TI SLYY018A

W H I T E
PA P E R
Murugavel Raju,
MSP430 Systems Solutions Manager;
Mark Grazier,
Third-Party Program Manger,
Low-Power RF;
Texas Instruments
Executive summary
Energy Harvesting
ULP meets energy harvesting:
A game-changing combination for design engineers
Ambient energy: Light, heat, motion, RF, etc.
Macro-scale energy harvesting technologies in the form of windmills, watermills
and passive solar power systems have been
Energy
Harvester
Energy Storage
& Power Mgmt.
Perpetually
Powered
Sensor
Sensor(s)
Ultra-Low Power
Microcontroller
Low-Power
Transceiver
around for centuries. Now, as designers
seek to cut the cords, they turn to microenergy harvesting systems that can scavenge milliwatts from solar, vibrational,
thermal and biological sources. However,
understanding ultra-low power from the
Environment: Temperature, status, position, etc.
sourcing side brings challenges as harvested
power derived from ambient sources tends
to be unregulated, intermittent and small.
Energy harvesting has been around for centuries in the form of windmills, watermills and passive solar power systems. In recent decades, technologies such as wind turbines, hydro-electric generators and solar panels have turned harvesting into a small but growing contributor to
the world’s energy needs. This technology offers two significant advantages over battery-powered solutions: virtually inexhaustible sources and little or no adverse environmental effects.
Macro-scale harvesting technologies differ in many ways but have one thing in common:
they “feed the grid,” typically adding kilowatts or megawatts to the power distribution system.
As such, they are not game changers for electronic designers whose mission in life is to snip
the wires – including power cords and even battery-powered systems where the perpetual
device is the ultimate design goal.
For this second goal, micro-energy harvesting systems are the answer. Energy harvesting’s
new frontier is an array of micro-scale technologies that scavenge milliwatts from solar,
vibrational, thermal and biological sources. A few years ago, micro-harvesting could have
been called a scientific curiosity. But the design community’s long march to ultra-low-power
(ULP) technology has had the unexpected result of pushing micro-scale energy harvesting out
of the lab and onto the designer’s bench.
Now, designers are sizing up ULP not just from the consumption side but from the production perspective as well. Understanding ULP from the sourcing side will be every bit as
2
Texas Instruments
challenging as it was from the consumption side not that many years ago. Primary reason: harvested power
is derived from ambient sources so it tends to be unregulated, intermittent and small.
Figure 1: Macro v. micro energy harvesting comparison
ULP sets targets
Macro vs.
Micro
Energy Source
Solutions
Ultimate Goal
Macro
Renewable energy (e.g., solar, wind)
Energy management solutions
Reduce oil dependency
Micro
Energy from the environment (e.g., vibration, body heat)
Ultra-low-power solutions
Perpetual devices
While there is no widely accepted definition of ULP, it’s helpful to consider it in the context of batteries because they are easily the most common energy source for ULP designs today.
Medical applications in which electronic devices are implanted in or attached to the body are good examples of ULP designs that run on batteries. Here are three examples.
• Implanted medical device. Size and battery life are primary considerations. Power dissipation of 10 μW
and battery life of 15,000 hours would be typical.
• In-ear device. Size becomes more important that life, which indicates button cell. Typical power dissipation of 1 mW and 1,500-hour life.
• Surface-of-skin device. Limiting factor is the ability of skin surface to dissipate heat. Typical power
dissipation of 10 mW and 150-hour life.
Medical applications that consume milliwatts set the energy-production bar for harvesting devices. The
good news is that milliwatts are the same order of magnitude that micro-harvesters can generate.
Some non-medical products already use micro-harvesting sources. These include calculators, watches,
radios and Bluetooth® headsets. There are also applications that consume on the order of milliwatts as well,
but have not yet been adapted to micro-harvesting. The most promising application is being remote sensors.
Harvester
technologies
The most promising micro-harvesting technologies extract energy from vibration, temperature differentials
and light. A fourth possibility – scavenging energy from RF emissions – is interesting, but the energy availability is at least an order of magnitude less than that of the first three. Estimates vary, but Figure 2 shows
the approximate amount of energy per unit available from four micro-harvesting sources.
Figure 2. Energy harvesting estimates
Energy Source
Harvested Power
Vibration/Motion
Human
Industry
4 μW/cm2
100 μW/cm2
Temperature Difference
Human
Industry
25 μW/cm2
1–10 mW/cm2
Light
Indoor
Outdoor
10 μW/cm2
10 mW/cm2
RF
GSM
WiFi
Energy Harvesting
0.1 μW/cm2
0.001 μW/cm2
April 2010
Texas Instruments 3
Micro-harvesting provides power at the same order of magnitude that carefully designed ULP circuits
typically consume. The three most promising technologies – based on light, motion and thermal scavenging –
have different characteristics.
• Large solar panels have made photovoltaic harvesting a well characterized technology. Approximately
1 mW of average power can be harvesting from each 100-mm2 photovoltaic cell. Typical efficiency is
roughly 10 percent and the capacity factor of photovoltaic sources (the ratio of average power produced
to power that would be produced if the sun was always shining) is about 15 to 20 percent.
• Commercially available kinetic energy systems also produce power in the milliwatt range. Energy is most
likely to be generated by an oscillating mass (vibration). But electrostatic energy harvested by piezoelectric
cells or flexible elastomers is also classified as kinetic energy. Vibrational energy is available from structures such as bridges and in many industrial and automotive scenarios. Basic kinetic harvester technologies include: (1) a mass on a spring; (2) devices that convert linear to rotary motion; and
(3) piezoelectric cells. An advantage of (1) and (2) is that voltage is not determined by the source itself but
by the conversion design. Electrostatic conversion produces voltages as high as 1,000 V or more.
• Thermoelectric harvesters exploit the Seebeck effect, which states that voltage is created in the presence
of a temperature difference between two different metals or semiconductors. A thermoelectric generator
(TEG) consists of thermopiles connected thermally in parallel and electrically in series. The latest TEGs
are characterized by an output voltage of 0.7 V at matched load, which is a familiar voltage for engineers
designing ultra-low-power applications. Generated power depends on the size of the TEG, the ambient
temperature, and (in the case of harvesting heat energy from humans), the level of metabolic activity.
According to the Belgian-based research corporation IMEC, at 22˚C a wrist-watch type TEG delivers useful
power of 0.2 to 0.3 mW on average for normal activity. Typically, a TEG continuously charges a battery or
super-capacitor and requires advanced power management to optimize efficiency.
Despite their differences, photovoltaic, motion and thermal harvesting also have a few things in common:
They generate erratic voltages instead of the steady 3.3 V or 1.8 V design engineers sometimes take for
granted; they also provide intermittent power and sometimes no power at all.
Conversion technology is only part of the solution. Since micro-harvesters tend to generate intermittent
power, the most common system architectures are called hybrids because they include energy storage in
thin-film batteries.
A typical energy-harvesting system includes conversion, temporary storage and a heavy dose of sophisticated power management circuits, analog converters and ULP MCUs. To take ULP to the next level, it is
highly desirable to integrate as many of these circuits as possible on a single chip.
Best practices
Energy harvesting doesn’t exactly rewrite the rules of realizing the best power efficiency in circuit design, but
some of its best practices may be counter-intuitive to many engineers.
The key design goal is to match the power circuits to the application circuits for the best overall performance. Applications can then be developed knowing that technology will support that product.
Energy Harvesting
April 2010
4
Texas Instruments
Several techniques that solve the unfamiliar power management problems that micro-harvesters present
include:
• Optimizing switched power supplies because they can boost very small source voltages. By chopping the
input signal, switchers allow designers to control its magnitude and frequency. Switching topologies also
dissipate very little power but introduce unwanted frequencies that must be normalized.
