7WB3306 2-Bit Bus Switch The 7WB3306 is an advanced high−speed low−power 2−bit bus switch in ultra−small footprints. Features • • • • • • • High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V 3 W Switch Connection Between 2 Ports Power Down Protection Provided on Inputs Zero Bounce TTL−Compatible Control Inputs Ultra−Small Pb−Free Packages These are Pb−Free Devices http://onsemi.com MARKING DIAGRAMS ANM G 1 ULLGA8 1.45 x 1.0 CASE 613AA M G 1 ULLGA8 1.6 x 1.0 CASE 613AB AWM G 1 ULLGA8 1.95 x 1.0 CASE 613AC AWM G F 1 UDFN8 MU SUFFIX CASE 517AJ 8 8 Micro8] DM SUFFIX CASE 846A 3306 AYWG G 1 8 AAA YWW A G TSSOP8 DT SUFFIX CASE 948AL 1 A Y W M G = Assembly Location = Year = Work Week = Date Code = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2010 December, 2010 − Rev. 2 1 Publication Order Number: 7WB3306/D 7WB3306 OE1 A1 8 1 2 7 VCC OE2 B1 3 6 B2 GND 4 5 A2 OE1 1 8 VCC A1 2 7 OE2 B1 3 6 B2 GND 4 5 A2 Figure 2. Micro8/TSSOP8 (Top View) Figure 1. ULLGA8/UDFN8 (Top Thru−View) A1 B1 FUNCTION TABLE OE1 A2 B2 OE2 Figure 3. Logic Diagram http://onsemi.com 2 Input OEn Function L Bn = An H Disconnect 7WB3306 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage Parameter −0.5 to +7.0 V VIN Control Pin Input Voltage −0.5 to +7.0 V VI/O Switch Input / Output Voltage −0.5 to +7.0 V IIK Control Pin DC Input Diode Current VIN < GND −50 mA IOK Switch I/O Port DC Diode Current VI/O < GND −50 mA IO ON−State Switch Current $128 mA Continuous Current Through VCC or GND $150 mA ICC DC Supply Current Per Supply Pin $150 mA IGND DC Ground Current per Ground Pin $150 mA TSTG Storage Temperature Range −65 to +150 °C 260 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL FR VESD ILATCHUP 150 °C UDFN8 (Note 1) ULLGA8 Micro8 TSSOP8 111 455 392 150 °C/W UDFN8 ULLGA8 Micro8 TSSOP8 1127 274 319 833 mW Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage (Note 2) UL 94 V−0 @ 0.125 in Human Body Model, all pins Human Body Model, An/Bn to Ground Human Body Model, An/Bn to VCC Latchup Performance Above VCC and Below GND at 125°C (Note 3) > 1.5 >4 >4 kV kV kV $100 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22−A114−A. 3. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 4.0 5.5 V VCC Positive DC Supply Voltage VIN Control Pin Input Voltage 0 5.5 V VI/O Switch Input / Output Voltage 0 5.5 V −55 +125 °C 0 0 5 DC nS/V TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Control Input Switch I/O http://onsemi.com 3 7WB3306 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VCC (V) Conditions Min Typ 4.5 Max Min −1.2 Max Unit −1.2 V VIK Clamp Diode Voltage VIH High−Level Input Voltage (Control) 4.0 to 5.5 VIL Low−Level Input Voltage (Control) 4.0 to 5.5 0.8 0.8 V VOH Output Voltage High See Figure 4 Input Leakage Current 0 v VIN v 5.5 V 5.5 $0.1 $1.0 mA IOFF Power Off Leakage Current VI/O = 0 to 5.5 V 0 $0.1 $1.0 mA ICC Quiescent Supply Current IO = 0, VIN = VCC or 0 V 5.5 $0.1 $1.0 