Features • Fast Read Access Time - 45 ns • Low-Power CMOS Operation • • • • • • • – 100 µA max. Standby – 20 mA max. Active at 5 MHz JEDEC Standard Packages – 28-Lead 600-mil PDIP – 32-Lead PLCC – 28-Lead TSOP and SOIC 5V ± 10% Supply High Reliability CMOS Technology – 2,000V ESD Protection – 200 mA Latchup Immunity Rapid™ Programming Algorithm - 100 µs/byte (typical) CMOS and TTL Compatible Inputs and Outputs Integrated Product Identification Code Commercial, Industrial and Automotive Temperature Ranges 256K (32K x 8) OTP EPROM AT27C256R Description The AT27C256R is a low-power, high-performance 262,144-bit one-time programmable read only memory (OTP EPROM) organized 32K by 8 bits. It requires only one 5V power supply in normal read mode operation. Any byte can be accessed in less than 45 ns, eliminating the need for speed reducing WAIT states on high-performance microprocessor systems. Atmel’s scaled CMOS technology provides low-active power consumption, and fast programming. Power consumption is typically only 8 mA in Active Mode and less than 10 µA in Standby. (continued) PDIP, SOIC Top View Pin Configurations Pin Name Function A0 to A14 Addresses O0 - O7 Outputs CE Chip Enable OE Output Enable NC No Connect VPP A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC A14 A13 A8 A9 A11 OE A10 CE O7 O6 O5 O4 O3 256K EPROM PLCC Top View 29 28 27 26 25 24 23 22 21 14 15 16 17 18 19 20 5 6 7 8 9 10 11 12 13 A8 A9 A11 NC OE A10 CE O7 O6 O1 O2 GND NC O3 O4 O5 A6 A5 A4 A3 A2 A1 A0 NC O0 4 3 2 1 32 31 30 A7 A12 VPP NC VCC A14 A13 TSOP Top View Type 1 Note: PLCC Package Pins 1 and 17 are DON’T CONNECT. OE A11 A9 A8 A13 A14 VCC VPP A12 A7 A6 A5 A4 A3 22 23 24 25 26 27 28 1 2 3 4 5 6 7 21 20 19 18 17 16 15 14 13 12 11 10 9 8 A10 CE O7 O6 O5 O4 O3 GND O2 O1 O0 A0 A1 A2 Rev. 0014H–07/98 1 The AT27C256R is available in a choice of industry standard JEDEC-approved one time programmable (OTP) plastic DIP, PLCC, SOIC, and TSOP packages. All devices feature two-line control (CE, OE) to give designers the flexibility to prevent bus contention. With 32K byte storage capability, the AT27C256R allows firmware to be stored reliably and to be accessed by the system without the delays of mass storage media. Atmel’s 27C256R has additional features to ensure high quality and efficient production use. The Rapid™ Programming Algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 100 µs/byte. The Integrated Product Identification Code electronically identifies the device and manufacturer. This feature is used by industry standard programming equipment to select the proper programming algorithms and voltages. 2 AT27C256R System Considerations Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may exceed data sheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor should be connected between the V CC and Ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again connected between the VCC and Ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array. AT27C256R Block Diagram Absolute Maximum Ratings* Temperature Under Bias ................................ -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Minimum voltage is -0.6V dc which may undershoot to -2.0V for pulses of less than 20 ns.Maximum output pin voltage is VCC + 0.75V dc which may overshoot to +7.0 volts for pulses of less than 20 ns. Storage Temperature ..................................... -65°C to +150°C Voltage on Any Pin with Respect to Ground .........................................-2.0V to +7.0V(1) Voltage on A9 with Respect to Ground ......................................-2.0V to +14.0V(1) 1. VPP Supply Voltage with Respect to Ground .......................................