TPS71525-DIE www.ti.com SLVSBG6 – JULY 2012 LOW-DROPOUT LINEAR REGULATOR Check for Samples: TPS71525-DIE FEATURES 1 • • • • • 24-V Maximum Input Voltage Low Quiescent Current Low-Dropout Regulator Available in 2.5 V Minimum/Maximum Specified Current Limit APPLICATIONS • • • Ultra-Low Power Microcontrollers Cellular/Cordless Handsets Portable/Battery-Powered Equipment xxx DESCRIPTION The TPS71525 low-dropout (LDO) voltage regulator offers the benefits of high input voltage, low-dropout voltage, low-power operation, and miniaturized packaging. The TPS71525, which operates over an input range of 2.5 V to 24 V, is stable with any capacitor (≥ 0.47 µF). The low-dropout voltage and low quiescent current allow operations at extremely low power levels. Therefore, the TPS71525 is ideal for powering battery management ICs. Specifically, since the TPS71525 is enabled as soon as the applied voltage reaches the minimum input voltage, the output is quickly available to power continuously operating battery charging ICs. The usual PNP pass transistor has been replaced by a PMOS pass element. Because the PMOS pass element behaves as a low-value resistor, the low-dropout voltage, typically 415 mV at 50 mA of load current, is directly proportional to the load current. The low quiescent current is stable over the entire range of output load current. xxx ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE TPS71525 TD (2) Bare die in waffle pack ORDERABLE PART NUMBER PACKAGE QUANTITY TPS71525TDB1 400 TPS71525TDB2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TPS71525-DIE SLVSBG6 – JULY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 15 mils. Silicon with backgrind Floating Aluminium Pad (TiW/AlSiCu (0.5%)) 600 nm 607.5 684.0 0 52 0 SCRIBE 52 SCRIBE Table 1. Bond Pad Coordinates in Microns (1) (1) 2 DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX GND 1 6.03 5.40 90.09 89.46 2 507.78 15.30 591.84 99.36 OUT 3 465.93 583.74 591.84 667.80 VIN 4 15.39 583.74 141.30 667.80 Substrate is to float. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TPS71525-DIE PACKAGE OPTION ADDENDUM www.ti.com 27-Jul-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TPS71525TDB1 ACTIVE 0 400 TBD Call TI N / A for Pkg Type TPS71525TDB2 ACTIVE 0 10 TBD Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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