I2C® CMOS 8 × 10 Unbuffered Analog Switch Array with Dual/Single Supplies ADG2108 FEATURES GENERAL DESCRIPTION I2C-compatible interface 3.4 MHz high speed I2C option 32-lead LFCSP_VQ (5 mm × 5 mm) Double-buffered input logic Simultaneous update of multiple switches Up to 300 MHz bandwidth Fully specified at dual ±5 V/single +12 V operation On resistance 35 Ω maximum Low quiescent current < 20 μA The ADG2108 is an analog cross point switch with an array size of 8 × 10. The switch array is arranged so that there are eight columns by 10 rows, for a total of 80 switch channels. The array is bidirectional, and the rows and columns can be configured as either inputs or outputs. Each of the 80 switches can be addressed and configured through the I2Ccompatible interface. Standard, full speed, and high speed (3.4 MHz) I2C interfaces are supported. Any simultaneous switch combination is allowed. An additional feature of the ADG2108 is that switches can be updated simultaneously, using the LDSW command. In addition, a RESET option allows all of the switch channels to be reset/off. At power on, all switches are in the off condition. The device is packaged in a 32-lead, 5 mm × 5 mm LFCSP_VQ. APPLICATIONS AV switching in TV Automotive infotainment AV receivers CCTV Ultrasound applications KVM switching Telecom applications Test equipment/instrumentation PBX systems FUNCTIONAL BLOCK DIAGRAM VDD VSS VL ADG2108 SDA INPUT REGISTER AND 7 TO 80 DECODER 1 LATCHES 80 LDSW A2 A1 A0 1 8 × 10 SWITCH ARRAY X0 TO X9 (I/O) 80 LDSW GND Y0 TO Y7 (I/O) 05898-001 SCL Figure 1. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved. ADG2108 TABLE OF CONTENTS Features .............................................................................................. 1 Load Switch (LDSW)................................................................. 18 Applications....................................................................................... 1 Readback ..................................................................................... 18 General Description ......................................................................... 1 Serial Interface ................................................................................ 19 Functional Block Diagram .............................................................. 1 High Speed I2C Interface........................................................... 19 Revision History ............................................................................... 2 Serial Bus Address...................................................................... 19 Specifications..................................................................................... 3 Writing to the ADG2108 ............................................................... 20 I2C Timing Specifications............................................................ 7 Input Shift Register .................................................................... 20 Timing Diagram ........................................................................... 8 Write Operation.......................................................................... 22 Absolute Maximum Ratings............................................................ 9 Read Operation........................................................................... 22 ESD Caution.................................................................................. 9 Evaluation Board ............................................................................ 24 Pin Configuration and Function Descriptions........................... 10 Using the ADG2108 Evaluation Board ................................... 24 Typical Performance Characteristics ........................................... 11 Power Supply............................................................................... 24 Test Circuits..................................................................................... 15 Schematics................................................................................... 25 Terminology .................................................................................... 17 Outline Dimensions ....................................................................... 27 Theory of Operation ...................................................................... 18 Ordering Guide .......................................................................... 27 RESET/Power-On Reset ............................................................ 18 REVISION HISTORY 4/06—Revision 0: Initial Version Rev. 0 | Page 2 of 28 ADG2108 SPECIFICATIONS VDD = 12 V ± 10%, VSS = 0 V, VL = 5 V, GND = 0 V, all specifications TMIN to TMAX, unless otherwise noted. 1 Table 1. Parameter ANALOG SWITCH Analog Signal Range On Resistance, RON On Resistance Matching Between Channels, ∆RON On Resistance Flatness, RFLAT(ON) LEAKAGE CURRENTS Channel Off Leakage, IOFF Channel On Leakage, ION DYNAMIC CHARACTERISTICS 2 COFF CON tON tOFF THD + N B Version −40°C to +25°C +85°C VDD − 2 V 30 35 32 37 45 50 4.5 8 2.3 3.5 14.5 18 40 42 57 9 4 20 Off Isolation Channel-to-Channel Crosstalk Adjacent Channels Nonadjacent Channels Differential Gain Differential Phase Charge Injection LOGIC INPUTS (Ax, RESET)2 Input High Voltage, VINH Input Low Voltage, VINL Input Leakage Current, IIN VDD − 2 V 30 35 32 37 45 50 4.5 8 2.3 3.5 14.5 18 47 62 10 5 22 V max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max ±0.03 ±0.03 μA typ μA typ 11 18.5 170 185 210 250 0.04 11 18.5 170 185 210 250 0.04 pF typ pF typ ns typ ns max ns typ ns max % typ 190 255 195 260 90 dB typ 210 16.5 −69 210 16.5 −69 MHz typ MHz typ dB typ −63 −76 0.4 0.6 −3.5 −63 −76 0.4 0.6 −3.5 dB typ dB typ % typ ° typ pC typ 2.0 0.8 0.005 2.0 0.8 0.005 ±1 Input Capacitance, CIN 42 Unit ±0.03 ±0.03 PSRR −3 dB Bandwidth Y Version −40°C to +25°C +125°C 7 ±1 7 Rev. 0 | Page 3 of 28 V min V max μA typ μA max pF typ Conditions VDD = 10.8 V, VIN = 0 V, IS = −10 mA VDD = 10.8 V, VIN = 1.4 V, IS = −10 mA VDD = 10.8 V, VIN = 5.4 V, IS = −10 mA VDD = 10.8 V, VIN = 0 V, IS = −10 mA VDD = 10.8 V, VIN = 0 V to 1.4 V, IS = −10 mA VDD = 10.8 V, VIN = 0 V to 5.4 V, IS = −10 mA VDD = 13.2 V VX = 7 V/1 V, VY = 1 V/7 V VX = VY = 1 V or 7 V RL = 300 Ω, CL = 35 pF RL = 300 Ω, CL = 35 pF RL = 10 kΩ, f = 20 Hz to 20 kHz, VS = 1 V p-p f = 20 kHz; without decoupling; see Figure 24 Individual inputs to outputs 8 inputs to 1 output RL = 75 Ω, CL = 5 pF, f = 5 MHz RL = 75 Ω, CL = 5 pF, f = 5 MHz RL = 75 Ω, CL = 5 pF, f = 5 MHz RL = 75 Ω, CL = 5 pF, f = 5 MHz VS = 4 V, RS = 0 Ω, CL = 1 nF ADG2108 Parameter LOGIC INPUTS (SCL, SDA)2 Input High Voltage, VINH B Version −40°C to +85°C +25°C 0.7 VL VL + 0.3 −0.3 0.3 VL Input Low Voltage, VINL Input Leakage Current, IIN Input Hysteresis Input Capacitance, CIN LOGIC OUTPUT (SDA)2 Output Low Voltage, VOL Floating State Leakage Current POWER REQUIREMENTS IDD Y Version −40°C to +125°C +25°C 0.005 0.7 VL VL + 0.3 −0.3 0.3 VL 0.005 ±1 0.05 VL 7 ±1 0.05 VL 7 0.4 0.6 ±1 0.05 0.4 0.6 ±1 0.05 1 ISS 0.05 1 0.05 1 1 Unit V min V max V min V max μA typ μA max V min pF typ ISINK = 3 mA ISINK = 6 mA μA typ μA max μA typ μA max Digital inputs = 0 V or VL Digital inputs = 0 V or VL Digital inputs = 0 V or VL Interface Inactive 0.3 Interface Active: 400 kHz fSCL 0.1 Interface Active: 3.4 MHz fSCL 0.4 0.3 2 2 0.1 0.2 0.2 0.4 1.2 2 VIN = 0 V to VL V max V max μA max IL 1 Conditions 1.7 Temperature range is as follows: B version: −40°C to +85°C; Y version: −40°C to +125°C. Guaranteed by design, not subject to production test. Rev. 0 | Page 4 of 28 μA typ μA max mA typ mA max mA typ mA max -HS model only ADG2108 VDD = +5 V ± 10%, VSS = −5 V ± 10%, VL = 5 V, GND = 0 V, all specifications TMIN to TMAX, unless otherwise noted. 1 Table 2. Parameter ANALOG SWITCH Analog Signal Range On Resistance, RON On Resistance Matching Between Channels, ∆RON On Resistance Flatness, RFLAT(ON) LEAKAGE CURRENTS Channel Off Leakage, IOFF Channel On Leakage, ION DYNAMIC CHARACTERISTICS 2 COFF CON tON tOFF THD + N PSRR −3 dB Bandwidth Off Isolation Channel-to-Channel Crosstalk Adjacent Channels Nonadjacent Channels Differential Gain Differential Phase Charge Injection LOGIC INPUTS (Ax, RESET)2 Input High Voltage, VINH Input Low Voltage, VINL Input Leakage Current, IIN B Version −40°C to +25°C +125°C Y Version −40°C to +25°C +125°C 34 40 50 55 66 75 4.5 8 17 20 34 42 34 40 50 55 66 75 4.5 8 17 20 34 42 VDD − 2 V 45 65 85 9 23 45 Input Low Voltage, VINL 70 95 10 25 48 V max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max Ω typ Ω max ±0.03 ±0.03 ±0.03 ±0.03 μA typ μA typ 6 9.5 170 200 210 250 0.04 300 18 −66 6 9.5 170 200 210 250 0.04 90 300 18 −64 pF typ pF typ ns typ ns max ns typ ns max % typ dB typ MHz typ MHz typ dB typ −62 −79 1.5 1.8 −3 −62 −79 1.5 1.8 −3 215 255 220 260 dB typ dB typ % typ ° typ pC typ 2.0 0.8 0.005 2.0 0.8 0.005 ±1 Input Capacitance, CIN LOGIC INPUTS (SCL, SDA)2 Input High Voltage, VINH 50 Unit 7 ±1 7 0.7 VL VL + 0.3 −0.3 0.3 VL 0.7 VL VL + 0.3 −0.3 0.3 VL Rev. 0 | Page 5 of 28 V min V max μA typ μA max pF typ V min V max V min V max Conditions VDD = +4.5 V, VSS = −4.5 V, VIN = VSS, IS = −10 mA VDD = +4.5 V, VSS = −4.5 V, VIN = 0 V, IS = −10 mA VDD = +4.5 V, VSS = −4.5 V, VIN = 1.4 V, IS = −10 mA VDD = +4.5 V, VSS = −4.5 V, VIN = VSS, IS = −10 mA VDD = +4.5 V, VSS = −4.5 V, VIN = VSS to 0 V, IS = −10 mA VDD = +4.5 V, VSS = −4.5 V, VIN = VSS to 1.4 V, IS = −10 mA VDD = 5.5 V, VSS = 5.5 V VX = +4.5 V/−2 V, VY = −2 V/+4.5 V VX = VY = −2 V or +4.5 V RL = 300 Ω, CL = 35 pF RL = 300 Ω, CL = 35 pF RL = 10 kΩ, f = 20 Hz to 20 kHz, VS = 1 V p-p f = 20 kHz; without decoupling; see Figure 24 Individual inputs to outputs 8 inputs to 1 output RL = 75 Ω, CL = 5 pF, f = 5 MHz RL = 75 Ω, CL = 5 pF, f = 5 MHz RL = 75 Ω, CL = 5 pF, f = 5 MHz RL = 75 Ω, CL = 5 pF, f = 5 MHz VS = 0 V, RS = 0 Ω, CL = 1 nF ADG2108 Parameter Input Leakage Current, IIN Input Hysteresis Input Capacitance, CIN LOGIC