-2.0V to +14.0V(1) Operating Modes Mode\Pin CE OE Ai VPP Outputs Read VIL VIL Ai VCC DOUT Output Disable VIL VIH X(1) VCC High Z (1) Standby Rapid Program (2) PGM Verify(2) Optional PGM Verify(2) (2) PGM Inhibit (1) VIH X X VCC High Z VIL VIH Ai VPP DIN VIL Ai VPP DOUT VIL Ai VCC DOUT VPP High Z VCC Identification Code X(1) VIL VIH VIH (1) X (3) Product Identification(4) Notes: VIL VIL A9 = VH A0 = VIH or VIL A1 - A14 = VIL 1. X can be VIL or VIH. 2. Refer to Programming Characteristics. 3. VH = 12.0 ± 0.5V. 4. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled low (VIL) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte. 3 DC and AC Operating Conditions for Read Operation AT27C256R -45 -55 -70 -90 -12 -15 0°C - 70°C 0°C - 70°C 0°C - 70°C 0°C - 70°C 0°C - 70°C 0°C - 70°C -40°C - 85°C -40°C - 85°C -40°C - 85°C -40°C - 85°C -40°C - 85°C -40°C - 85°C -40°C - 125°C -40°C - 125°C -40°C - 125°C -40°C - 125°C 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% Com. Operating Temp. (Case) Ind. Auto. 5V ± 10% VCC Supply 5V ± 10% DC and Operating Characteristics for Read Operation Symbol Parameter Condition ILI Input Load Current VIN = 0V to VCC ILO Output Leakage Current IPP1 (2) VPP (1) Read/Standby Current Min Max Units Com., Ind. ±1 µA Auto. ±5 µA Com., Ind. ±5 µA Auto. ±10 µA VPP = VCC 10 µA ISB1 (CMOS), CE = VCC ± 0.3V 100 µA ISB2 (TTL), CE = 2.0 to VCC + 0.5V 1 mA f = 5 MHz, IOUT = 0 mA, E = VIL 20 mA VOUT = 0V to VCC ISB VCC(1) Standby Current ICC VCC Active Current VIL Input Low Voltage -0.6 0.8 V VIH Input High Voltage 2.0 VCC + 0.5 V VOL Output Low Voltage IOL = 2.1 mA 0.4 V VOH Output High Voltage IOH = -400 µA Notes: 2.4 V 1. VCC must be applied simultaneously with or before VPP, and removed simultaneously with or after VPP.. 2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP.. AC Characteristics for Read Operation AT27C256R -45 Symbol Parameter (3) Condition -55 -70 -90 -12 -15 Min Max Min Max Min Max Min Max Min Max Min Max Units Address to Output Delay CE = OE = VIL 45 55 70 90 120 150 ns (2) CE to Output Delay OE = VIL 45 55 70 90 120 150 ns tOE(2)(3) OE to Output Delay CE = VIL 20 25 30 30 35 40 ns tDF(4)(5) OE or CE High to Output Float, whichever occurred first 20 20 25 25 30 35 ns tOH Output Hold from Address, CE or OE, whichever occurred first tACC tCE Note: 4 7 2, 3, 4, 5. - see AC Waveforms for Read Operation. AT27C256R 7 7 0 0 0 ns AT27C256R AC Waveforms for Read Operation(1) Notes: 1. Timing measurement reference level is 1.5V for -45 and -55 devices. Input AC drive levels are VIL = 0.0V and VIH = 3.0V. Timing measurement reference levels for all other speed grades are V OL = 0.8V and VOH = 2.0V. Input AC drive levels are VIL = 0.45V and VIH = 2.4V. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 3. OE may be delayed up to tACC - tOE after the address is valid without impact on tACC. 4. This parameter is only sampled and is not 100% tested. 5. Output float is defined as the point when data is no longer driven. Input Test Waveforms and Measurement Levels Output Test Load For -45 and -55 devices only: tR, tF < 5 ns (10% to 90%) For -70, -90, -12, and -15 devices: Note: CL = 100 pF including jig capacitance, except for the -45 and -55 devices, where CL = 30 pF. tR, tF < 20 ns (10% to 90%) Pin Capacitance (f = 1MHz, T = 25°C)(1) Typ Max Units CIN 4 6 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: Conditions 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. 