• Since tasks such as charging the gate capacitance of a MOSFET could consume a large percentage of the
harvested energy, a current-source gate charge rather and a voltage-source gate charge will often make
sense.
• Another technique is to use more than one power converter circuit. The first circuit could be unregulated
but capable of charging a capacitor. Once sufficient energy is stored in the capacitor, it can be discharged
and the signal conditioned by a more sophisticated power converter circuit.
Silicon implications
What are the implications of micro-harvesting for ICs? The most common system component would be an
MCU. Because MCUs have more to do than just be stingy with energy, other criteria have to weigh in, including: wake up time (which also has an impact on energy consumption), operating voltage, frequency and code
density. Texas Instruments platform of MSP430 microcontrollers offer an excellent example of a controller
well-suited to energy harvesting applications. The MCU portfolio’s typical specifications outlined below make
it well suited for ULP applications.
• Low standby current
• Low active current
• Efficient 16-bit architecture with industry’s highest code density
• Integrated low power ADC for precision measurements
• Low operating voltage
• Low pin leakage
The most recent generation of MSP430 MCUs, the MSP430F5xx generation, allows designers to tap
into peak execution performance of up to 25 MHz while consuming as low as 160 μA/MHz (microamp per
Megahertz).
A system powered by a small battery – or micro-energy harvesting device – will need to communicate
information to another system or to a central collection point. Supplying power to a network of sensortransmitters has traditionally required expensive wiring installation or routine battery changes. Gathering data
from difficult or dangerous-to-reach locations using wired sensors may be impossible and or even compromise the safety of personnel installing wiring and replacing batteries.
Low power, wireless communication for energy-harvesting applications is the clear alternative. When discussing low-power radios, we will focus on radios that have the following capabilities or features: they can go
to sleep mode and be off 95 percent of the time; they can go from deep sleep to ready to transmit in 300 ms
or less; they consume less than 500 μA of current in the transition phase and typically consume less than
16 mA when transmitting and 20 mA when receiving data.
Energy Harvesting
April 2010
Texas Instruments 5
The following best practices will accelerate the development process of products featuring energy harvesting and RF technology
1. Use the lowest possible duty cycle. Send your data only when needed and do not send more data than
necessary. A large amount of sensor activity is exception-based messages. Only send the message when
the sensor value has gone out of limits set up for the application.
2. Minimize the receive window length of your radio in application testing. This window length can be
adjusted adaptively. The default is to use a narrow window and increase the window when packets are
missed as a result of receive timeout.
3. Use the built-in receive signal strength indicator (RSSI) feature of the radio to reduce the transmit power
or receive sensitivity in your point-to-point product so that the radio can dynamically adjust based on the
other devices operating in the vicinity of your radio. There is no need to increase your transmit power and
shout across the room when you can talk or whisper and get your message through the first time. The
difference in transmit mode current can be as much as 10 mA between using output levels of –12 dBm
and 0 dbm.
4. Use the lowest possible voltage setting. RF devices have reduced current draw at low voltages and use
the on-chip regulator with low quiescent current to maximize battery lifetime.
5. When you have data to send, use the FIFO buffer function of the RF-IC to store it. Use the buffer read/
write mode to minimize SPI operations. SPI communications consume power.
6. When you receive incoming messages, discard false packets that are not intended for your product possibly coming from another unwanted radio system. Minimize the time in RX processing false packets by
checking the carrier sense, valid preamble, valid sync word, valid byte length and valid address feature
options built into today’s radio technology. Once you have done that, wake up the MCU and use the automatic CRC check and discard the packet if the CRC fails. Interrupt the MCU if the CRC is okay.
7. Spend time selecting a crystal that takes into consideration clock drift between the two devices. Increased
drift means increased time in the receiver to ensure packet reception. The receiver must be turned early,
especially in polling mode architectures. The problem with turning on early means an increased probability
of receiving false packets that require additional receiver time where we are driving to maximum sleep
time for battery life.