OUTPUT (SDA)2 Output Low Voltage, VOL Floating State Leakage Current POWER REQUIREMENTS IDD B Version −40°C to +25°C +125°C 0.005 ±1 0.05 VL 7 Y Version −40°C to +25°C +125°C 0.005 ±1 0.05 VL 7 0.4 0.6 ±1 0.05 0.4 0.6 ±1 0.005 1 ISS 0.05 1 0.005 1 1 Unit μA typ μA max V min pF typ Conditions VIN = 0 V to VL V max V max μA max ISINK = 3 mA ISINK = 6 mA μA typ μA max μA typ μA max Digital inputs = 0 V or VL IL Digital inputs = 0 V or VL Interface Inactive 0.3 Interface Active: 400 kHz fSCL 0.1 Interface Active: 3.4 MHz fSCL 0.4 0.3 2 2 0.1 0.1 2 0.1 0.4 0.3 1 Digital inputs = 0 V or VL 0.3 Temperature range is as follows: B version: –40°C to +85°C; Y version: –40°C to +125°C. Guaranteed by design, not subject to production test. Rev. 0 | Page 6 of 28 μA typ μA max mA typ mA max mA typ mA max -HS model only ADG2108 I2C TIMING SPECIFICATIONS VDD = 5 V to 12 V; VSS = −5 V to 0 V; VL = 5 V; GND = 0 V; TA = TMIN to TMAX, unless otherwise noted (see Figure 2). Table 3. Parameter 1 fSCL t1 t2 t3 t4 3 t5 t6 t7 t8 t9 t10 Conditions Standard mode Fast mode High speed mode 2 CB = 100 pF maximum CB = 400 pF maximum Standard mode Fast mode High speed mode2 CB = 100 pF maximum CB = 400 pF maximum Standard mode Fast mode High speed mode2 CB = 100 pF maximum CB = 400 pF maximum Standard mode Fast mode High speed mode2 Standard mode Fast mode High speed mode2 CB = 100 pF maximum CB = 400 pF maximum Standard mode Fast mode High speed mode2 Standard mode Fast mode High speed mode2 Standard mode Fast mode Standard mode Fast mode High speed mode2 Standard mode Fast mode High speed mode2 CB = 100 pF maximum CB = 400 pF maximum Standard mode Fast mode High speed mode2 CB = 100 pF maximum CB = 400 pF maximum ADG2108 Limit at TMIN, TMAX Min Max 100 400 3.4 1.7 Unit kHz kHz 4 0.6 MHz MHz μs μs 60 120 4.7 1.3 ns ns μs μs 160 320 250 100 10 0 0 ns ns ns ns ns μs μs 0 0 4.7 0.6 160 4 0.6 160 4.7 1.3 4 0.6 160 3.45 0.9 1000 300 ns ns μs μs ns μs μs ns μs μs μs μs ns ns ns 20 + 0.1 CB 80 160 300 300 ns ns ns ns 10 20 80 160 ns ns 20 + 0.1 CB 10 20 70 150 Rev. 0 | Page 7 of 28 Description Serial clock frequency tHIGH, SCL high time tLOW, SCL low time tSU;DAT, data setup time tHD;DAT, data hold time tSU;STA, setup time for a repeated start condition tHD;STA, hold time for a repeated start condition tBUF, bus free time between a stop and a start condition tSU;STO, setup time for a stop condition tRDA, rise time of SDA signal tFDA, fall time of SDA signal ADG2108 Parameter 1 t11 t11A t12 tSP ADG2108 Limit at TMIN, TMAX Min Max 1000 20 + 0.1 CB 300 Conditions Standard mode Fast mode High speed mode2 CB = 100 pF maximum CB = 400 pF maximum Standard mode Fast mode High speed mode2 CB = 100 pF maximum CB = 400 pF maximum Standard mode Fast mode High speed mode2 CB = 100 pF maximum CB = 400 pF maximum Fast mode High speed mode2 10 20 Unit ns ns 40 80 1000 300 ns ns ns ns 20 + 0.1 CB 80 160 300 300 ns ns ns ns 10 20 0 0 40 80 50 10 ns ns ns ns 20 + 0.1 CB 10 20 Description tRCL, rise time of SCL signal tRCL1, rise time of SCL signal after a repeated start condition and after an acknowledge bit tFCL, fall time of SCL signal Pulse width of suppressed spike 1 Guaranteed by initial characterization. All values measured with input filtering enabled. CB refers to capacitive load on the bus line; tR and tF are measured between 0.3 VDD and 0.7 VDD. High speed I2C is available only in -HS models. 3 A device must provide a data hold time for SDA to bridge the undefined region of the SCL falling edge. 2 TIMING DIAGRAM t2 t11 t12 t6 SCL t6 t4 t5 t3 t8 t1 t9 t10 SDA t7 S S P 05898-002 P S = START CONDITION P = STOP CONDITION Figure 2. Timing Diagram for 2-Wire Serial Interface Rev. 0 | Page 8 of 28 ADG2108 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 4. Parameter VDD to VSS VDD to GND VSS to GND VL to GND Analog Inputs Digital Inputs Continuous Current 10 V on Input; Single Input Connected to Single Output 1 V on Input; Single Input Connected to Single Output 10 V on Input; Eight Inputs Connected to Eight Outputs Operating Temperature Range Industrial (B Version) Automotive (Y Version) Storage Temperature Range Junction Temperature 32-Lead LFCSP_VQ θJA Thermal Impedance Reflow Soldering (Pb Free) Peak Temperature Time at Peak Temperature Rating 15 V −0.3 V to +15 V +0.3 V to −7 V −0.3 V to +7 V VSS − 0.3 V to VDD + 0.3 V −0.3 V to VL + 0.3 V or 30 mA, whichever occurs first Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 65 mA 90 mA 25 mA –40°C to +85°C –40°C to +125°C –65°C to +150°C 150°C 108.2°C/W 260°C (+0/–5) 10 sec to 40 sec ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. 