5 Programming Waveforms(1) Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH. 2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer. 3. When programming the AT27C256R a 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage transients. DC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Limits Symbol Parameter Test Conditions ILI Input Load Current VIN = VIL,VIH VIL Input Low Level VIH Input High Level VOL Output Low Volt IOL = 2.1 mA VOH Output High Volt IOH = -400 µA ICC2 VCC Supply Current (Program and Verify) IPP2 VPP Current VID A9 Product Identification Voltage 6 AT27C256R Min Max Units ±10 µA -0.6 0.8 V 2.0 VCC + 1 V 0.4 V 2.4 CE = VIL 11.5 V 25 mA 25 mA 12.5 V AT27C256R AC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Limits (1) Symbol Parameter tAS Address Setup Time 2 µs tOES OE Setup Time 2 µs tDS Data Setup Time 2 µs tAH Address Hold Time Input Rise and Fall Times (10% to 90%) 20ns 0 µs tDH Data Hold Time Input Pulse Levels 2 µs tDFP OE High to Output Float Delay(2) tVPS VPP Setup Time tVCS VCC Setup Time tPW Test Conditions 0.45V to 2.4V Input Timing Reference Level 0.8V to 2.0V CE Program Pulse Width (3) (2) tOE Data Valid from OE tPRT VPP Pulse Rise Time During Programming Notes: Min Output Timing Reference Level 0.8V to 2.0V Max 0 Units 130 ns 2 µs 2 µs 95 105 µs 150 ns 50 ns 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP.. 2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven— see timing diagram. 3. Program Pulse width tolerance is 100 µsec ± 5%. Atmel’s 27C256R Integrated Product Identification Code Pins A0 O7 O6 O5 O4 O3 O2 O1 O0 Hex Data Manufacturer 0 0 0 0 1 1 1 1 0 1E Device Type 1 1 0 0 0 1 1 0 0 8C Codes 7 Rapid Programming Algorithm A 100 µs CE pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and VPP is raised to 13.0V. Each address is first programmed with one 100 µs CE pulse without verification. Then a verification/reprogramming loop is executed for each address. In the event a byte fails to pass verification, up to 10 successive 100 µs pulses are applied with a verification after each 8 AT27C256R pulse. If the byte fails to verify after 10 pulses have been applied, the part is considered failed. After the byte verifies properly, the next address is selected until all have been checked. VPP is then lowered to 5.0V and VCC to 5.0V. All bytes are read again and compared with the original data to determine if the device passes or fails. AT27C256R Ordering Information ICC (mA) tACC (ns) Active Standby Ordering Code Package 45 20 0.1 AT27C256R-45JC AT27C256R-45PC AT27C256R-45RC AT27C256R-45TC 32J 28P6 28R 28T Commercial (0°C to 70°C) 20 0.1 AT27C256R-45JI AT27C256R-45PI AT27C256R-45RI AT27C256R-45TI 32J 28P6 28R 28T Industrial (-40°C to 85°C) 20 0.1 AT27C256R-55JC AT27C256R-55PC AT27C256R-55RC AT27C256R-55TC 32J 28P6 28R 28T Commercial (0°C to 70°C) 20 0.1 AT27C256R-55JI AT27C256R-55PI AT27C256R-55RI AT27C256R-55TI 32J 28P6 28R 28T Industrial (-40°C to 85°C) 20 0.1 AT27C256R-70JC AT27C256R-70PC AT27C256R-70RC AT27C256R-70TC 32J 28P6 28R 28T Commercial (0°C to 70°C) 20 0.1 AT27C256R-70JI AT27C256R-70PI AT27C256R-70RI AT27C256R-70TI 32J 28P6 28R 28T Industrial (-40°C to 85°C) 20 0.1 AT27C256R-70JA AT27C256R-70PA AT27C256R-70RA 32J 28P6 28R Automotive (-40°C to 125°C) 55 70 Operation Range (continued) Package Type 32J 32-Lead, Plastic J-Leaded Chip Carrier (PLCC) 28P6 28-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 28R 28-Lead, 0.330" Wide, Plastic Gull Wing Small Outline (SOIC) 28T 28-Lead, Thin Small Outline Package (TSOP) 9 Ordering Information (Continued) ICC (mA) tACC (ns) Active Standby 90 20 120 150 Ordering Code Package 0.1 AT27C256R-90JC AT27C256R-90PC AT27C256R-90RC AT27C256R-90TC 32J 28P6 28R 28T Commercial (0°C to 70°C) 20 0.1 AT27C256R-90JI AT27C256R-90PI AT27C256R-90RI AT27C256R-90TI 32J 28P6 28R 28T Industrial (-40°C to 85°C) 20 0.1 AT27C256R-90JA AT27C256R-90PA AT27C256R-90RA 32J 28P6 28R Automotive (-40°C to 125°C) 20 0.1 AT27C256R-12JC AT27C256R-12PC AT27C256R-12RC AT27C256R-12TC 32J 28P6 28R 28T Commercial (0°C to 70°C) 20 0.1 AT27C256R-12JI AT27C256R-12PI AT27C256R-12RI AT27C256R-12TI 32J 28P6 28R 28T Industrial (-40°C to 85°C) 20 0.1 AT27C256R-12JA AT27C256R-12PA AT27C256R-12RA 32J 28P6 28R Automotive (-40°C to 125°C) 20 0.1 AT27C256R-15JC AT27C256R-15PC AT27C256R-15RC AT27C256R-15TC 32J 28P6 28R 28T Commercial (0°C to 70°C) 20 0.1 AT27C256R-15JI AT27C256R-15PI AT27C256R-15RI AT27C256R-15TI 32J 28P6 28R 28T Industrial (-40°C to 85°C) 20 0.1 AT27C256R-15JA AT27C256R-15PA AT27C256R-15RA 32J 28P6 28R Automotive (-40°C to 125°C) Package Type 32J 32-Lead, Plastic J-Leaded Chip Carrier (PLCC) 28P6 28-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 28R 28-Lead, 0.330" Wide, Plastic Gull Wing Small Outline (SOIC) 28T 28-Lead, Thin Small Outline Package (TSOP) 10 AT27C256R Operation Range AT27C256R Packaging Information 32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-016 AE 28P6, 28-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-011 AB .045(1.14) X 45° PIN NO. 1 IDENTIFY .553(14.0) .547(13.9) .595(15.1) .585(14.9) .032(.813) .026(.660) 1.47(37.3) 1.44(36.6) .025(.635) X 30° - 45° .012(.305) .008(.203) PIN 1 .566(14.4) .530(13.5) .530(13.5) .490(12.4) .021(.533) .013(.330) .090(2.29) MAX 1.300(33.02) REF .050(1.27) TYP .300(7.62) REF .430(10.9) .390(9.90) AT CONTACT POINTS .030(.762) .015(3.81) .095(2.41) .060(1.52) .140(3.56) .120(3.05) .022(.559) X 45° MAX (3X) .453(11.5) .447(11.4) .495(12.6) .485(12.3) 28R, 28-Lead, 0.330" Wide, Plastic Gull Wing Small Outline (SOIC) Dimensions in Inches and (Millimeters) .220(5.59) MAX .005(.127) MIN SEATING PLANE .065(1.65) .015(.381) .022(.559) .014(.356) .161(4.09) .125(3.18) .110(2.79) .090(2.29) .012(.305) .008(.203) .065(1.65) .041(1.04) .630(16.0) .590(15.0) 0 REF 15 .690(17.5) .610(15.5) 28T, 28-Lead, Plastic Thin Small Outline Package (TSOP) Dimensions in Millimeters and (Inches)* INDEX MARK AREA 11.9 (0.469) 11.7 (0.461) 13.7 (0.539) 13.1 (0.516) 0.27 (0.011) 0.18 (0.007) 0.55 (0.022) BSC 7.15 (0.281) REF 8.10 (0.319) 7.90 (0.311) 1.25 (0.049) 1.05 (0.041) 0.20 (0.008) 0.10 (0.004) 0 5 REF 0.20 (0.008) 0.15 (0.006) 0.70 (0.028) 0.30 (0.012) *Controlling dimension: millimeters 11 Atmel Headquarters Atmel Operations Corporate Headquarters Atmel Colorado Springs 2325 Orchard Parkway San Jose, CA 95131 TEL (408) 441-0311 FAX (408) 487-2600 Europe 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL (719) 576-3300 FAX (719) 540-1759 Atmel Rousset Atmel U.K., Ltd. Coliseum Business Centre Riverside Way Camberley, Surrey GU15 3YL England TEL (44) 1276-686677 FAX (44) 1276-686697 Zone Industrielle 13106 Rousset Cedex, France TEL (33) 4 42 53 60 00 FAX (33) 4 42 53 60 01 Asia Atmel Asia, Ltd. Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon, Hong Kong TEL (852) 27219778 FAX (852) 27221369 Japan Atmel Japan K.K. Tonetsu Shinkawa Bldg., 9F 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581 Fax-on-Demand North America: 1-(800) 292-8635 International: 1-(408) 441-0732 e-mail [email protected] Web Site http://www.atmel.com BBS 1-(408) 436-4309 © Atmel Corporation 1998. Atmel Cor poration makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s website. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual proper ty of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life suppor t devices or systems. Marks bearing ® and/or ™ are registered trademarks and trademarks of Atmel Corporation. Terms and product names in this document may be trademarks of others. Printed on recycled paper. 0014H–07/98/xM