mA DICC Increase in Supply Current (Control Pin) One input at 3.4 V; Other inputs at VCC or GND 5.5 2.5 mA RON Switch ON Resistance VI/O = 0, II/O = 64 mA II/O = 30 mA 4.5 IIN II/O = −18 mA TA = −555C to +1255C TA = 255C 2.0 VI/O = 2.4, II/O = 15 mA VI/O = 2.4, II/O = 15 mA 4.0 2.0 V 3 3 7 7 7 7 6 15 15 10 20 20 W AC ELECTRICAL CHARACTERISTICS Symbol Parameter VCC (V) Test Condition TA = −555C to +1255C TA = 25 5C Min Typ Max Min Unit 0.25 ns ns tPD Propagation Delay, Bus to Bus See Figure 5 4.0 to 5.5 tEN Output Enable Time See Figure 5 4.5 to 5.5 0.8 2.5 4.2 0.8 4.2 4.0 0.8 3.0 4.6 0.8 4.6 4.5 to 5.5 0.8 3.0 4.8 0.8 4.8 4.0 0.8 2.9 4.4 0.8 4.4 tDIS CIN Output Disable Time 0.25 Max ns Control Input Capacitance VIN = 5 or 0 V 5.0 2.5 pF CIO(ON) Switch On Capacitance Switch ON 5.0 10 pF CIO(OFF) Switch Off Capacitance Switch OFF 5.0 5 pF http://onsemi.com 4 7WB3306 TYPICAL DC CHARACTERISTICS 4.50 VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 4.25 −6 mA 4.00 −12 mA 3.75 IOH = −0.1 mA 3.50 3.25 −24 mA 3.00 2.75 TA = +85°C VIN = VCC 2.50 2.25 4.00 4.25 4.75 5.25 5.00 5.50 5.75 5.60 VCC, SUPPLY VOLTAGE (V) 4.50 VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 4.25 −6 mA −12 mA 4.00 3.75 IOH = −0.1 mA 3.50 3.25 −24 mA 3.00 2.75 TA = +25°C VIN = VCC 2.50 2.25 4.00 4.25 4.75 5.25 5.00 5.50 5.75 5.60 VCC, SUPPLY VOLTAGE (V) 4.50 VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 4.25 −6 mA 4.00 −12 mA 3.75 IOH = −0.1 mA 3.50 3.25 −24 mA 3.00 2.75 TA = −40°C VIN = VCC 2.50 2.25 4.00 4.25 4.75 5.25 5.00 5.50 5.75 5.60 VCC, SUPPLY VOLTAGE (V) Figure 4. Output Voltage High vs Supply Voltage http://onsemi.com 5 7WB3306 AC LOADING AND WAVEFORMS Parameter Measurement Information From Output Under Test 500 W S1 7V Test S1 tPD Open tPLZ/tPZL 7V tPHZ/tPZH Open Open GND CL = 50 pF* 500 W *CL includes probes and jig capacitance. 3V 1.5 V 1.5 V Output Control Input tPHL VOH 1.5 V Output 1.5 V 1.5 V Output Waveform 2 S1 at Open (Note 4) VOL Voltage Waveforms Propagation Delay Times 1.5 V 3V 0V tPLZ tPZL Output Waveform 1 S1 at 7 V (Note 4) tPZH 0V tPLH 1.5 V 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ VOH VOH − 0.3 V 0V Voltage Waveforms Enable and Disable Times 4. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control 5. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, ZO = 50 W, tr v 2.5 ns, tf v 2.5 ns. 6. The outputs are measured one at a time, with one transition per measurement. 7. tPLZ and tPHZ are the same as tDIS. 8. tPZL and tPZH are the same as tEN. 9. tPHL and tPLH are the same as tPD. Figure 5. tPD, tEN, tDIS Loading and Waveforms ORDERING INFORMATION Package Shipping† UDFN8 (Pb−Free) 3000 / Tape & Reel 7WB3306AMX1TCG ULLGA8 – 0.5 mm Pitch (Pb−Free) 3000 / Tape & Reel 7WB3306BMX1TCG ULLGA8 – 0.4 mm Pitch (Pb−Free) 3000 / Tape & Reel 7WB3306CMX1TCG ULLGA8 – 0.35 mm Pitch (Pb−Free) 3000 / Tape & Reel 7WB3306DMR2G Micro8 (Pb−Free) 4000 / Tape & Reel (In Developmant) 7WB3306DTR2G TSSOP8 (Pb−Free) 5000 / Tape & Reel Device 7WB3306MUTAG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 6 7WB3306 PACKAGE DIMENSIONS UDFN8 1.8 x 1.2, 0.4P CASE 517AJ−01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B D 0.10 C PIN ONE REFERENCE ÉÉ ÉÉ 0.10 C L1 E DETAIL A NOTE 5 TOP VIEW (A3) 0.05 C DIM A A1 A3 b b2 D E e L L1 L2 A 0.05 C SIDE VIEW e/2 A1 e (b2) 1 C SEATING PLANE DETAIL A 8X L 4 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF MOUNTING FOOTPRINT* SOLDERMASK DEFINED (L2) 8 5 BOTTOM VIEW 8X 8X b 0.10 M C A B 0.05 M C 0.66 7X 0.22 NOTE 3 1.50 1 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 7WB3306 PACKAGE DIMENSIONS ULLGA8 1.45x1.0, 0.35P CASE 613AA−01 ISSUE A ÉÉÉ ÉÉÉ ÉÉÉ PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 8X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 7X 0.48 8X 0.22 e/2 e 1 7X L NOTE 4 4 1.18 L1 0.53 8 5 8X b 0.05 C PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 8 7WB3306 PACKAGE DIMENSIONS ULLGA8 1.6x1.0, 0.4P CASE 613AB−01 ISSUE A PIN ONE REFERENCE 0.10 C 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 8X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 7X 0.49 e/2 e 1 4 8 5 7X L NOTE 4 1.24 L1 0.53 8X b 0.05 C 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 8X 0.26 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 9 7WB3306 PACKAGE DIMENSIONS ULLGA8 1.95x1.0, 0.5P CASE 613AC−01 ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 A 8X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 7X C A1 0.49 8X 0.30 e/2 e 7X L NOTE 4 4 1 1.24 L1 0.53 8 5 BOTTOM VIEW 8X b 0.10 C A B 0.05 C 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 10 7WB3306 PACKAGE DIMENSIONS Micro8t CASE 846A−02 ISSUE H D HE PIN 1 ID NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. E e b 8 PL 0.08 (0.003) M T B S A S SEATING −T− PLANE 0.038 (0.0015) A A1 MILLIMETERS NOM MAX −− 1.10 0.08 0.15 0.33 0.40 0.18 0.23 3.00 3.10 3.00 3.10 0.65 BSC 0.40 0.55 0.70 4.75 4.90 5.05 DIM A A1 b c D E e L HE MIN −− 0.05 0.25 0.13 2.90 2.90 L c SOLDERING FOOTPRINT* 8X 1.04 0.041 0.38 0.015 3.20 0.126 6X 8X 4.24 0.167 0.65 0.0256 5.28 0.208 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 INCHES NOM −− 0.003 0.013 0.007 0.118 0.118 0.026 BSC 0.016 0.021 0.187 0.193 MIN −− 0.002 0.010 0.005 0.114 0.114 MAX 0.043 0.006 0.016 0.009 0.122 0.122 0.028 0.199 7WB3306 PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O b SYMBOL MIN NOM A E1 E MAX 1.20 A1 0.05 A2 0.80 b 0.19 0.15 0.90 1.05 0.30 c 0.09 D 2.90 3.00 3.10 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 0.20 e 0.65 BSC L 1.00 REF L1 0.50 θ 0º 0.60 0.75 8º e TOP VIEW D A2 c q1 A A1 L1 SIDE VIEW L END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. Micro8 is a trademark of International Rectifier. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 12 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative 7WB3306/D