0 | Page 9 of 28 ADG2108 27 26 25 24 VDD 23 NC 22 X9 21 X8 20 X7 19 X6 7 18 X5 8 17 X4 X1 6 X2 X3 10 × 8 TOP VIEW (Not to Scale) 9 10 11 12 13 14 15 16 Y7 5 Y6 X0 ADG2108 Y5 4 Y4 NC Y3 3 Y2 NC PIN 1 INDICATOR Y1 2 Y0 NC NC = NO CONNECT 05898-003 VL 28 SCL 29 SDA 30 A1 31 A0 RESET 32 VSS 1 A2 GND PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Exposed Paddle Soldered to VSS Figure 3. Pin Configuration Table 5. Pin Function Descriptions 1 Pin No. 1 Mnemonic VSS 2 to 4, 23 5 to 8, 17 to 22 9 to 16 24 25 26 27 NC X0 to X9 Y0 to Y7 VDD VL SDA SCL 28 29 30 31 32 A0 A1 A2 RESET GND 1 Description Negative Power Supply in a Dual-Supply Application. For single-supply applications, this pin should be tied to GND. No Connect. Can be inputs or outputs. Can be inputs or outputs. Positive Power Supply Input. Logic Power Supply Input. Digital I/O. Bidirectional open drain data line. External pull-up resistor required. Digital Input, Serial Clock Line. Open drain input that is used in conjunction with SDA to clock data into the device. External pull-up resistor required. Logic Input. Address pin that sets the least significant bit of the 7-bit slave address. Logic Input. Address pin that sets the second least significant bit of the 7-bit slave address. Logic Input. Address pin that sets the third least significant bit of the 7-bit slave address. Active Low Logic Input. When this pin is low, all switches are open, and appropriate registers are cleared to 0. Ground. Reference point for all circuitry on the ADG2108. It is recommended that the exposed paddle be soldered to VSS to improve heat dissipation and crosstalk. Rev. 0 | Page 10 of 28 ADG2108 TYPICAL PERFORMANCE CHARACTERISTICS 90 200 TA = 25°C IDS = 10mA TA = 25°C 180 IDS = 10mA 80 160 VDD = 7.2V VSS = –5V VDD = +5V 120 RON (Ω) RON (Ω) 70 VSS = 0V VDD = +8V 140 100 80 VDD = 8V 60 50 60 VDD = 8.8V VSS = 0V VDD = +12V 40 40 30 1 2 3 4 5 6 7 8 9 10 11 12 SOURCE VOLTAGE (V) 05898-007 0 –5 –4 –3 –2 –1 0 0 0.5 2.0 2.5 3.0 3.5 4.0 5.0 4.5 Figure 7. RON vs. Source Voltage, VDD = 8 V ± 10% 85 80 TA = 25°C IDS = 10mA VDD = +5V VSS = –5V IDS = 10mA 70 VDD/VSS = ±4.5V TA = +125°C 60 65 TA = +85°C 50 VDD/VSS = ±5V RON (Ω) RON (Ω) 1.5 SOURCE VOLTAGE (V) Figure 4. Signal Range 75 1.0 05898-025 20 55 40 TA = +25°C 30 45 35 TA = –40°C 20 VDD/VSS = ±5.5V –4.5 –3.5 –2.5 –1.5 –0.5 0.5 0 –5 05898-017 25 –5.5 1.5 SOURCE VOLTAGE (V) 60 VDD = 10.8V 60 0 1 TA = +125°C TA = +85°C 40 VDD = 12V RON (Ω) 45 TA = +25°C 30 TA = –40°C 40 20 35 VDD = 13.2V 30 10 20 0 1 2 3 4 5 6 SOURCE VOLTAGE (V) 7 8 0 0 1 2 3 4 SOURCE VOLTAGE (V) Figure 9. RON vs. Temperature, VDD = 12 V Figure 6. RON vs. Supplies, VDD = 12 V ± 10% Rev. 0 | Page 11 of 28 5 6 05898-027 25 05898-018 RON (Ω) –1 VDD = 12V VSS = 0V IDS = 10mA 50 55 50 –2 Figure 8. RON vs. Temperature, Dual ±5 V Supplies 70 TA = 25°C IDS = 10mA –3 SOURCE VOLTAGE (V) Figure 5. RON vs. Source Voltage, Dual ±5 V Supplies 65 –4 05898-026 10 ADG2108 80 18 VDD = 8V VSS = 0V IDS = 10mA TA = +125°C 60 TA = +85°C 50 RON (Ω) Y CHANNELS, VBIAS = 7V 14 LEAKAGE CURRENTS (nA) 70 VDD = 12V VSS = 0V 16 40 TA = +25°C 30 TA = –40°C 20 X CHANNELS, VBIAS = 7V 12 10 8 Y CHANNELS, VBIAS = 1V 6 4 2 10 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 SOURCE VOLTAGE (V) –2 40 60 9 LEAKAGE CURRENTS (nA) LEAKAGE CURRENTS (nA) X CHANNELS, VBIAS = +4V 6 Y CHANNELS, VBIAS = –2V 4 120 X, Y CHANNELS; VBIAS = 7V ON X CHANNEL; 1V ON Y CHANNEL 7 12 8 100 VDD = 12V VSS = 0V 8 10 80 Figure 13. On Leakage vs. Temperature, 12 V Single Supply VDD = +5V VSS = –5V 14 20 TEMPERATURE (°C) Figure 10. RON vs. Temperature, VDD = 8 V 16 0 05898-011 0 05898-013 0 0 6 5 4 3 X, Y CHANNELS; VBIAS = 1V ON X CHANNEL; 7V ON Y CHANNEL 2 1 2 0 20 40 60 80 100 120 TEMPERATURE (°C) 20 40 60 80 100 120 TEMPERATURE (°C) Figure 11. On Leakage vs. Temperature, Dual ±5 V Supplies 12 0 05898-012 0 –1 05898-014 0 Figure 14. Off Leakage vs. Temperature, 12 V Single Supply 0 VDD = +5V VSS = –5V –0.5 10 CHARGE INJECTION (pC) X, Y CHANNELS; VBIAS = +4V ON X CHANNEL; –2V ON Y CHANNEL 6 4 X, Y CHANNELS; VBIAS = –2V ON X CHANNEL; +4V ON Y CHANNEL 2 –1.5 –2.0 –2.5 –3.0 –3.5 VDD = +5V, VSS = –5V –4.0 0 VDD = +12V, VSS = 0V –4.5 0 20 40 60 80 100 120 TEMPERATURE (°C) Figure 12. Off Leakage vs. Temperature, Dual ±5 V Supplies –5.0 –5 –3 –1 1 3 5 7 9 SUPPLY VOLTAGE (V) Figure 15. Charge Injection vs. Supply Voltage Rev. 0 | Page 12 of 28 11 05898-030 –2 05898-015 LEAKAGE CURRENTS (nA) –1.0 8 ADG2108 0 240 –1 220 tOFF INSERTION LOSS (dB) VDD = +5V, VSS = –5V 180 tON 160 VDD = 12V, VSS = 0V 140 –2 –3 –4 –5 –6 –7 –20 0 20 40 60 80 100 120 TEMPERATURE (°C) –8 10 05898-029 100 –40 –10 –20 INSERTION LOSS (dB) –4 –5 –6 10G VDD = +5V TO +12V VSS = –5V TO 0V TA = 25°C –40 –50 –60 –70 –80 1k 100k 10M 1G 10G –110 10 1k 100k 10M 1G 05898-023 –100 1G FREQUENCY (Hz) Figure 17. Individual Inputs to Individual Outputs Bandwidth, Dual ±5 V Supply Figure 20. Off Isolation vs. Frequency –1 –20 –2 INSERTION LOSS (dB) –3 –4 –5 –6 VDD = +5V TO +12V VSS = –5V TO 0V TA = 25°C –40 ADJACENT CHANNELS –60 –80 NON-ADJACENT CHANNELS –100 VDD = 12V VSS = 0V TA = 25°C 1k 100k 10M 1G 10G FREQUENCY (Hz) 05898-021 INSERTION LOSS (dB) 1G –90 VDD = +5V VSS = –5V TA = 25°C FREQUENCY (Hz) –8 10 10M –30 05898-020 INSERTION LOSS (dB) –3 –7 100k Figure 19. One Input to Eight Outputs Bandwidth, ±5 V Dual Supply –2 –8 10 