8. Spend time squeezing every possible electron from transition states of the radio. For example, spend time
drilling into the state diagrams of the data sheet. Develop a power budget spreadsheet which includes the
typical values for power-down, crystal oscillator start-up, PLL start-up, full TX_RX time and power-down
for your application. For two-way protocols, go as quickly as possible from transmit to receive mode or
vice-versa.
With TI’s CC430 platform, the combination of the power-efficient, highly functional MSP430F5xx MCU
and a TI low-power RF transceiver on a single chip offers a unique low-power/performance mix and high
Energy Harvesting
April 2010
6
Texas Instruments
integration to help break down barriers to RF implementation such as stringent power, performance, size and
cost requirements helping bring wireless connectivity to new applications.
Integration adds
value
From an IC architecture perspective, integration is almost always a good thing. With ULP designs, the benefits
are particularly helpful. Of the five important components of a harvesting system – conversion, temporary
storage, power management circuits, analog converters and ULP MCUs – the last four are the most likely first
step toward high integration.
In fact, TI’s MSP430 MCU family already integrates many high-performance analog and controller functions
needed for energy-harvesting applications. The addition of power management and the radio circuits are all
that is required – and that formula is exactly what TI’s new CC430 platform will deliver.
The full MSP430 MCU peripheral set will be available on the CC430 devices including intelligent, highperformance digital and analog peripherals like a 12-bit ADC, and comparators that provide high performance
even during RF transmissions and consume no power when not in operation. These peripherals also speed
design by integrating functions such as an integrated Advanced Encryption Standard (AES) accelerator that
encrypts and decrypts data sent wirelessly for more secure alarm and industrial monitoring systems.
With a 50 percent reduction in printed circuit board (PCB) space, CC430-based devices help enable
smaller devices in a wide variety of wireless applications. Examples may include smart hospital tracking that
can communicate patient or medical equipment information to a central location or personal area networking
between sports watches, pedometers, chest-strap heart-rate monitors and PC-based health and fitness analysis programs. Smaller board space and reduced complexity also help shrink the size of heat-cost allocators
and AMI smart metering systems, which are expected to make up 28 percent of all electric meters by 2013.
In addition to delivering low-power advantages, integration also reduces package size and cost which is a
high priority for small sensor applications that might be deployed, for example, in a mesh network or some
other “network of things” – for example, innovative RF sensor networks that report data to a central collection to analyze and regulate information such as smoke in the atmosphere to detect forest fires, moisture or
pesticide information in crop fields or even humidity levels in a winery.
According to the ARC Advisory Group, the worldwide market for industrial applications of wireless technology will grow at a 32 percent compound annual growth rate (CAGR) over the next five years, and is projected
to exceed U.S. $1 billion in 2010.
A major stumbling block to date in deploying wireless technology in industrial settings has always been
powering the radio and the application circuits. Both installation and periodic maintenance have been identified as being problematic. If line power has to be extended to the application, the value of wireless communication is reduced. If batteries are used, they have to be replaced from time to time.
Energy Harvesting
April 2010
Texas Instruments 7
The combination of ULP and micro-harvesting is likely to be the most cost-sensitive, sensible approach
to addressing these challenges; the CC430 technology platform is an ideal solution to provide the microharvesting and ULP needed for these applications. Sensing applications are limitless, power supplies are not;
solutions like the CC430 platform that combine low power and high functionality with the know-how to take
the mystery out of RF design help bridge this gap to help usher in a new age of energy solutions.
For further information on energy harvesting technology, please see
www.ti.com/energyharvesting.
Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard terms and
conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no liability for applications assistance, customer’s applications or product designs, software performance, or infringement of patents. The publication of information regarding any other company’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
All trademarks are the property of their respective owners.
© 2010 Texas Instruments Incorporated
SLYY018A
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated