ASMT-Mx6x & ASMT-MxHx MoonstoneTM ½W Power LED Light Source Data Sheet Description Features ½W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. Option with electrically isolated metal slug is also available • Available in Cool White and Warm White color The Cool White Power LED is available in various color temperature ranging from 4000K to 10000K and Warm White Power LED ranging from 2600K to 4000K. • Available in diffuse and non-diffuse version • Available in both electrical isolated and non-isolated metal slug • Energy efficient • Exposed pad for excellent heat transfer • Suitable for reflow soldering process The low profile package design is suitable for a wide variety of applications especially where height is a constraint. • High current operation The package is compatible with reflow soldering. This will give more freedom and flexibility to the light source designer. • Wide viewing angle Applications • Long operation life • Silicone encapsulation • ESD HBM Class 3B, > 8000 • MSL 4 products • Sign backlight • High junction temperature of 145°C • Safety, exit and emergency sign lightings Specifications • Specialty lighting such as task lighting and reading lights • Retail display • Commercial lighting • Accent or marker lightings, strip or step lightings • InGaN Technology • 3.5V, 150mA (typical) • 110 viewing angle Package Dimensions 1 ANODE 2 CATHODE 3 Heatsink (2 options) a. Electrically Isolated b. Electrically non-isolated 10.00 3.30 1.27 8.50 METAL SLUG 3 5.26 10.60 8.50 8.00 1.30 5.25 1 2 2.00 0.81 5.08 LED NOTES: 1. ALL DIMENSIONS IN MILLIMETERS. 2. TOLERANCE IS ± 0.1 mm UNLESS OTHERWISE SPECIFIED. Notes: 1. All dimensions in millimeters. 2. Tolerance is ± 0.1 mm unless otherwise specified. + ZENER – Device Selection Guide at Junction Temperature Tj = 25°C Luminous Flux, Φv[1,2] (lm) Color Part Number Min Typ Max Test Current (mA) Cool White ASMT-MW60 19.5 30 43.0 150 Non-isolated InGaN Warm White ASMT-MY60 15 25 33 150 Non-isolated InGaN Cool White Diffuse ASMT-MWH0 15 25 43.0 150 Non-isolated InGaN Warm White Diffuse ASMT-MYH0 11.5 20 33 150 Non-isolated InGaN Cool White ASMT-MW62 19.5 30 43.0 150 Isolated InGaN Warm White ASMT-MY62 15 25 33 150 Isolated InGaN Cool White Diffuse ASMT-MWH2 15 25 43.0 150 Isolated InGaN Warm White Diffuse ASMT-MYH2 11.5 20 33 150 Isolated InGaN Notes: 1. ΦV is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux tolerance is ±10 % Part Numbering System ASMT – M x x x – N x1 x2 x3 x4 Packing Option 0 – Tube 1 – Tape & reel Color Bin Selection Max Flux Bin Selection Min Flux Bin Selection 0 – Electrically non-isolated Metal Slug 2 – Electrically Isolated Metal Slug 6 – Clear H – Di use Color W – Cool White Y – Warm White Metal Slug Dice Technology Absolute Maximum Ratings at TA = 25°C Parameter ASMT-Mx60 Units DC Forward Current [1] 150 mA Peak Pulsing Current [2] 300 mA Power Dissipation 525 mW LED Junction Temperature 145 °C Operating Ambient Temperature Range -40 to +120 °C Storage Temperature Range -40 to +120 °C Notes: 1. DC forward current – derate linearly based on Figure 5. 2. Pulse condition duty factor = 10%, Frequency = 1kHz Optical Characteristics (TA = 25°C) Correlated Color Temperature, CCT (Kelvin) Viewing Angle 2θ½ [1] (Degrees) Luminous Efficiency (lm/W) Part Number Color Min Max Typ Typ ASMT-MW6x Cool White 4000 10000 110 57 ASMT-MY6x Warm White 2600 4000 110 48 ASMT-MWHx Cool White Diffuse 4000 10000 120 48 ASMT-MYHx Warm White Diffuse 2600 4000 120 38 Notes: 1. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristic (TA = 25°C) Forward Voltage VF (Volts) @ IF = 150mA Reverse Voltage VR (Volts) Thermal Resistance Rθj-ms (°C/W)[1] Dice Type Typ. Max. Max. Typ. InGaN 3.5 4.0 5 27 Note: 1. Rθj-ms is Thermal Resistance from LED junction to metal slug. 200 COOL WHITE DIFFUSED WARM WHITE DIFFUSED COOL WHITE WARM WHITE 0.9 RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 175 150 FORWARD CURRENT - mA 1.0 0.1 100 75 50 25 0.0 380 430 480 530 580 630 WAVELENGTH - nm 680 730 0.50 1.00 3.50 4.00 70 90 0.9 RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 COOL WHITE DIFFUSED WARM WHITE DIFFUSED COOL WHITE WARM WHITE 0.3 0.2 0.1 0 20 40 60 80 100 120 140 160 180 0.0 200 -90 -70 -50 Figure 4. Radiation Pattern 180 150 R JA = 140°C/W 120 R JA = 120°C/W R JA = 100°C/W 90 60 30 0 10 20 30 40 50 60 TA AMBIENT TEMPERATURE - °C 70 80 90 Figure 5. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 145°C, RθJA = 100°C/W, 120°C/W and 140°C/W 350 8.40 ± 0.10 17.00 ± 0.20 WARD VOLTAGE SHIFT (mV) 10.70 ± 0.10 -30 -10 10 OFF-AXIS ANGLE(°) Figure 3. Relative Luminous Flux vs. Mono Pulse Current IF MAX FORWARD CURRENT - mA 3.00 1.0 MONO PULSE CURRENT - mA 0 1.50 2.00 2.50 FORWARD VOLTAGE - V Figure 2. Forward Current vs Forward Voltage 1.30 1.20 1.10 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 0 0.00 780 Figure 1. Relative Intensity vs. Wavelength RELATIVE LUMINOUS FLUX (Φv) - lm 125 300 250 200 150 100 50 0 -50 30 50 0 20 30 40 50 60 TA AMBIENT TEMPERATURE - °C 70 80 90 350 RELATIVE FORWARD VOLTAGE SHIFT (mV) 10.70 ± 0.10 TEMPERATURE 10 to 30 SEC. /W 217 °C 200 °C 255 - 260 °C 3°C/SEC. MAX. 8.40 ± 0.10 -6°C/SEC. MAX. 150 °C 17.00 ± 0.20 3 °C/SEC. MAX. 1.00 ± 0.10 100 SEC. MAX. 60 - 120 SEC. 3.1 ± 0.10 80 TIME 90 (Acc. to J-STD-020C) 5.08 ± 0.10 0.10 Figure 7. Recommended soldering land pattern 350 100 300 250 200 150 100 50 0 90 -50 -100 -150 -200 -250 -300 -40 80 RELATIVE LOP (%) RELATIVE FORWARD VOLTAGE SHIFT (mV) Figure 6. Recommended Reflow Soldering 0.10 -15 10 35 Figure 8. Temperature vs. relative forward voltage shift Flux Bin Limit[1] (For reference only) [X1 X2] Flux (lm) at 150mA 135 145 Bin Min Max A 5.5 7.0 B 7.0 9.0 C 9.0 11.5 D 11.5 15.0 E 15.0 19.5 F 19.5 25.5 G 25.5 33.0 H 33.0 43.0 Tolerance for each bin limits is ±10 % 70 60 50 40 30 ½W COOL WHITE 20 ½W WARM WHITE 10 TEMPERATURE - °C E 25 10 60 85 0 25 35 45 55 65 75 85 95 105 JUNCTION TEMPERATURE (°C) 115 125 Figure 9. Relative LOP vs Junction Temperature for InGaN Devices 135 145 300 250 200 150 100 50 0 -50 -100 -150 -200 -250 -300 -40 Color Bin Selections [X3] Individual reel will contain parts from one full bin only. Cool White Warm White 0 Full Distribution 0 Full Distribution A A only A A only B B only B B only C C only C C only D D only D D only E E only E E only F F only F F only G G only Z A and B only H H only Y B and C only Z A and B only W C and D only Y B and C only V D and E only W C and D only U E and F only V D and E only Q A, B and C only U E and F only P B, C and D only T F and G only N C, D and E only S G and H only M D, E and F only Q A, B and C only J Special Color Bin P B, C and D only 1 A, B, C and D only N C, D and E only 2 E, F, G and H only M D, E and F only 3 B, C, D and E only L E, F and G only 4 C, D, E and F only K F, G and H only 5 A, B, C, D and E only J Special Color Bin 6 B, C, D, E, and F only 1 A, B, C and D only 2 E, F, G and H only 3 B, C, D and E only 4 C, D, E and F only 5 A, B, C, D and E only 6 B, C, D, E, and F only Primary Color Binning Cool White Color Limits (Chromaticity Coordinates) Bin A X Y 0.367 0.400 0.362 0.372 0.329 0.345 0.329 0.369 Warm White Color Limits (Chromaticity Coordinates) Bin A X Y 0.452 0.434 0.488 0.447 0.470 0.414 0.438 0.403 Bin B X Y 0.362 0.372 0.356 0.330 0.329 0.302 0.329 0.302 Bin B X Y 0.438 0.403 0.470 0.414 0.452 0.384 0.424 0.376 Bin C X Y 0.329 0.369 0.329 0.345 0.305 0.322 0.301 0.342 Bin C X Y 0.407 0.393 0.418 0.422 0.452 0.434 0.438 0.403 Bin D X Y 0.329 0.345 0.329 0.302 0.311 0.285 0.305 0.322 Bin D X Y 0.395 0.362 0.407 0.393 0.438 0.403 0.424 0.376 Bin E X Y 0.303 0.333 0.307 0.311 0.283 0.284 0.274 0.301 Bin E X Y 0.381 0.377 0.387 0.404 0.418 0.422 0.407 0.393 Bin F X Y 0.307 0.311 0.311 0.285 0.290 0.265 0.283 0.284 Bin F X Y 0.373 0.349 0.381 0.377 0.407 0.393 0.395 0.362 Bin G X Y 0.388 0.417 0.379 0.383 0.362 0.372 0.367 0.400 Bin H X Y 0.379 0.383 0.369 0.343 0.356 0.330 0.362 0.372 Tolerances ± 0.01 Tolerances ± 0.01 0.48 0.46 G 0.38 A 4.0k 0.36 4.5k C H B 0.34 5.6k 0.32 Black Body Curve 7k D E 0.30 F 10k 0.28 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 X - COORDINATE Y - COORDINATE Y - COORDINATE 0.44 0.42 0.40 0.44 A 0.42 C 0.40 0.38 0.36 E 4.0k F 3.5k D 3.0k B 2.6k Black Body Curve 0.34 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 X - COORDINATE Sub-Color Binning (Only Applicable for Color Bin A to Bin D and Bin G to Bin H) Color Limits Cool White Color Limits (Chromaticity Coordinates) Bin A1 X Y 0.364 0.383 0.367 0.400 0.348 0.385 Bin A2 X Y 0.364 0.383 0.362 0.372 Bin A3 X Y 0.329 0.357 Bin A4 X Y Bin B1 Cool White Color Limits (Chromaticity Coordinates) 0.347 0.372 Bin D1 X Y 0.329 0.345 0.329 0.331 0.317 0.320 0.316 0.333 0.346 0.359 0.347 0.372 Bin D2 X Y 0.329 0.331 0.329 0.320 0.318 0.310 0.317 0.320 0.329 0.369 0.348 0.385 0.347 0.372 Bin D3 X Y 0.329 0.320 0.329 0.302 0.320 0.293 0.318 0.310 0.329 0.345 0.329 0.357 0.347 0.372 0.346 0.359 Bin D4 X Y 0.316 0.333 0.317 0.320 0.307 0.311 0.305 0.322 X Y 0.362 0.372 0.360 0.357 0.344 0.344 0.346 0.359 Bin D5 X Y 0.317 0.320 0.318 0.310 0.309 0.300 0.307 0.311 Bin B2 X Y 0.360 0.357 0.358 0.343 0.343 0.331 0.344 0.344 Bin D6 X Y 0.318 0.310 0.320 0.293 0.311 0.285 0.309 0.300 Bin B3 X Y 0.358 0.343 0.356 0.330 0.341 0.314 0.343 0.331 Bin G1 X Y 0.392 0.421 0.386 0.400 0.364 0.383 0.367 0.400 Bin B4 X Y 0.329 0.331 0.329 0.345 0.346 0.359 0.344 0.344 Bin G2 X Y 0.386 0.400 0.382 0.385 0.362 0.372 0.364 0.383 Bin B5 X Y 0.329 0.331 0.344 0.344 0.343 0.331 0.329 0.320 Bin H1 X Y 0.382 0.385 0.378 0.370 0.360 0.357 0.362 0.372 Bin B6 X Y 0.343 0.331 0.341 0.314 0.329 0.302 0.329 0.320 Bin H2 X Y 0.378 0.370 0.375 0.358 0.358 0.343 0.360 0.357 Bin C1 X Y 0.329 0.369 0.329 0.357 0.315 0.344 0.314 0.355 Bin H3 X Y 0.375 0.358 0.371 0.344 0.356 0.330 0.358 0.343 Bin C2 X Y 0.329 0.357 0.329 0.345 0.316 0.333 0.315 0.344 Bin C3 X Y 0.314 0.355 0.315 0.344 0.303 0.333 0.301 0.342 Bin C4 X Y 0.315 0.344 0.316 0.333 0.305 0.322 0.303 0.333 Tolerances ± 0.01 0.44 0.42 0.40 G1 0.38 Y - COORDINATE G2 A1 A3 0.36 C3 0.34 C4 0.32 7k A4 C2 B4 5.6k B5 D1 D2 D4 0.30 C1 D5 D6 H1 A2 B1 B2 4.5k 4.0k H2 H3 Black Body Curve B3 B6 D3 10k 0.28 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 X - COORDINATE 0.36 0.38 0.40 0.42 0.44 Package Tube – Option 0 1.00 5.80 4.65 5.50 37.00 5.45 10.10 8.30 535.00 TOP VIEW FRONT VIEW Tape & Reel – Option 1 END START Dim Value AO 8.80±0.10 BO 16.45±0.10 KO 3.60±0.10 W 24.0±0.10 P 16.0±0.10 Qty/Reel 250EA Unit: mm THERE SHALL BE A MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. 10 MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 390 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Reel Dimension Handling Precaution: The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body (white epoxy). DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. AV02-1319EN - July 2, 2008