1k FREQUENCY (Hz) Figure 16. tON/tOFF Times vs. Temperature –7 VDD = +5V VSS = –5V TA = 25°C 05898-022 120 05898-024 tON/tOFF (ns) 200 Figure 18. Individual Inputs to Individual Outputs Bandwidth, 12 V Single Supply –120 10 1k 100k 10M FREQUENCY (Hz) Figure 21. Crosstalk vs. Frequency Rev. 0 | Page 13 of 28 ADG2108 0.35 0 VDD = +5V VSS = –5V 0.30 VDD = 5V/12V VSS = –5V/0V TA = 25°C 0.2V p-p RIPPLE –20 VL = 5V SWITCH ON, WITHOUT DECOUPLING 0.25 ACPSRR (dB) 0.15 –60 –80 0.10 –100 0.5 1.0 1.5 2.0 2.5 05898-016 0 3.0 FREQUENCY (MHz) –120 100 1.8 1.6 1.4 VL = 5V IL (mA) 1.2 1.0 0.8 0.6 0.4 0 1 2 3 VLOGIC (V) 4 5 6 05898-019 VL = 3V 0.2 1k 10k 100k 1M 10M FREQUENCY (Hz) Figure 24. ACPSRR Figure 22. Digital Current (IL) vs. Frequency 0 WITH DECOUPLING VL = 3V 0.05 0 SWITCH OFF, WITHOUT DECOUPLING Figure 23. Digital Current (IL) vs. VLOGIC for Varying Digital Supply Voltage Rev. 0 | Page 14 of 28 100M 1G 05898-028 IL (mA) –40 0.20 ADG2108 TEST CIRCUITS The test circuits show measurements on one channel for clarity, but the circuit applies to any of the switches in the matrix. IDS V1 RON = V1/IDS X Y IOFF A VX VY Figure 25. On Resistance X NC VDD VSS VDD VSS X A VY Figure 27. On Leakage Figure 26. Off Leakage 0.1µF ION Y 0.1µF 50% 9TH DATA BIT VOUT Y RL 300Ω VX CL 35pF 90% VOUT tOFF AND tON 05898-034 GND Figure 28. Switching Times, tON, tOFF VDD VSS VDD VSS RX X 0.1 µF SW OFF SW ON Y VOUT DATA BIT CL 1nF VX VOUT GND ΔVOUT QINJ = CL × ΔVOUT 05898-035 0.1 µF Figure 29. Charge Injection VDD VSS NETWORK ANALYZER VSS VDD X VSS 0.1µF 0.1µF 50Ω 0.1µF VDD NETWORK ANALYZER VSS X 50Ω 50Ω VX VX Y Y RL 50Ω GND OFF ISOLATION = 20 log VOUT VS VOUT V RL 50Ω GND 05898-036 V INSERTION LOSS = 20 log Figure 30. Off Isolation VOUT WITH SWITCH VOUT WITHOUT SWITCH Figure 31. Bandwidth Rev. 0 | Page 15 of 28 VOUT 05898-037 VDD 0.1µF 05898-033 A 05898-032 VS IOFF Y 05898-031 X ADG2108 VDD VSS 0.1µF NETWORK ANALYZER 0.1µF VDD VOUT RL 50Ω VSS Y1 X1 X2 Y2 R 50Ω 50Ω DATA BIT CHANNEL-TO-CHANNEL CROSSTALK = 20 log GND VOUT VS 05898-038 VX R 50Ω Figure 32. Channel-to-Channel Crosstalk Rev. 0 | Page 16 of 28 ADG2108 TERMINOLOGY On Resistance (RON) The series on-channel resistance measured between the X input/output and the Y input/output. Total Harmonic Distortion + Noise (THD + N) The ratio of the harmonic amplitudes plus noise of a signal to the fundamental. On Resistance Match (ΔRON) The channel-to-channel matching of on resistance when channels are operated under identical conditions. −3 dB Bandwidth The frequency at which the output is attenuated by 3 dB. On Resistance Flatness (RFLAT(ON)) The variation of on resistance over the specified range produced by the specified analog input voltage change with a constant load current. Channel Off Leakage (IOFF) The sum of leakage currents into or out of an off channel input. Channel On Leakage (ION) The current loss/gain through an on-channel resistance, creating a voltage offset across the device. Input Leakage Current (IIN) The current flowing into a digital input when a specified low level or high level voltage is applied to that input. Input Off Capacitance (COFF) The capacitance between an analog input and ground when the switch channel is off. Input/Output On Capacitance (CON) The capacitance between the inputs or outputs and ground when the switch channel is on. Off Isolation The measure of unwanted signal coupling through an off switch. Crosstalk The measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. Differential Gain The measure of how much color saturation shift occurs when the luminance level changes. Both attenuation and amplification can occur; therefore, the largest amplitude change between any two levels is specified and is expressed as a percentage of the largest chrominance amplitude. Differential Phase The measure of how much hue shift occurs when the luminance level changes. It can be a negative or positive value and is expressed in degrees of subcarrier phase. Charge Injection The measure of the glitch impulse transferred from the digital input to the analog output during on/off switching. Input High Voltage (VINH) The minimum input voltage for Logic 1. Digital Input Capacitance (CIN) The capacitance between a digital input and ground. Output On Switching Time (tON) The time required for the switch channel to close. The time is measured from 50% of the logic input change to the time the output reaches 10% of the final value. Output Off Switching Time (tOFF) The time required for the switch to open. This time is measured from 50% of the logic input change to the time the output reaches 90% of the switch off condition. Input Low Voltage (VINL) The maximum input voltage for Logic 0. Output Low Voltage (VOL) The minimum input voltage for Logic 1. Input Low Voltage (VINL) The maximum output voltage for Logic 0. IDD Positive supply current. ISS Negative supply current. Rev. 0 | Page 17 of 28 ADG2108 LOAD SWITCH (LDSW) THEORY OF OPERATION The ADG2108 is an analog cross point switch with an array size of 8 × 10. The 10 rows are referred to as the X input/output lines, and the eight columns are referred to as the Y input/output lines. The device is fully flexible in that it connects any X line or number of X lines with any Y line when turned on. Similarly, it connects any X line with any number of Y lines when turned on. Control of the ADG2108 is carried out via an I2C interface. The device can be operated from single supplies of up to 13.2 V or from dual ±5 V supplies. The ADG2108 has many attractive features, such as the ability to reset all the switches, the ability to update many switches at the same time, and the option of reading back the status of any switch. All of these features are described in more detail here in the Theory of Operation section. RESET/POWER-ON RESET The ADG2108 offers the ability to reset all of the 80 switches to the off state. This is done through the RESET pin. When the RESET pin is low, all switches are open (off), and appropriate registers are cleared. Note that the ADG2108 also has a poweron reset block. This ensures that all switches are in the off condition at power-up of the device. In addition, all internal registers are filled with 0s and remain so until a valid write to the ADG2108 takes place. LDSW is an active high command that allows a number of switches to be simultaneously updated. This is useful in applications where it is important to have synchronous transmission of signals. There are two LDSW modes: the transparent mode and the latched mode. Transparent Mode In this mode, the switch position changes after the new word is written into the input shift register. LDSW is set to 1. Latched Mode In this mode, the switch positions are not updated at the same time that the input registers are written to. This is achieved by setting LDSW to 0 for each word (apart from the last word) written to the device. Then, setting LDSW to 1 for the last word allows all of the switches in that sequence to be simultaneously updated. READBACK Readback of the switch array conditions is also offered when in standard mode and fast mode. Readback enables the user to check the status of the switches of the ADG2108. This is very useful when debugging a system. Rev. 0 | Page 18 of 28 ADG2108 SERIAL INTERFACE The ADG2108 is controlled via an I2C-compatible serial bus. The parts are connected to this bus as a slave device (no clock is generated by the switch). 2. The peripheral whose address corresponds to the transmitted address responds by pulling the SDA line low during the ninth clock pulse, known as the acknowledge bit. At this stage, all other devices on the bus remain idle while the selected device waits for data to be written to or read from its serial register. If the R/W bit is 1 (high), the master reads from the slave device. If the R/W bit is 0 (low), the master writes to the slave device. 3. Data is transmitted over the serial bus in sequences of nine clock pulses: eight data bits followed by an acknowledge bit from the receiver of the data. Transitions on the SDA line must occur during the low period of the clock signal, SCL, and remain stable during the high period of SCL because a low-to-high transition when the clock is high can be interpreted as a stop signal. 4. When all data bits have been read or written, a stop condition is established by the master. A stop condition is defined as a low-to-high transition on the SDA line while SCL is high. In write mode, the master pulls the SDA line high during the 10th clock pulse to establish a stop condition. In read mode, the master issues a no acknowledge for the ninth clock pulse (that is, the SDA line remains high). The master then brings the SDA line low before the 10th clock pulse and then high during the 10th clock pulse to establish a stop condition. HIGH SPEED I2C INTERFACE In addition to standard and full speed I2C, the ADG2108 also supports the high speed (3.4 MHz) I2C interface. Only the -HS models provide this added performance. See the Ordering Guide for details. SERIAL BUS ADDRESS The ADG2108 has a 7-bit slave address. The four MSBs are hard coded to 1110, and the three LSBs are determined by the state of Pin A0, Pin A1, and Pin A2. By offering the facility to hardware configure Pin A0, Pin A1, and Pin A2, up to eight of these devices can be connected to a single serial bus. The 2-wire serial bus protocol operates as follows: 1. The master initiates data transfer by establishing a start condition, defined as when a high-to-low transition on the SDA line occurs while SCL is high. This indicates that an address/data stream follows. All slave peripherals connected to the serial bus respond to the start condition and shift in the next eight bits, consisting of a 7-bit address (MSB first) plus an R/W bit that determines the direction of the data transfer, that is, whether data is written to or read from the slave device. Refer to Figure 33 and Figure 34 for a graphical explanation of the serial data transfer protocol. Rev. 0 | Page 19 of 28 ADG2108 WRITING TO THE ADG2108 INPUT SHIFT REGISTER The input shift register is 24 bits wide. A 3-byte write is necessary when writing to this register and is done under the control of the serial clock input, SCL. The contents of the three bytes of the input shift register are shown in Figure 33 and described in Table 6. 1 1 1 0 A2 A1 A0 R/W DB8 (LSB) DB15 (MSB) DATA AX3 AX2 AX1 AX0 AY2 AY1 AY0 DEVICE ADDRESS DB0 (LSB) DB7 (MSB) X DATA BITS X X X X X X LDSW DATA BITS 05898-004 DB16 (LSB) DB23 (MSB) Figure 33. Data-Words Table 6. Input Shift Register Bit Function Descriptions Bit DB23 to DB17 Mnemonic 1110xxx DB16 R/W DB15 Data DB14 to DB11 DB10 to DB8 DB7 to DB1 DB0 AX3 to AX0 AY2 to AY0 X LDSW Descriptions The MSBs of the ADG2108 are set to 1110. The LSBs of the address byte are set by the state of the three address pins, Pin A0, Pin A1, and Pin A2. Controls whether the ADG2108 slave device is read from or written to. If R/W = 1, the ADG2108 is being read from. If R/W = 0, the ADG2108 is being written to. Controls whether the switch is to be opened (off ) or closed (on). If Data = 0, the switch is opened/off. If Data = 1, the switch is closed/on. Controls I/Os X0 to X9. See Table 7 for the decode truth table. Controls I/Os Y0 to Y7. See Table 7 for the decode truth table. Don’t care. This bit is useful when a number of switches need to be updated simultaneously. If LDSW = 1, the switch position changes after the new word is read. If LDSW = 0, the input data is latched, but the switch position is not changed. As shown in Table 6, Bit DB14 to Bit DB11 control the X input/output lines, while Bit DB10 to Bit DB8 control the Y input/output lines. Table 7 shows the truth table for these bits. Note that the full coding sequence is written out for Channel Y0, and Channel Y1 to Channel Y7 follow a similar pattern. Note also that the RESET pin must be high when writing to the device. Table 7. Address Decode Truth Table DB15 DATA X X 1 0 1 0 1 0 1 0 X X 1 0 1 0 1 0 1 0 DB14 AX3 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 DB13 AX2 0 0 0 0 0 0 1 1 1 1 1 1 0 0 0 0 0 0 0 0 DB12 AX1 0 0 1 1 1 1 0 0 0 0 1 1 0 0 0 0 1 1 1 1 DB11 AX0 0 1 0 0 1 1 0 0 1 1 0 1 0 0 1 1 0 0 1 1 DB10 AY2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Rev. 0 | Page 20 of 28 DB9 AY1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 DB8 AY0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Switch Configuration Reserved Reserved X0 to Y0 (on) X0 to Y0 (off ) X1 to Y0 (on) X1 to Y0 (off ) X2 to Y0 (on) X2 to Y0 (off ) X3 to Y0 (on) X3 to Y0 (off ) Reserved Reserved X4 to Y0 (on) X4 to Y0 (off ) X5 to Y0 (on) X5 to Y0 (off ) X6 to Y0 (on) X6 to Y0 (off ) X7 to Y0 (on) X7 to Y0 (off ) ADG2108 DB15 DATA 1 0 1 0 X X X X 1 0 .. 0 X X 1 0 .. 0 X X 1 0 .. 0 X X 1 0 .. 0 X X 1 0 .. 0 X X 1 0 .. 0 X X 1 0 .. 0 DB14 AX3 1 1 1 1 1 1 0 0 0 0 .. 1 0 0 0 0 .. 1 0 0 0 0 .. 1 0 0 0 0 .. 1 0 0 0 0 .. 1 0 0 0 0 .. 1 0 0 0 0 .. 1 DB13 AX2 1 1 1 1 1 1 0 0 0 0 .. 1 0 0 0 0 .. 1 0 0 0 0 .. 1 0 0 0 0 .. 1 0 0 0 0 .. 1 0 0 0 0 .. 1 0 0 0 0 .. 1 DB12 AX1 0 0 0 0 1 1 0 0 1 1 .. 0 0 0 1 1 .. 0 0 0 1 1 .. 0 0 0 1 1 .. 0 0 0 1 1 .. 0 0 0 1 1 .. 0 0 0 1 1 .. 0 DB11 AX0 0 0 1 1 0 1 0 1 0 0 .. 1 0 1 0 0 .. 1 0 1 0 0 .. 1 0 1 0 0 .. 1 0 1 0 0 .. 1 0 1 0 0 .. 1 0 1 0 0 .. 1 DB10 AY2 0 0 0 0 0 0 0 0 0 0 .. 0 0 1 0 0 .. 0 0 0 0 0 .. 0 1 1 1 1 .. 1 1 1 1 1 .. 1 1 1 1 1 .. 1 1 1 1 1 .. 1 Rev. 0 | Page 21 of 28 DB9 AY1 0 0 0 0 0 0 0 0 0 0 .. 0 1 1 1 1 .. 1 1 1 1 1 .. 1 0 0 0 0 .. 0 0 0 0 0 .. 0 1 1 1 1 .. 1 1 1 1 1 .. 1 DB8 AY0 0 0 0 0 0 0 1 1 1 1 .. 1 0 0 0 0 .. 0 1 1 1 1 .. 1 0 0 0 0 .. 0 1 1 1 1 .. 1 0 0 0 0 .. 0 1 1 1 1 .. 1 Switch Configuration X8 to Y0 (on) X8 to Y0 (off ) X9 to Y0 (on) X9 to Y0 (off ) Reserved Reserved Reserved Reserved X0 to Y1 (on) X0 to Y1 (off ) X9 to Y1 (off ) Reserved Reserved X0 to Y2 (on) X0 to Y2 (off ) X9 to Y2 (off ) Reserved Reserved X0 to Y3 (on) X0 to Y3 (off ) X9 to Y3 (off ) Reserved Reserved X0 to Y4 (on) X0 to Y4 (off ) X9 to Y4 (off ) Reserved Reserved X0 to Y5 (on) X0 to Y5 (off ) X9 to Y5 (off ) Reserved Reserved X0 to Y6 (on) X0 to Y6 (off ) X9 to Y6 (off ) Reserved Reserved X0 to Y7 (on) X0 to Y7 (off ) X9 to Y7 (off ) ADG2108 WRITE OPERATION b. When writing to the ADG2108, the user must begin with an address byte and R/W bit, after which the switch acknowledges that it is prepared to receive data by pulling SDA low. This address byte is followed by the two 8-bit words. The write operations for the switch array are shown in Figure 34. Note that it is only the condition of the switch corresponding to the bits in the data bytes that changes state. All other switches retain their previous condition. Enter the readback address for the X line of interest, the addresses of which are shown in Table 8. Note that the ADG2108 is expecting a 2-byte write; therefore, be sure to enter another byte of don’t cares (see Figure 35). c. The ADG2108 then places the status of those eight