AD ADG601BRM

2 CMOS
5 V/5 V, SPST Switches
ADG601/ADG602
a
FEATURES
Low On Resistance 2.5 Max
<0.6 On Resistance Flatness
Dual 2.7 V to 5.5 V or Single 2.7 V to 5.5 V Supplies
Rail-to-Rail Input Signal Range
Tiny 6-Lead SOT-23 and 8-Lead Micro-SOIC Packages
Low Power Consumption
TTL/CMOS-Compatible Inputs
FUNCTIONAL BLOCK DIAGRAMS
D
S
D
S
IN
APPLICATIONS
Automatic Test Equipment
Power Routing
Communication Systems
Data Acquisition Systems
Sample and Hold Systems
Avionics
Relay Replacement
Battery-Powered Systems
IN
ADG602
ADG601
SWITCHES SHOWN FOR A LOGIC “1” INPUT
GENERAL DESCRIPTION
Table I. Truth Table
The ADG601/ADG602 are monolithic CMOS SPST (Single
Pole, Single Throw) switches with On Resistance typically less
than 2.5 Ω. The Low On Resistance flatness makes the ADG601/
ADG602 ideally suited to many applications, particularly those
requiring low distortion. These switches are ideal for replacements for mechanical relays because they are more reliable, have
lower power requirements, and package size is much smaller.
PRODUCT HIGHLIGHTS
The ADG601 is a normally open (NO) switch, while the ADG602
is normally closed (NC). Each switch conducts equally well in
both directions when ON, with the input signal range extending
to the supply rails.
1.
2.
3.
4.
ADG601 In
ADG602 In
Switch Condition
0
1
1
0
OFF
ON
Low On Resistance (2 Ω typical)
Dual ± 2.7 V to ± 5.5 V or Single 2.7 V to 5.5 V Supplies
Tiny 6-lead SOT-23 and 8-lead Micro-SOIC Packages
Rail-to-Rail Input Signal Range
They are available in tiny 6-lead SOT-23 and 8-lead MicroSOIC packages.
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 2001
ADG601/ADG602 –SPECIFICATIONS
DUAL SUPPLY (V
DD
= 5 V 10%, VSS = –5 V 10%, GND = 0 V, unless otherwise noted.)
25oC
Parameter
B Version
–40oC
to +85oC
ANALOG SWITCH
Analog Signal Range
Unit
VSS to VDD
On Resistance (RON)
On-Resistance Flatness (RFLAT(ON))
2
2.5
0.35
0.4
Test Conditions/Comments
V
Ω typ
Ω max
Ω typ
Ω max
5.5
0.6
VDD = +4.5 V, VSS = –4.5 V
VS = ± 4.5 V, IS = –10 mA;
Test Circuit 1
VS = ± 3.3 V, IS = –10 mA
LEAKAGE CURRENTS
Source OFF Leakage IS (OFF)
Drain OFF Leakage ID (OFF)
Channel ON Leakage ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
± 0.01
± 0.25
± 0.01
± 0.25
± 0.01
± 0.25
nA typ
nA max
nA typ
nA max
nA typ
nA max
±1
±1
±1
2.4
0.8
V min
V max
0.005
± 0.1
CIN, Digital Input Capacitance
VDD = +5.5 V, VSS = –5.5 V
VS = +4.5 V/–4.5 V, VD = –4.5 V/+4.5 V;
Test Circuit 2
VS = +4.5 V/–4.5 V, VD = –4.5 V/+4.5 V;
Test Circuit 2
VS = VD = +4.5 V, or –4.5 V;
Test Circuit 3
2
µA typ
µA max
pF typ
VIN = VINL or VINH
ns typ
ns max
ns typ
ns max
pC typ
dB typ
MHz typ
pF typ
pF typ
pF typ
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; Test Circuit 4
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; Test Circuit 4
VS = 0 V, RS = 0 Ω, CL = 1 nF; Test Circuit 5
RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 6
RL = 50 Ω, CL = 5 pF; Test Circuit 7
f = 1 MHz
f = 1 MHz
f = 1 MHz
2
DYNAMIC CHARACTERISTICS
tON
tOFF
Charge Injection
Off Isolation
Bandwidth –3 dB
CS (OFF)
CD (OFF)
CD, CS (ON)
80
120
45
75
250
–60
180
50
50
145
155
90
POWER REQUIREMENTS
IDD
0.001
ISS
0.001
µA typ
µA max
µA typ
µA max
1.0
1.0
VDD = +5.5 V, VSS = –5.5 V
Digital Inputs = 0 V or 5.5 V
Digital Inputs = 0 V or 5.5 V
NOTES
1
Temperature range is as follows: B Version: –40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
–2–
REV. 0
ADG601/ADG602
SINGLE SUPPLY1 (V
DD
= 5 V 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.)
B Version
–40C
25C
to +85C
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On-Resistance Flatness (RFLAT(ON))
3.5
5
0.2
Unit
0 V to VDD
V
8
0.2
0.35
Ω typ
Ω max
Ω typ
Ω max
Test Conditions/Comments
VDD = 4.5 V
VS = 0 V to 4.5 V, IS = –10 mA;
Test Circuit 1
VS = 1.5 V to 3.3 V, IS = –10 mA
LEAKAGE CURRENTS
Source OFF Leakage IS (OFF)
Drain OFF Leakage ID (OFF)
Channel ON Leakage ID, IS (ON)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
± 0.01
± 0.25
± 0.01
± 0.25
± 0.01
± 0.25
±1
2.4
0.8
V min
V max
± 0.1
µA typ
µA max
pF typ
VIN = VINL or VINH
ns typ
ns max
ns typ
ns max
pC typ
dB typ
MHz typ
pF typ
pF typ
pF typ
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; Test Circuit 4
RL = 300 Ω, CL = 35 pF
VS = 3.3 V; Test Circuit 4
VS = 0 V, RS = 0 Ω, CL = 1 nF, Test Circuit 5
RL = 50 Ω, CL = 5 pF, f = 1 MHz, Test Circuit 6
RL = 50 Ω, CL = 5 pF, Test Circuit 7
f = 1 MHz
f = 1 MHz
f = 1 MHz
±1
±1
0.005
CIN, Digital Input Capacitance
VDD = 5.5 V
VS = 4.5 V/1 V, VD = 1 V/4.5 V;
Test Circuit 2
VS = 4.5 V/1 V, VD = 1 V/4.5 V;
Test Circuit 2
VS = VD = 4.5 V, or 1 V;
Test Circuit 3
nA typ
nA max
nA typ
nA max
nA typ
nA max
2
2
DYNAMIC CHARACTERISTICS
tON
tOFF
Charge Injection
Off Isolation
Bandwidth –3 dB
CS (OFF)
CD (OFF)
CD, CS (ON)
110
220
50
80
20
–60
180
50
50
145
280
110
POWER REQUIREMENTS
IDD
µA typ
µA max
0.001
1.0
NOTES
1
Temperature range is as follows: B Version: –40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
REV. 0
–3–
VDD = 5.5 V
Digital Inputs = 0 V or 5.5 V
ADG601/ADG602
ABSOLUTE MAXIMUM RATINGS 1
PIN CONFIGURATIONS
(TA = 25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V
Analog Inputs2 . . . . . . . . . . . . . . . . . VSS –0.3 V to VDD +0.3 V
Digital Inputs2 . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD +0.3 V
or 30 mA, whichever occurs first
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle Max) . . . . . . . . . 200 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Micro-SOIC Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44°C/W
SOT_23 Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . 229.6°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . 91.99°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . 300°C
IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . 220°C
6-Lead Plastic Surface Mount (SOT_23)
(RT-6)
VDD 1
S 2
VSS 3
ADG601/
ADG602
8
IN
7
D
TOP VIEW 6 GND
(Not to Scale)
8-Lead Small Outline Micro-SOIC
(RM-8)
D 1
NC 2
ADG601/
ADG602
8
S
7
GND
NC 3
6 IN
TOP VIEW
VDD 4 (Not to Scale) 5 VSS
NC = NO CONNECT
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
Branding Information*
ADG601BRT
ADG601BRM
ADG602BRT
ADG602BRM
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Plastic Surface-Mount (SOT_23)
Micro Small Outline (Micro-SOIC)
Plastic Surface-Mount (SOT_23)
Micro Small Outline (Micro-SOIC)
RT-6
RM-8
RT-6
RM-8
STB
STB
SUB
SUB
*Branding on SOT_23 and Micro-SOIC packages is limited to three characters due to space constraints.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG601/ADG602 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
–4–
WARNING!
ESD SENSITIVE DEVICE
REV. 0
ADG601/ADG602
TERMINOLOGY
VDD
VSS
IDD
ISS
GND
S
D
IN
VD (VS)
RON
RFLAT(ON)
IS (OFF)
ID (OFF)
ID, IS (ON)
VINL
VINH
IINL(IINH)
CS (OFF)
CD (OFF)
CD,CS(ON)
CIN
tON
tOFF
Charge Injection
Off Isolation
On Response
Insertion Loss
Most Positive Power Supply Potential
Most Negative Power Supply Potential
Positive Supply Current
Negative Supply Current
Ground (0 V) Reference
Source Terminal. May be an input or output.
Drain Terminal. May be an input or output.
Logic Control Input
Analog Voltage on Terminals D, S
Ohmic Resistance Between D and S
Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured
over the specified analog signal range.
Source Leakage Current with the Switch “OFF”
Drain Leakage Current with the Switch “OFF”
Channel Leakage Current with the Switch “ON”
Maximum Input Voltage for Logic “0”
Minimum Input Voltage for Logic “1”
Input Current of the Digital Input
“OFF” Switch Source Capacitance. Measured with reference to ground.
“OFF” Switch Drain Capacitance. Measured with reference to ground.
“ON” Switch Capacitance. Measured with reference to ground.
Digital Input Capacitance
Delay Between Applying the Digital Control Input and the Output Switching On.
Delay Between Applying the Digital Control Input and the Output Switching Off.
A measure of the glitch impulse transferred from the digital input to the analog output during switching.
A measure of unwanted signal coupling through an “OFF” Switch.
Frequency Response of the “ON” Switch
Loss Due to the ON Resistance of the Switch
Typical Performance Characteristics
5
VDD 3.0V
8
ON RESISTANCE – 2.5V
3V
3.3V
3
4.5V
2
5V
1
4
7
6
5
VDD 3.3V
4
VDD 4.5V
3
2
VDD 5.0V
TA 25 C
VSS 0V
1
0
–3 –2
–1 0
1
VD, VS – V
2
3
4
5
TPC 1. On Resistance vs. VD(VS)
(Dual Supply)
REV. 0
3
+85 C
+25 C
2
1
–40 C
0
0
–5 –4
VDD +5V
VSS –5V
VDD 2.7V
9
ON RESISTANCE – 4
ON RESISTANCE – 5
10
TA 25 C
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VD, VS – V
TPC 2. On Resistance vs. VD(VS)
(Single Supply)
–5–
–5 –4
–3 –2
–1 0
1
VD, VS – V
2
3
4
5
TPC 3. On Resistance vs. VD(VS) for
Different Temperatures (Dual Supply)
ADG601/ADG602 –Typical Performance Characteristics (continued)
0.5
0.5
VDD 5V
VSS 0V
VD 4.5V1V
VS 1V4.5V
0.4
+85 C
0.3
CURRENT – nA
3
2
–40 C
+25 C
0.2
0
–0.1
ID (OFF)
0
0
500
0
IS (OFF)
–0.4
–0.5
0
10
20
30 40 50 60
TEMPERATURE – C
70
80 85
TPC 5. Leakage Currents vs.
Temperature (Single Supply)
TIME – ns
250
VDD 5V
VSS 0V
200
100
100
40
50
20
–3 –2
–1
0
1
VS – V
2
3
4
5
TPC 7. Charge Injection vs. Source
Voltage
tON
80
60
150
0
–5 –4
VDD +5V
VSS –5V
120
VDD +5V
VSS –5V
300
0
–40
10
20
30 40 50 60
TEMPERATURE – C
70
80 85
–10
VDD 5V
VSS 0V
140
350
0
0
160
400
IS (OFF)
TPC 6. Leakage Currents vs.
