uA9638C-EP SLLSEA4A – DECEMBER 2011 – REVISED DECEMBER 2011 www.ti.com DUAL HIGH-SPEED DIFFERENTIAL LINE DRIVER Check for Samples: uA9638C-EP FEATURES 1 • 2 • • • • • SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS Meets or Exceeds ANSI Standard EIA/TIA-422-B Operates From a Single 5-V Power Supply Drives Loads as Low as 50 Ω up to 15 Mbps TTL- and CMOS-Input Compatibility Output Short-Circuit Protection Interchangeable With National Semiconductor™ DS9638 • • • • • • • Controlled Baseline One Assembly/Test Site One Fabrication Site Rated From –40°C to 85°C Extended Product Life Cycle Extended Product-Change Notification Product Traceability D PACKAGE (TOP VIEW) VCC 1A 2A GND 1 8 2 7 3 6 4 5 1Y 1Z 2Y 2Z DESCRIPTION The uA9638C is a dual high-speed differential line driver designed to meet ANSI Standard EIA/TIA-422-B. The inputs are TTL and CMOS compatible and have input clamp diodes. Schottky-diode-clamped transistors are used to minimize propagation delay time. This device operates from a single 5-V power supply and is supplied in an 8-pin package. The uA9638 provides the current needed to drive low-impedance loads at high speeds. Typically used with twisted-pair cabling and differential receiver(s), base-band data transmission can be accomplished up to and exceeding 15 Mbps in properly designed systems. The uA9637A dual line receiver is commonly used as the receiver. For even faster switching speeds in the same pin configuration, see the SN75ALS191. The uA9638C is characterized for operation from -40°C to 85°C. 8 8 1Y 2 1A 7 1Z 2 1A 1Z 6 3 6 2Y 2A 5 2Z This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 1Y 7 3 2A 2Y 5 2Z Figure 2. Logic Diagram Figure 1. Logic Symbol 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. National Semiconductor is a trademark of National Semiconductor Corporation. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated uA9638C-EP SLLSEA4A – DECEMBER 2011 – REVISED DECEMBER 2011 www.ti.com ORDERING INFORMATION (1) TA = TJ –40°C to 85°C (1) PACKAGE SOIC - D Reel of 2500 ORDERABLE PART NUMBER TOP-SIDE MARKING VID NUMBER UA9638CIDREP 9638I V62/12606-10XE For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. SCHEMATICS OF INPUTS AND OUTPUTS VCC VCC 4 kΩ NOM Input 9.6 Ω NOM Output Figure 3. Equivalent of Each Input GND Figure 4. Typical of All Inputs ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range (2) –0.5 V to 7 V VI Input voltage range –0.5 V to 7 V Continuous total power dissipation Lead temperature 1,6 mm (1/16 inch) from 10 seconds See Dissipation Ratings Table 260°C TA Operating free-air temperature range –40°C to 85°C Tstg Storage temperature range –65°C to 150°C (1) (2) 2 Voltage values except differential output voltages are with respect to network GND. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated uA9638C-EP SLLSEA4A – DECEMBER 2011 – REVISED DECEMBER 2011 www.ti.com THERMAL INFORMATION uA9638C THERMAL METRIC (1) D UNITS 8 PINS θJA Junction-to-ambient thermal resistance (2) 114.3 θJC Junction-to-case thermal resistance 59.1 θJB Junction-to-board thermal resistance (3) 55.3 ψJT Junction-to-top characterization parameter (4) 12.7 ψJB Junction-to-board characterization parameter (5) 54.7 (1) (2) (3) (4) (5) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). DISSIPATION RATINGS PACKAGE POWER RATING TA = 25°C (mW) DERATING FACTOR TA > 70°C (mW/°C) POWER RATING TA = 85°C (mW) D 725 8.75 199 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT 4.75 5 5.25 V VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage 0.8 V IOH High-level output current -50 mA IOL Low-level output current 50 mA TA Operating free-air temperature 85 °C 2 V -40 ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT -1 -1.2 V Input clamp voltage VCC = 4.75 V, II = −18 mA VOH High level output voltage VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V VOL Low level output voltage VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, IOL = 40 mA |VOD1| Magnitude of differential output voltage VCC = 5.25 V, IO = 0 A |VOD2| Magnitude of differential output voltage VCC = 4.75 V to 5.25 V, RL = 100 Ω, See Figure 5 Δ|VOD| Change in magnitude of differential output voltage (2) VCC = 4.75 V to 5.25 V, RL = 100 Ω, See Figure 5 ±0.4 V VOC Common-mode output voltage (3) VCC = 4.75 V to 5.25 V, RL = 100 Ω, See Figure 5 3 V VIK (1) (2) (3) IOH = −10 mA 2.5 IOH = −40 mA 2 3.5 V 0.5 1.25 x VOD2 V V 2 V All typical values are at VCC = 5 V and TA = 25°C. Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low level or vice versa. In Standard EIA-422-A, VOC, which is the average of the two output voltages with respect to ground, is called output offset voltage, VOS. Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 3 uA9638C-EP SLLSEA4A – DECEMBER 2011 – REVISED DECEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS TYP (1) MIN MAX UNIT ±0.4 V Δ|VOC| Change in magnitude of common-mode output voltage (2) VCC = 4.75 V to 5.25 V, RL = 100 Ω, See Figure 5 IO Output current with power off VCC = 0 V II Input current VCC = 5.25 V, VI = 5.5 V 50 µA IIH High-level input current VCC = 5.25 V, VI = 2.7 V 25 µA IIL Low-level input current VCC = 5.25 V, VI = 0.5 V IOS Short-circuit output current (4) VCC = 5.25 V, VO = 0 V ICC Supply current (both drivers) VCC = 5.25 V, No load, All inputs at 0 V VO = 6 V VO = −0.25 V 0.1 100 -0.1 -100 VO = −0.25 V to 6 V (4) µA ±100 -50 -200 µA -150 mA 65 mA 45 Only one output at a time should be shorted, and duration of the short circuit should not exceed one second. SWITCHING CHARACTERISTICS VCC = 5 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT td(OD) Differential output delay time CL = 15 pF, RL = 100 Ω, See Figure 6 10 ns tt(OD) Differential output transition time CL = 15 pF, RL = 100 Ω, See Figure 6 10 ns tsk(o) Output skew See Figure 6 1 ns PARAMETER MEASUREMENT INFORMATION 50 Ω VOD2 Input VOC 50 Ω Figure 5. Differential and Common-Mode Output Voltages 3V Input 1.5 V 1.5 V 0V Y Output Differential Output CL Generator (see Note A) RL = 100 Ω 50 Ω td(OD) td(OD) 90% 90% 10% 10% tt(OD) tt(OD) Z Output CL = 15 pF (see Note B) VOH Y Output 50% 50% tsk(o) tsk(o) VOL VOH Z Output 50% 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. The input pulse generator has the following characteristics: ZO = 50 Ω, PRR ≤ 500 kHz, tw = 100 ns, tr = ≤ 5 ns. B. CL includes probe and jig capacitance. Figure 6. Test Circuit and Voltage Waveforms 4 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 23-Dec-2011 PACKAGING INFORMATION Orderable Device UA9638CIDREP Status (1) ACTIVE Package Type Package Drawing SOIC D Pins Package Qty 8 2500 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Feb-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device UA9638CIDREP Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.4 B0 (mm) K0 (mm) P1 (mm) 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 13-Feb-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UA9638CIDREP SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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