ETC EDI8G32259V-MN

EDI8F32259V
256Kx32 Static RAM CMOS, High Speed Module
FEATURES
DESCRIPTION
n 256Kx32 bit CMOS Static RAM
The EDI8F32259V is a high speed 8Mb Static RAM module
organized as 256K words by 32 bits. This module is constructed
from eight 256Kx4 Static RAMs in SOJ packages on an epoxy
laminate (FR4) board.
• Access Times: 12, 15, 20, and 25ns
• Individual Byte Selects
• Fully Static, No Clocks
Four chip enables (EØ-E3) are used to independently enable the
four bytes. Reading or writing can be executed on individual
bytes or any combination of multiple bytes through proper use of
selects.
• TTL Compatible I/O
n High Density Package with JEDEC Standard Pinouts
• 72 Pin SIMM No. 175 (Angle)
The EDI8F32259V is offered in 72 pin ZIP/SIMM package which
enables eight megabits of memory to be placed in less than 1.3
square inches of board space.
• 72 Pin ZIP No. 176
• 72 Pin SIMM, No. 354 (Straight)
All inputs and outputs are TTL compatible and operate from a
single 3.3V supply. Fully asynchronous circuitry requires no
clocks or refreshing for operation and provides equal access and
cycle times for ease of use.
n Single +3.3V (±10%) Supply Operation
The ZIP and SIMM modules contain four PD (Presence Detect)
pins which are used to identify module memory density in applications where alternate modules can be interchanged.
FIG. 1
PIN NAMES
PIN CONFIGURATIONS AND BLOCK DIAGRAM
AØ-A17
Address Inputs
EØ-E3
Chip Enables
W,
Write Enables
G
Output Enable
DQØ-DQ31
Common Data Input/Output
VCC
Power (3.3V±10%)
VSS
Ground
0
PD 1,2 = VSS
PD 3,4 = Open
Oct. 2002 Rev. 0A
ECO #15735
1
White Electronic Designs Corporation • (508) 366-5151 • www.whiteedc.com
EDI8F32259V
ABSOLUTE MAXIMUM RATINGS*
Voltage on any pin relative to VSS
Operating Temperature TA (Ambient)
Commercial
Storage Temperature, Plastic
Power Dissipation
Output Current
RECOMMENDED DC OPERATING CONDITIONS
-0.5V to 4.6V
Parameter
Supply Voltage
Supply Voltage
Input High Voltage
Input Low Voltage
0°C to +70°C
-55°C to +125°C
2.5 Watts
20 mA
*Stress greater than those listed under "Absolute Maximum Ratings" may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions greater than those indicated in the
operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
Sym
VCC
VSS
VIH
VIL
Min
3.0
0
2.2
-0.3
Typ
3.3
0
---
Max
Units
3.6
V
0
V
VCC+0.3V V
0.8
V
AC TEST CONDITIONS
Input Pulse Levels
Input Rise and Fall Times
Input and Output Timing Levels
Output Load
VSS to 3.0V
5ns
1.5V
1TTL, CL = 30pF
(note: For TEHQZ,TGHQZ and TWLQZ, CL = 5pF)
DC ELECTRICAL CHARACTERISTICS
Parameter
Sym
Conditions
Min
Operating Power Supply Current
Standby (TTL) Power Supply Current
Full Standby Power Supply Current
CMOS
Input Leakage Current
Output Leakage Current
Output High Voltage
Output Low Voltage
ICC1
ICC2
ICC3
W, E = VIL, II/O = 0mA, Min Cycle
E ³ VIH, VIN £ VIL or VIN ³ VIH
E ³ VCC-0.2V
VIN ³ VCC-0.2V or VIN £ 0.2V
VIN = 0V to VCC
V I/O = 0V to VCC
IOH = -4.0mA
IOL = 8.0mA
Max
12-25
800
240
40
Units
ns
mA
mA
mA
--2.4
—
±80
±20
—
0.4
µA
µA
V
V
ILI
ILO
VOH
VOL
CAPACITANCE
TRUTH TABLE
E
H
L
L
L
W
X
H
L
H
G
X
L
X
H
Mode
Standby
Read
Write
Output Deselect
Output
HIGH Z
DOUT
DIN
HIGH Z
(f=1.0MHz, VIN=VCC or VSS)
Power
ICC3
ICC1
ICC1
ICC1
Parameter
Address Lines
Data Lines
Chip Enable Line
Write Control Line
Sym
CI
CD/Q
CC
CN
Max
60
20
20
60
Unit
pF
pF
pF
pF
These parameters are sampled, not 100% tested.
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Oct. 2002 Rev. 0A
ECO #15735
EDI8F32259V
AC CHARACTERISTICS READ CYCLE
Parameter
Symbol
JEDEC Alt.
12ns
Min Max
15ns
Min Max
Min
Read Cycle Time
TAVAV
12
15
20
TRC
20ns
Max
25ns
Min Max
25
Units
ns
Address Access Time
TAVQV
TAA
12
15
20
25
ns
Chip Enable Access
TELQV
TACS
12
15
20
25
ns
Chip Enable to Output in Low Z (1)
TELQX
TCLZ
Chip Disable to Output in High Z (1)
TEHQZ TCHZ
9
ns
Output Hold from Address Change
TAVQX
TOH
Output Enable to Output Valid
TGLQV
TOE
Output Enable to Output in Low Z (1)
TGLQX
TOLZ
Output Disable to Output in High Z (1)
TGHQZ TOHZ
3
3
6
3
3
7
3
6
0
3
7
0
6
3
9
3
9
0
7
ns
ns
9
0
9
ns
ns
9
ns
Note 1: Parameter guaranteed, but not tested.
FIG. 2
READ CYCLE 1 - W HIGH, G, E LOW
TAVAV
A
ADDRESS 1
ADDRESS 2
TAVQV
TAVQX
Q
DATA 1
DATA 2
FIG. 3
READ CYCLE 2 - W HIGH
TAVAV
A
TAVQV
E
TELQV
TEHQZ
TELQX
G
TGLQV
TGHQZ
TGLQX
Q
Oct. 2002 Rev. 0A
ECO #15735
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White Electronic Designs Corporation • (508) 366-5151 • www.whiteedc.com
EDI8F32259V
AC CHARACTERISTICS WRITE CYCLE
Parameter
Symbol
JEDEC Alt.
12ns
Min Max
15ns
Min Max
Min
Write Cycle Time
TAVAV
TWC
12
15
20
25
ns
Chip Enable to End of Write
TELWH
TWLEH
TCW
TCW
8
8
9
9
10
10
10
10
ns
ns
Address Setup Time
TAVWL
TAVEL
TAS
TAS
0
0
0
0
0
0
0
0
ns
ns
Address Valid to End of Write
TAVWH
TAVEH
TAW
TAW
8
8
9
9
10
10
10
10
ns
ns
Write Pulse Width
TWLWH TWP
TELEH TWP
8
8
9
9
10
10
10
10
ns
ns
Write Recovery Time
TWHAX
TEHAX
TWR
TWR
0
0
0
0
0
0
0
0
ns
ns
Data Hold Time
TWHDX
TEHDX
TDH
TDH
3
3
3
3
3
3
3
3
ns
ns
6
0
7
0
20ns
Max
9
25ns
Min Max
0
9
Units
Write to Output in High Z (1)
TWLQZ TWHZ
0
Data to Write Time
TDVWH TDW
TDVEH TDW
6
6
7
7
8
8
8
8
ns
ns
ns
Output Active from End of Write (1)
TWHQX TWLZ
3
3
3
3
ns
Note 1: Parameter guaranteed, but not tested.
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Oct. 2002 Rev. 0A
ECO #15735
EDI8F32259V
WRITE CYCLE 1 - W CONTROLLED
TAVAV
A
E
TELWH
TWHAX
TAVWH
TWLWH
W
TAVWL
TDVWH
D
TWHDX
DATA VALID
TWHQX
TWLQZ
HIGH Z
Q
WRITE CYCLE 2 - E CONTROLLED
TAVAV
A
TAVEL
TELEH
E
TAVEH
TEHAX
TWLEH
W
TDVEH
D
Q
Oct. 2002 Rev. 0A
ECO #15735
TEHDX
DATA VALID
HIGH Z
5
White Electronic Designs Corporation • (508) 366-5151 • www.whiteedc.com
EDI8F32259V
ORDERING INFORMATION
Part Number
EDI8F32259V12MNC
EDI8F32259V15MNC
EDI8F32259V20MNC
EDI8F32259V25MNC
EDI8F32259V12MMC
EDI8F32259V15MMC
EDI8F32259V20MMC
EDI8F32259V25MMC
EDI8F32259V12MZC
EDI8F32259V15MZC
EDI8F32259V20MZC
EDI8F32259V25MZC
Speed
(ns)
12
15
20
25
12
15
20
25
12
15
20
25
Package
No.
176
176
176
176
354
354
354
354
175
175
175
175
Note: For Gold SIMM, Change from EDI8F to EDI8G.
PACKAGE DESCRIPTION
PACKAGE NO. 175: 72 PIN ZIP
NS
G
I
S
3.865 MAX.
DE
.360
W
.050
E
MAX.
N
R
FO
D
E
.590
.050
ND
MAX.
E
M
M
.175
O
P1
C
E
.125
R.020
.100
T
.250 TYP.
.100 TYP.
O
N
TYP.
.052 TYP.
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Oct. 2002 Rev. 0A
ECO #15735
EDI8F32259V
PACKAGE NO. 176: 72 PIN SIMM ANGLED
PACKAGE NO. 354: 72 PIN SIMM STRAIGHT
ALL DIMENSIONS ARE IN INCHES
Oct. 2002 Rev. 0A
ECO #15735
7
White Electronic Designs Corporation • (508) 366-5151 • www.whiteedc.com
DATASHEET APPROVALS
ECO# 15735
NEW REV 0A
EDI PART NO. EDI8F32259V
APPROVAL:
JUAN GUZMAN
INITIAL
DATE
DATE
11/4/02
CORRECTION ON PAGES
11/4/02
L.K.
11/6/02
MUKESH TRIVEDI M.A.
PAUL MARIEN
11/7/02
LARRY WINROTH
DAVE KELLY
MARK DOWNEY
DAVE HARRISON
TONY LEE
BOB KHEDERIAN
LUIS ESTELLA
YES
NO
WILL THIS DATASHEET GO ON THE WEB?
IS THIS A NEW DATASHEET?
WILL THIS DATASHEET REPLACE AN EXISTING
DATASHEET THAT’S ALREADY ON THE WEB?
LINE:________
FAMILY:____________
PROD.TYPE:________
ORG:___________
DENSITY:________
SPEED:__________
PKG:____________
VOLTAGE:________
IF YES, WHAT DATASHEET IS IT REPLACING?
WHAT SECTION SHOULD THIS DATASHEET BE
PLACED IN ON THE WEB?
AFTER REVIEWING OR MAKING CORRECTIONS ON THE DATASHEET (S)
PLEASE SIGN-OFF ON THIS SHEET AND ,MAKE YOUR CORRECTIONS –ON
THE ORIGINAL COPY(S).
AFTER REVIEWING THE DATA SHEET, TEST ENGINEERING WILL COMPLETE THE SECTION BELOW.
TEST PROGRAM CHANGE REQUIRED:
YES:_________NO____________DATE:___________
TEST ENGINEER SIGNATURE___________________
IF YES, DO NOT RELEASE DATA SHEET UNTIL TEST PROGRAM CHANGE IS COMPLETED.
TEST PROGRAM CHANGE COMPLETION DATE:__________
TEST PROGRAM NAME AND REVISION_________________
TEST ENGINEER SIGNATURE__________________________
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