TI AM5K2E04

Industrial Imaging
Applications Brief
Applications of the K2H and K2E platforms in
high-end imaging
TI’s K2E and K2H System-on-Chip (SoC)
platforms, based on the KeyStone II
multicore architecture, are 28-nm highperformance platforms that deliver powerefficient processing solutions for high-end
imaging applications. These devices are
the first to integrate ARM® Cortex™-A15
MPCore™ processors with high-performance
TMS320C66x DSP cores, providing
heterogeneous processing at industry-low
power-consumption levels.
The integration of the Cortex-A15 pro­
cessors greatly reduces system cost and
design complexity by removing the need for
a high-end general-purpose processor. With
full support of SMP Linux™, the Cortex-A15
processors enable developers to quickly and
easily migrate existing software designs to the
low-power, high-performance K2E and K2H
platforms.
ARM®
Cortex™-A15
C66x DSP
5-Port 1 GbE
Switch
3-Port 10 GbE
Switch
NetCP
AM5K2E02
2
0
1
0
1
AM5K2E04
4
0
2
2
2
66AK2E05
4
1
2
2
2
66AK2E02
1
1
1
0
1
66AK2H12
4
8
1
0
1
66AK2H06
2
4
1
0
1
K2E
K2H
Table 1 – Devices in the KeyStone II architecture
Many high-end imaging applications require
powerful real-time processing as well as the
need to run operating system and control
code. With the K2H platform, developers of
applications will have for the first time, a full
Multicore Navigator
ARM A15 ARM A15 ARM A15 ARM A15
011100
100010
001111
011100
100010
001111
4 MB
C66x DSP C66x DSP C66x DSP C66x DSP
1 MB 1 MB 1 MB 1 MB
011100
1 MB 011100
1 MB 011100
1 MB 011100
1 MB
011100
Multicore Shared Memory Controller
DDR3/3L
64/72b
PCIE
011100
EMIF 16
011100
011100
TeraNet
+ *
+ *
+ *
+ *
- + <<* - + <<* - + <<* - + <<*
C66x- DSP
<< C66x- DSP
<< C66x- DSP
<< C66x- DSP
<<
System
Services
SPI
System
Monitor
Debug
EDMA
Security AccelerationPac
Packet AccelerationPac
6 MB
DDR3/3L
64/72b
UART
Power
Manager
Ethernet Switch
2
IC
HyperLink
USB 3
SRIO
®
Figure 1 – TI’s 66AK2H12 SoC with four Cortex-A15 processors and eight C66x DSP cores
Ethernet
ARM-based Linux device integrated with the
industry’s highest-performing DSP cores in a
single power-efficient package that can deliver
up to 352 GMACS, 198 GFLOPS and 19,600
Dhrystone MIPS. Coupled with industry-best
development tools and multicore software
support for OpenMP® and OpenCL™,
developers can easily parallelize code and run
it on the ARM or DSP cores and quickly create
code that scales across the different devices
within the K2H and K2E platforms, allowing for
the most cost- and power-efficient designs.
Application Segments
Industrial Automation: Industrial automation
systems are implemented to increase
production throughput and productivity and
to improve the quality and consistency of a
product or process. These systems perform a
wide array of functions including:
• Image location and enhancement
• 1D/2D code reading
• 2D/3D pattern matching
• Background modeling and subtraction
• Object feature extraction
• Edge detection
• Dilation and erosion
• Thresholding
• Image warping
• Optical character recognition (OCR)
• Edge- and surface-based inspection
• Defect identification and classification
• Feature and tolerance verification
• Color identification
The combination of these functions in
an industrial automation system requires
significant real-time processing. These
processing functions can be implemented in
a smart industrial imaging camera with a lowpower, high-performance processor like TI’s
TMS320C665x multicore DSPs which provide
enough processing power to do many industrial
automation functions while remaining within
the power limitations of the camera.
Where more processing is needed or post
processing analysis is desired, a multi-headed
processing unit taking input from several
cameras in a centralized vision processing
unit as part of a comprehensive industrial
automation system is deployed, as shown
in Figure 2. This central system typically is
responsible for most of the analytic processing.
The K2E and K2H SoC platforms provide
an elegant, scalable solution for this type of
centralized processing in industrial automation
systems.
With the Cortex-A15 processors in the K2H
and K2E devices and the development tools
and programming models available from TI,
developers have the ability to support full ARMbased Linux™ systems while offloading the
real-time processing to the high-performance
C66x cores. The offloading of real-time
processing enables a more power-efficient,
high-performance centralized processing unit.
For more complex systems requiring additional
processing capacity, TI’s HyperLink can be used
to connect multiple KeyStone devices adding
additional C66x DSP cores and/or Cortex-A15
processors.
Because the processing elements of
the KeyStone SoCs are programmable and
scalable, the system has maximum flexibility,
allowing the same processing system to
be used across different product lines. The
scalability is further expanded because the
C66x cores in the K2H platform are the same
as those in the C665x platform. Therefore,
code developed for the C66x core that is used
in the central processing unit can migrate to
the smart automation camera and vice versa,
allowing maximum reuse and scalability.