Temperature (Dual Supply)
180
TA 25 C
ID (OFF)
–0.3
–0.5
TPC 4. On Resistance vs. VD(VS) for
Different Temperatures (Single Supply)
ID, IS (ON)
–0.1
–0.4
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VD, VS – V
450
0.2
0.1
–0.2
–0.3
VDD 5V
VSS 0V
CHARGE INJECTION – pC
ID, IS (ON)
0.1
–0.2
1
0.3
tOFF
ATTENUATION – dB
ON RESISTANCE – 4
VDD +5V
VSS –5V
VD 4.5V
VS 4.5V
0.4
CURRENT – nA
5
–20
–30
–40
–50
–60
VDD 5V
VSS 0V
–20
VDD +5V
VSS –5V
0
20
40
60
TEMPERATURE – C
80
TPC 8. tON/tOFF Times vs. Temperature
–70
–80
0.2
VDD +5V
VSS –5V
TA 25C
10
1
FREQUENCY – MHz
100
TPC 9. Off Isolation vs. Frequency
0
ATTENUATION – dB
–2
–4
–6
–8
–10
–12
0.2
VDD +5V
VSS –5V
TA 25 C
1
10
100
FREQUENCY – MHz
400
TPC 10. On Response vs. Frequency
–6–
REV. 0
ADG601/ADG602
TEST CIRCUITS
IDS
IS (OFF)
V1
A
S
D
S
D
ID (OFF)
ID (ON)
A
VS
S
NC
D
A
VD
NC = NO CONNECT
VS
VD
RON = V1/IDS
Test Circuit 1. On Resistance
VDD
Test Circuit 2. Off Leakage
VSS
0.1F
0.1F
VS
Test Circuit 3. On Leakage
VDD
VSS
S
D
VOUT
RL
300
IN
VIN
ADG601
50%
50%
VIN
ADG602
50%
50%
CL
35pF
90%
VOUT
90%
GND
t ON
t OFF
Test Circuit 4. Switching Times
VDD
VSS
VDD
VSS
VIN
ADG601
OFF
ON
RS
S
D
VS
VOUT
CL
1nF
IN
VIN
ADG602
VOUT
GND
QINJ = CL VOUT
VOUT
Test Circuit 5. Charge Injection
VDD
VDD
0.1F
VDD
NETWORK
ANALYZER
VSS
S
S
NETWORK
ANALYZER
50
VS
D
VOUT
VIN
VOUT
VIN
RL
50
GND
GND
VOUT
INSERTION LOSS = 20 LOG
VS
Test Circuit 6. Off Isolation
REV. 0
VSS
IN
VS
D
OFF ISOLATION = 20 LOG
0.1F
VDD
50
50
IN
VSS
0.1F
0.1F
RL
50
VOUT WITH SWITCH
VS WITHOUT SWITCH
Test Circuit 7. Bandwidth
–7–
ADG601/ADG602
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
C02619–.8–10/01(0)
8-Lead Micro-SOIC
(RM-8)
0.122 (3.10)
0.114 (2.90)
8
5
0.122 (3.10)
0.114 (2.90)
0.199 (5.05)
0.187 (4.75)
1
4
PIN 1
0.0256 (0.65) BSC
0.120 (3.05)
0.112 (2.84)
0.120 (3.05)
0.112 (2.84)
0.043 (1.09)
0.037 (0.94)
0.006 (0.15)
0.002 (0.05)
0.018 (0.46)
SEATING 0.008 (0.20)
PLANE
0.011 (0.28)
0.003 (0.08)
33
27
0.028 (0.71)
0.016 (0.41)
6-Lead Plastic Mount SOT-23
(RT-6)
0.122 (3.10)
0.106 (2.70)
6
5
4
0.071 (1.80)
0.059 (1.50)
0.118 (3.00)
0.098 (2.50)
1
2
3
PIN 1
0.075
(1.90)
BSC
0.006 (0.15)
0.000 (0.00)
0.057 (1.45)
0.035 (0.90)
0.020 (0.50)
0.010 (0.25)
SEATING
PLANE
0.009 (0.23)
0.003 (0.08)
10
0
0.022 (0.55)
0.014 (0.35)
PRINTED IN U.S.A.
0.051 (1.30)
0.035 (0.90)
0.037
(0.95) BSC
–8–
REV. 0