PRELIMINARY TECHNICAL DATA Wideband, 43dB Isolation @ 1GHz, CMOS 1.65 V to 2.75V, 2:1 Mux/SPDT Switches ADG918/ADG919 Preliminary Technical Data a FEATURES Wideband DC to 2GHz ADG918/ADG919 Absorptive/Reflective Switches High Off Isolation (43 dB @ 1 GHz) Low Insertion Loss (1 dB DC to 900 MHz) Single 1.65 to 2.75 V power supply CMOS/LVTTL Control Logic 8 Lead MSOP & Tiny 3 x 3mm CSP Packages µA) Low Power Consumption (5µ FUNCTIONAL BLOCK DIAGRAM ADG918 RF1 RF COMMON 50Ω RF2 CONTROL 50Ω APPLICATIONS Wireless Communications General Purpose RF switching Dual Band Applications Filter Selection Antenna Switch Digital Transceiver Front-End Switch IF Switching ADG919 RF1 RF COMMON RF2 CONTROL GENERAL DESCRIPTION The ADG918/ADG919 are wideband switches using a CMOS process to provide high isolation and low insertion loss to 1GHz. The ADG918 is an absorptive switch having 50 ohm terminated shunt legs, while the ADG919 is a reflective switch. These devices are designed such that the isolation is high over the DC to 1GHz frequency range. They have on board CMOS control logic, thus eliminating the need for external controlling circuitry. The control inputs are both CMOS and LVTTL compatible. The low power consumption of these CMOS devices makes them ideally suited to wireless applications and general purpose high frequency switching. Figure 1. Isolation vs Frequency Table 1. Truth Table Control Signal Path 0 1 RF2 to RF Common RF1 to RF Common Figure 2. Loss vs Frequency REV. PrC Sept 2002 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 Analog Devices, Inc., 2002 PRELIMINARY TECHNICAL DATA 1 ADG918/ADG919–SPECIFICATIONS (V = +1.65 V to +2.75 V, GND = 0 V, All specifications T to T unless otherwise noted) DD MIN MAX Parameter Symbol Conditions AC ELECTRICAL CHARACTERISTICS Operating Frequency Insertion Loss S21, S12 Isolation- RF to RF1/RF2 S21, S12 Isolation - RF1 to RF2 S21, S12 Return Loss (On Channel) S11, S22 On switching Time Off Switching Time 1 dB Compression Third Order Intermodulation intercept tON t OFF P-1dB IP3 VINH VINH VINL VINL II VDD = 2.3 V to 2.75 V VDD = 1.65 V to 1.95 V VDD = 2.3 V to 2.75 V VDD = 1.65 V to 1.95 V 0 ⱕ VIN ⱕ 2.75 V CAPACITANCE3 RF1/RF2, RF Port On Capacitance Control Input Capacitance CRF ON C IN f = 1 MHz f = 1 MHz POWER REQUIREMENTS VDD Quiescent Power Supply Current IDD Digital Inputs = 0 V or VDD Input Low Voltage Input Leakage Current B Version Typ 2 DC DC - 100 MHz 500 MHz 900 MHz 1 MHz 100 MHz 500 MHz 1000 MHz 1 MHz 100 MHz 500 MHz 1000 MHz DC - 100 MHz 500 MHz 1000 MHz 50% Control to 90% RF 50% Control to 10% RF DC to 1000 MHz 900MHz, 5dBm DC ELECTRICAL CHARACTERISTICS Input High Voltage Min Max Units 2 GHz dB dB dB dB dB dB dB dB dB dB dB dB dB dB ns ns dBm dBm 0.4 0.65 1.0 100 55 43 100 55 30 26 23 5 4 20 35 1.7 0.65VCC 0.7 0.35VCC ±1 2 2 1.65 1 V V V V µA pF pF 2.75 5 V µA NOTES 1 Temperature range is as follows: B Version: –40°C to +85°C. 2 Typical values are at +25°C unless otherwise stated. 3 Guaranteed by design, not subject to production test. Specifications subject to change without notice. –2– REV. PrC PRELIMINARY TECHNICAL DATA ADG918/ADG919 ABSOLUTE MAXIMUM RATINGS 1 PIN CONFIGURATION (T A = +25°C unless otherwise noted) VDD to GND -0.5 V to +4 V Inputs to GND -0.5 V to VDD + 0.3V Input Power TBD dBm Operating Temperature Range Industrial (B Version) –40°C to +85°C Storage Temperature Range –65°C to +150°C Junction Temperature +150°C MSOP Package 206°C/W θJA Thermal Impedance CSP Package TBD°C/W θJA Thermal Impedance Lead Temperature, Soldering (10seconds) 300°C IR Reflow, Peak Temperature (<20 seconds) +235°C 8-Lead MSOP (RM-8) 3x3mm CSP (CP-8) 1 VDD CONTROL 2 GND 3 RFCommon 4 8 ADG918/ ADG919 TOP VIEW (Not to Scale) RF1 7 GND 6 GND 5 RF2 NOTES 1 Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. ORDERING GUIDE Model Temperature Range Package Descriptions ADG918BRM ADG918BCP ADG919BRM ADG919BCP –40°C –40°C –40°C –40°C MSOP (Micro Small Outline Package) Chip Scale Package MSOP (Micro Small Outline Package) Chip Scale Package to to to to +85°C +85°C +85°C +85°C Branding CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG919 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. REV. PrC –3– Package Options RM-8 CP-8 RM-8 CP-8 PRELIMINARY TECHNICAL DATA ADG918/ADG919 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). MSOP (RM-8) 0.122 (3.10) 0.114 (2.90) 8 5 0.199 (5.05) 0.187 (4.75) 0.122 (3.10) 0.114 (2.90) 1 4 PIN 1 0.0256 (0.65) BSC 0.120 (3.05) 0.112 (2.84) 0.120 (3.05) 0.112 (2.84) 0.043 (1.09) 0.037 (0.94) 0.006 (0.15) 0.002 (0.05) 0.018 (0.46) SEATING 0.008 (0.20) PLANE 0.011 (0.28) 0.003 (0.08) 33 27 0.028 (0.71) 0.016 (0.41) Chip Scale Package (CP-8) 3 x 3mm TBD –4– REV. PrC