ETC 80SQ045N/D

80SQ045N
Preferred Device
Axial Lead Rectifier
. . . employing the Schottky Barrier principle in a large area
metal–to–silicon power diode. State–of–the–art geometry features
epitaxial construction with oxide passivation and metal overlap
contact. Ideally suited for use as rectifiers in low–voltage,
high–frequency inverters, free wheeling diodes, and polarity
protection diodes.
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SCHOTTKY BARRIER
RECTIFIER
8.0 AMPERES
High Current Capability
Low Stored Charge, Majority Carrier Conduction
Low Power Loss/High Efficiency
Highly Stable Oxide Passivated Junction
Guard–Ring for Stress Protection
Low Forward Voltage
High Surge Capacity
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 1.1 gram (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
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AXIAL LEAD
CASE 267–03
STYLE 1
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
220°C Max. for 10 Seconds, 1/16″ from case
Shipped in plastic bags, 500 per bag
Available Tape and Reeled, 1500 per reel, by adding a “RL’’ suffix to
the part number
Polarity: Cathode indicated by Polarity Band
ESD Protection: Human Body Model > 4000 V (Class 3)
ESD Protection: Machine Model > 400 V (Class C)
MARKING DIAGRAM
80SQ045N
80SQ045N= Device Code
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
VRRM
VRWM
VR
45
V
Average Rectified Forward Current
TL = 75°C (PsiJL = 12°C/W,
P.C. Board Mounting, see Note 2.)
IO
8.0
Non–Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, Single
Phase, 60 Hz)
IFSM
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Operating and Storage Junction
Temperature Range
(Reverse Voltage Applied)
Voltage Rate of Change (Rated VR)
 Semiconductor Components Industries, LLC, 2001
March, 2001 – Rev. 0
ORDERING INFORMATION
Device
Package
Shipping
80SQ045N
Axial Lead
500 Units/Bag
A
80SQ045NRL
Axial Lead
1500/Tape & Reel
140
A
Preferred devices are recommended choices for future use
and best overall value.
TJ, Tstg
–65 to +125
°C
dv/dt
10
V/ns
1
Publication Order Number:
80SQ045N/D
80SQ045N
THERMAL CHARACTERISTICS
Characteristic
Symbol
0.9 in x 0.9 in
Copper Pad Size
6.75 in x 6.75 in
Copper Pad Size
Unit
RθJL
13
12
°C/W
RθJA
50
40
Thermal Resistance – Junction–to–Lead
(See Note 2. – Mounting Data)
Thermal Resistance – Junction–to–Ambient
(See Note 2. – Mounting Data)
ELECTRICAL CHARACTERISTICS (TL = 25°C unless otherwise noted)
Symbol
Characteristic
Maximum Instantaneous Forward Voltage (Note 1.)
(iF = 8.0 Amps, TL = 25°C)
vF
Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 1.)
TL = 25°C
TL = 100°C
iR
Max
Unit
V
0.55
mA
1.0
50
1. Pulse Test: Pulse Width = 300 µs, Duty Cycle = 2.0%.
30
IF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
30
10
100°C
1
0.1
75°C
125°C
25°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
VF, INSTANTANEOUS VOLTAGE (VOLTS)
10
MBR845
1
0.1
0.8
100°C
25°C
0.1
IR, INSTANTANEOUS REVERSE CURRENT (AMPS)
Figure 1. Typical Forward Voltage
0.2
0.3
0.4
0.5
0.6
0.7
VF, INSTANTANEOUS VOLTAGE (VOLTS)
0.8
Figure 2. Maximum Forward Voltage
10,000
1E–01
C, CAPACITANCE (pF)
125°C
1E–02
100°C
75°C
1E–03
1E–04
25°C
1E–05
1E–06
75°C
125°C
f = 1 MHz
TJ = 25°C
1000
100
0
5
10 15 20
25 30 35 40
VR, REVERSE VOLTAGE (VOLTS)
45
50
0.1
Figure 3. Typical Reverse Current
1
10
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Typical Capacitance
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2
100
75
9
70
8
IF, AVERAGE FORWARD
CURRENT (AMPS)
COPPER AREA (sq in)
80SQ045N
65
60
55
50
See Note 2.
45
40
dc
RJL = 12°C/W
7
6
SQUARE
WAVE
5
4
3
2
1
35
0
30
0
2
6
4
8
0
10
20
60
40
80
100
120
RJA (°C/W)
TL, LEAD TEMPERATURE (°C)
Figure 5. RJA versus Copper Area
Figure 6. Current Derating – Lead
140
4.5
NOTE 2. — MOUNTING DATA
PFO, AVERAGE POWER
DISSIPATION (WATTS)
4
3.5
Mounting Method
SQUARE
WAVE
3
TJ = 125°C
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
2.5
dc
2
1.5
1
0.5
0
0
2
4
6
10
8
IO, AVERAGE FORWARD CURRENT (AMPS)
r(t), NORMALIZED EFFECTIVE TRANSIENT
THERMAL RESISTANCE
Figure 7. Forward Power Dissipation
1
P.C. Board with 6.75 sq. in.
copper surface.
L = 3/8
Board Ground Plane
D = 0.5
0.2
0.1
0.1
0.05
P(pk)
0.01
Copper Area = 0.271 sq. in.
0.01
0.001
0.0001
t1
RJA = 61.8 °C/W
SINGLE PULSE
0.001
0.01
0.1
1.0
t, TIME (sec)
Figure 8. Thermal Response, Junction–to–Ambient
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3
t2
DUTY CYCLE, D = t1/t2
10
100
1000
80SQ045N
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 267–03
ISSUE G
K
D
A
1
2
B
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
D
K
INCHES
MIN
MAX
0.370
0.380
0.190
0.210
0.048
0.052
1.000
---
MILLIMETERS
MIN
MAX
9.40
9.65
4.83
5.33
1.22
1.32
25.40
---
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
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4
80SQ045N/D