switches in a register than can be read back. 2. READ OPERATION Readback on the ADG2108 is designed to work as a tool for debug and can be used to output the status of any of the 80 switches of the device. The readback function is a two-step sequence that works as follows: 1. The second step involves reading back from the register that holds the status of the eight switches associated with the X line of choice. a. As before, enter the I2C address of the ADG2108. This time, set the R/W to 1 to indicate a readback from the device. b. As with a write to the device, the ADG2108 outputs a 2-byte sequence during readback. Therefore, the first eight bits of data out that are read back are all 0s. The next eight bits of data that come back are the status of the eight Y lines attached to that particular X line. If the bit is a 1, the switch is closed (on); similarly, if the bit is a 0, the switch is open (off). Select the relevant X line to be read back from. Note that there are eight switches connecting that X line to the eight Y lines. The next step involves writing to the ADG2108 to tell the part to reveal the status of those eight switches. a. Enter the I2C address of the ADG2108, and set the R/W to 0 to indicate a write to the device. The entire read sequence is shown in Figure 35. SCL START COND BY MASTER A1 A0 DATA R/W AX3 ACK BY SWITCH ADDRESS BYTE AX2 AX1 AX0 AY2 AY1 AY0 DATA BYTE x x x ACK BY SWITCH x x x DATA BYTE x LDSW ACK BY SWITCH STOP COND BY MASTER Figure 34. Write Operation Table 8. Readback Addresses for Each X Line X Line X0 X1 X2 X3 X4 X5 X6 X7 X8 X9 RB7 0 0 0 0 0 0 0 0 0 0 RB6 1 1 0 0 1 1 0 0 1 1 RB5 1 1 1 1 1 1 1 1 1 1 RB4 1 1 1 1 1 1 1 1 1 1 Rev. 0 | Page 22 of 28 RB3 0 1 0 1 0 1 0 1 0 0 RB2 1 1 1 1 1 1 1 1 1 1 RB1 0 0 0 0 0 0 1 1 1 1 RB0 0 0 1 1 1 1 0 0 0 0 05898-005 A2 SDA ADG2108 SCL A2 SDA START COND BY MASTER A1 A0 RB7 R/W ACK BY SWITCH ADDRESS BYTE RB6 RB5 RB4 RB3 RB2 RB1 RB0 DATA BYTE x x x ACK BY SWITCH x x x x x NO ACK BY SWITCH DATA BYTE STOP COND BY MASTER SCL START COND BY MASTER ADDRESS BYTE A1 A0 R/W ACK BY SWITCH Y7 DUMMY READBACK BYTE Figure 35. Read Operation Rev. 0 | Page 23 of 28 ACK BY MASTER Y6 Y5 Y4 Y3 Y2 READBACK BYTE Y1 Y0 NO ACK BY MASTER STOP COND BY MASTER 05898-006 A2 SDA ADG2108 EVALUATION BOARD The ADG2108 evaluation board allows designers to evaluate the high performance ADG2108 8 × 10 switch array with a minimum of effort. The evaluation kit includes a populated, tested ADG2108 printed circuit board. The evaluation board interfaces to the USB port of a PC, or it can be used as a standalone evaluation board. Software is available with the evaluation board that allows the user to easily program the ADG2108 through the USB port. Schematics of the evaluation board are shown in Figure 36 and Figure 37. The software runs on any PC that has Microsoft® Windows® 2000 or Windows XP installed. USING THE ADG2108 EVALUATION BOARD The ADG2108 evaluation kit is a test system designed to simplify the evaluation of the ADG2108. Each input/output of the part comes with a socket specifically chosen for easy audio/video evaluation. An application note is also available with the evaluation board that gives full information on operating the evaluation board. POWER SUPPLY The ADG2108 evaluation board can be operated with both single and dual supplies. VDD and VSS are supplied externally by the user. The VL supply can be applied externally, or the USB port can be used to power the digital circuitry. Rev. 0 | Page 24 of 28 ADG2108 05898-041 SCHEMATICS Figure 36. EVAL-ADG2108EB Schematic, USB Controller Section Rev. 0 | Page 25 of 28 05898-042 ADG2108 Figure 37. EVAL-ADG2108EB Schematic, Chip Section Rev. 0 | Page 26 of 28 ADG2108 OUTLINE DIMENSIONS 0.60 MAX 5.00 BSC SQ 0.60 MAX PIN 1 INDICATOR TOP VIEW 0.50 BSC 4.75 BSC SQ 0.50 0.40 0.30 32 1 3.25 3.10 SQ 2.95 EXPOSED PAD (BOTTOM VIEW) 17 16 9 8 0.25 MIN 3.50 REF 0.80 MAX 0.65 TYP 12° MAX 1.00 0.85 0.80 PIN 1 INDICATOR 25 24 0.05 MAX 0.02 NOM SEATING PLANE 0.30 0.23 0.18 0.20 REF COPLANARITY 0.08 COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2 Figure 38. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 5 mm x 5 mm Body, Very Thin Quad (CP-32-2) Dimensions shown in millimeters ORDERING GUIDE Model ADG2108BCPZ-R2 1 ADG2108BCPZ-REEL71 ADG2108BCPZ-HS-RL71 ADG2108YCPZ-R21 ADG2108YCPZ-REEL71 ADG2108YCPZ-HS-RL71 EVAL-ADG2108EB 1 Temperature Range –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +125°C –40°C to +125°C –40°C to +125°C I2C Speed 100 kHz, 400 kHz 100 kHz, 400 kHz 100 kHz, 400 kHz, 3.4 MHz 100 kHz, 400 kHz 100 kHz, 400 kHz 100 kHz, 400 kHz, 3.4 MHz Package Description 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 10 x 8 Evaluation Board Z = Pb-free part. Rev. 0 | Page 27 of 28 Package Option CP-32-2 CP-32-2 CP-32-2 CP-32-2 CP-32-2 CP-32-2 ADG2108 NOTES Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. ©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D05898-0-4/06(0) Rev. 0 | Page 28 of 28