Video Surveillance: Video surveillance appli­
cations will also benefit from TI’s K2H and K2E
platform of devices. This is particularly true in
the popular network video recorder (NVR) and
digital video recorder (DVR) hybrid, known as an
NVR/DVR, and the standalone analytics servers.
These end equipments get their video
content through a network connection and
may have to encode/transcode the video
before storing it. Video can then be retrieved,
decoded/transcoded when necessary, and
have various analytics algorithms run on all or
parts of the video stream. Common analytic
algorithms used in surveillance are:
• Tamper detection
• Motion detection
• Trip zone/boundary crossing
• Object detection/removal
• Object identification
• Object counting
• Object tracking
• Behavior analysis
• Facial recognition
• License plate recognition
TI’s KeyStone II SoCs are well equipped
to handle the combination of the NVR/DVR
functionality and the need for processing the
analytics algorithms listed above.
KeyStone II devices feature a network
coprocessor AccelerationPac. This
AccelerationPac consists of a packet
accelerator and a security accelerator that
work in tandem to offload the DSP and
ARM cores. This enables high-performance
network application processing while freeing
the C66x DSP and Cortex-A15 processors for
other functions like analytics, video encode/
decode, running the operating system (OS)
Multi-Head
Vision Controller
66AK2H06 SoC
inside
Multicore Navigator
+ *
+ *
- + <<* - + <<*
+ *
+ *
- + <<* - + <<*
011100
100010
001111
011100
100010
001111
4 MB
C66x DSP C66x DSP C66x DSP C66x DSP
1 MB 1 MB 1 MB 1 MB
011100
1 MB 011100
1 MB 011100
1 MB 011100
1 MB
011100
DDR3/3L
64/72b
PCIE
011100
Multicore Shared Memory Controller
EMIF 16
011100
011100
TeraNet
C66x- DSP
<< C66x- DSP
<< C66x- DSP
<< C66x- DSP
<<
ARM A15 ARM A15 ARM A15 ARM A15
Power
Manager
System
Services
UART
SPI
System
Monitor
Debug
EDMA
Security AccelerationPac
Packet AccelerationPac
6 MB
DDR3/3L
64/72b
Ethernet Switch
2
IC
HyperLink
USB 3
SRIO
®
Ethernet
Figure 2 – Example of 66AK2H06 SoC used as the main processor in a multi-head vision controller used to control multiple cameras and run analytics in an industrial
automation system
and executing control code. The security
accelerator provides security processing for a
number of popular encryption and decryption
modes and algorithms, including IPSec, SCTP,
SRTP, 3GPP and SSL/TLS.
The C66x DSP cores in the K2H platform
are ideal for running advanced analytics
algorithms. Providing both fixed- and
floating-point capability and high-speed
device interconnectivity through HyperLink
to connect multiple KeyStone devices, the
K2H platform provides a scalable solution
to fit the processing needs of any NVR/DVR
system, including software implementations of
advanced codecs like HEVC.
With the Cortex-A15 processors integrated
into the same K2H platform, or available
stand alone in the K2E platform, developers
have a full ARM-based Linux system allowing
quick and easy migration to the low-power,
high-performance KeyStone II devices while
eliminating the need for an additional generalpurpose CPU.
Other Applications for High-End
Imaging Include:
• High-end inspection systems
• PLC in industrial automation
• Industrial printers/scanners
• Currency/counterfeit detection
Development Support
Texas Instruments’ investment in hetero­
geneous software tools makes programming
and development simpler than ever. TI provides
a free, downloadable Multicore Software
Development Kit (MCSDK) which includes
highly-optimized libraries and platform-specific
drivers. TI also provides optimized single
and multicore libraries for FFTs, image and
video analytics, matrix math, and many other
commonly used functions and algorithms.
The multicore software development
tools include support for OpenMP®, making
it easier than ever to repurpose complex
application software, and OpenCL™ which
simplifies offloading tasks to the C66x DSP
cores. Algorithm and system developers
can recompile OpenMP code with TI’s Code
Composer Studio™ Integrated Development
Environment to run in supported KeyStone
devices with little modification, substantially
reducing the traditional porting time to
embedded architectures.
TI has numerous demonstration systems
available to help developers see a complete
system and to get up and running quickly.
These include an industrial imaging
demonstration and an image-processing
demonstration that is incorporated into TI’s
MCSDK.
TI also provides free video codecs for
the C66x DSP which come with production
licensing and are available for download.
Additional codecs are available via TI’s Design
Network.
To download TI’s multicore software, libraries
and tools please visit www.ti.com/multicore.
The platform bar and Code Composer Studio are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
© 2012 Texas Instruments Incorporated
Printed in U.S.A. by (Printer, City, State)
SPRT650
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated