGA8/UDFN8 (Top Thru−View) A C B FUNCTION TABLE Input OE Input EX Function L L A = C; B = D L H A = D; B = C H X Disconnect D EX OE Figure 3. Logic Diagram http://onsemi.com 2 7WB383 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage Parameter −0.5 to +7.0 V VIN Control Pin Input Voltage −0.5 to +7.0 V VI/O Switch Input / Output Voltage −0.5 to +7.0 V IIK Control Pin DC Input Diode Current VIN < GND −50 mA IOK Switch I/O Port DC Diode Current VI/O < GND −50 mA IO ON−State Switch Current $128 mA Continuous Current Through VCC or GND $150 mA ICC DC Supply Current Per Supply Pin $150 mA IGND DC Ground Current per Ground Pin $150 mA TSTG Storage Temperature Range −65 to +150 °C 260 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL FR VESD ILATCHUP 150 °C UDFN8 (Note 1) ULLGA8 Micro8 111 455 392 °C/W UDFN8 ULLGA8 Micro8 1127 274 319 mW Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Mode (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V $200 mA Latchup Performance Above VCC and Below GND at 125 °C (Note 5) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22−A114−A. 3. Tested to EIA / JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 4.0 5.5 V VCC Positive DC Supply Voltage VIN Control Pin Input Voltage 0 5.5 V VI/O Switch Input / Output Voltage 0 5.5 V −55 +125 °C 0 0 5 DC nS/V TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Control Input Switch I/O http://onsemi.com 3 7WB383 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VCC (V) Conditions Min Typ 4.5 Max Min −1.2 Max Unit −1.2 V VIK Clamp Diode Voltage VIH High−Level Input Voltage (Control) 4.0 to 5.5 VIL Low−Level Input Voltage (Control) 4.0 to 5.5 0.8 0.8 V VOH Output Voltage High See Figure 4 Input Leakage Current 0 v VIN v 5.5 V 5.5 $0.1 $1.0 mA IOFF Power Off Leakage Current VI/O = 0 to 5.5 V 0 $0.1 $1.0 mA ICC Quiescent Supply Current IO = 0, VIN = VCC or 0 V 5.5 $0.1 $1.0 mA DICC Increase in Supply Current (Control Pin) One input at 3.4 V; Other inputs at VCC or GND 5.5 2.5 mA RON Switch ON Resistance VI/O = 0, II/O = 64 mA II/O = 30 mA 4.5 IIN II/O = −18 mA TA = −555C to +1255C TA = 255C 2.0 VI/O = 2.4, II/O = 15 mA VI/O = 2.4, II/O = 15 mA 4.0 2.0 V 3 3 7 7 7 7 6 15 15 10 20 20 W AC ELECTRICAL CHARACTERISTICS VCC (V) Min Typ Max Max Unit 0.25 0.25 ns 4.5 4.5 ns 0.8 4.2 ns 4.6 0.8 4.6 3.0 4.8 0.8 4.8 2.9 4.4 0.8 4.4 Symbol Parameter tPD Propagation Delay, Bus to Bus See Figure 5 4.0 to 5.5 tPD−EX Propagation Delay, EX to Bus See Figure 5 and Figure 6 4.0 to 5.5 Output Enable Time See Figure 5 4.5 to 5.5 0.8 2.5 4.2 4.0 0.8 3.0 4.5 to 5.5 0.8 4.0 0.8 tEN tDIS CIN Test Condition TA = −555C to +1255C TA = 25 5C Output Disable Time Min ns Control Input Capacitance VIN = 5 or 0 V 5.0 2.5 pF CIO(ON) Switch On Capacitance Switch ON 5.0 10 pF CIO(OFF) Switch Off Capacitance Switch OFF 5.0 5 pF http://onsemi.com 4 7WB383 TYPICAL DC CHARACTERISTICS 4.50 VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 4.25 −6 mA 4.00 −12 mA 3.75 IOH = −0.1 mA 3.50 3.25 −24 mA 3.00 2.75 TA = +85°C VIN = VCC 2.50 2.25 4.00 4.25 4.75 5.25 5.00 5.50 5.75 5.60 VCC, SUPPLY VOLTAGE (V) 4.50 VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 4.25 −6 mA −12 mA 4.00 3.75 IOH = −0.1 mA 3.50 3.25 −24 mA 3.00 2.75 TA = +25°C VIN = VCC 2.50 2.25 4.00 4.25 4.75 5.25 5.00 5.50 5.75 5.60 VCC, SUPPLY VOLTAGE (V) 4.50 VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 4.25 −6 mA 4.00 −12 mA 3.75 IOH = −0.1 mA 3.50 3.25 −24 mA 3.00 2.75 TA = −40°C VIN = VCC 2.50 2.25 4.00 4.25 4.75 5.25 5.00 5.50 5.75 5.60 VCC, SUPPLY VOLTAGE (V) Figure 4. Output Voltage High vs Supply Voltage http://onsemi.com 5 7WB383 AC LOADING AND WAVEFORMS From Output Under Test 500 W 7V S1 Open Test S1 GND CL = 50 pF* 500 W tPD Open tPLZ/tPZL 7V tPHZ/tPZH Open *CL includes probes and jig capacitance. 1.5 V 1.5 V Output Control 3V Input tPHL VOH Output 1.5 V 1.5 V 1.5 V Output Waveform 2 S1 at Open (Note 6) VOL Voltage Waveforms Propagation Delay Times 1.5 V 3V 0V tPLZ tPZL Output Waveform 1 S1 at 7 V (Note 6) tPZH 0V tPLH 1.5 V 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ VOH VOH − 0.3 V 0V Voltage Waveforms Enable and Disable Times 6. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control 7. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, ZO = 50 W, tr v 2.5 ns, tf v 2.5 ns. 8. The outputs are measured one at a time, with one transition per measurement. 9. tPLZ and tPHZ are the same as tDIS. 10. tPZL and tPZH are the same as tEN. 11. tPHL and tPLH are the same as tPD. Figure 5. PD, tEN, tDIS Loading and Waveforms tr 2.5 ns tf 2.5 ns 3V Exchange (EX) 90% 1.5 V 10% GND tPHL tPLH Output (A, B, C, D) 1.5 V VOH Output (A, B, C, D) VOL 1.5 V tPHL tPLH Figure 6. tPD−EX Waveforms http://onsemi.com 6 7WB383 ORDERING INFORMATION Package Shipping† UDFN8 (Pb−Free) 3000 / Tape & Reel 7WB383AMX1TCG ULLGA8 – 0.5 mm Pitch (Pb−Free) 3000 / Tape & Reel 7WB383BMX1TCG ULLGA8 – 0.4 mm Pitch (Pb−Free) 3000 / Tape & Reel 7WB383CMX1TCG ULLGA8 – 0.35 mm Pitch (Pb−Free) 3000 / Tape & Reel Micro8 (Pb−Free) 4000 / Tape & Reel Device 7WB383MUTAG 7WB383DMR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7 7WB383 PACKAGE DIMENSIONS UDFN8 1.8 x 1.2, 0.4P CASE 517AJ−01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B D 0.10 C PIN ONE REFERENCE ÉÉ ÉÉ 0.10 C L1 E DETAIL A NOTE 5 TOP VIEW (A3) 0.05 C DIM A A1 A3 b b2 D E e L L1 L2 A 0.05 C SIDE VIEW e/2 A1 e (b2) 1 C SEATING PLANE DETAIL A 8X L 4 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF MOUNTING FOOTPRINT* SOLDERMASK DEFINED (L2) 8 5 BOTTOM VIEW 8X 8X b 0.10 M C A B 0.05 M C 0.66 7X 0.22 NOTE 3 1.50 1 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 7WB383 PACKAGE DIMENSIONS ULLGA8 1.45x1.0, 0.35P CASE 613AA−01 ISSUE A ÉÉÉ ÉÉÉ ÉÉÉ PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 8X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 7X 0.48 8X 0.22 e/2 e 1 7X L NOTE 4 4 1.18 L1 0.53 8 5 8X b 0.05 C PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 9 7WB383 PACKAGE DIMENSIONS ULLGA8 1.6x1.0, 0.4P CASE 613AB−01 ISSUE A PIN ONE REFERENCE 0.10 C 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 8X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 7X 0.49 e/2 e 1 4 8 5 7X L NOTE 4 1.24 L1 0.53 8X b 0.05 C 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 8X 0.26 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 10 7WB383 PACKAGE DIMENSIONS ULLGA8 1.95x1.0, 0.5P CASE 613AC−01 ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 A 8X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 7X C A1 0.49 8X 0.30 e/2 e 7X L NOTE 4 4 1 1.24 L1 0.53 8 5 BOTTOM VIEW 8X b 0.10 C A B 0.05 C 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 11 7WB383 PACKAGE DIMENSIONS Micro8t CASE 846A−02 ISSUE H D HE PIN 1 ID NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. E e b 8 PL 0.08 (0.003) M T B S A S SEATING −T− PLANE 0.038 (0.0015) A A1 MILLIMETERS NOM MAX −− 1.10 0.08 0.15 0.33 0.40 0.18 0.23 3.00 3.10 3.00 3.10 0.65 BSC 0.40 0.55 0.70 4.75 4.90 5.05 DIM A A1 b c D E e L HE MIN −− 0.05 0.25 0.13 2.90 2.90 INCHES NOM −− 0.003 0.013 0.007 0.118 0.118 0.026 BSC 0.016 0.021 0.187 0.193 MIN −− 0.002 0.010 0.005 0.114 0.114 MAX 0.043 0.006 0.016 0.009 0.122 0.122 0.028 0.199 L c SOLDERING FOOTPRINT* 8X 1.04 0.041 0.38 0.015 3.20 0.126 6X 8X 4.24 0.167 0.65 0.0256 5.28 0.208 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Micro8 is a trademark of International Rectifier. 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