RF3334 RF3334IF Low Noise Amplifier/Mixer IF LOW NOISE AMPLIFIER/MIXER 30dB RF Gain Control 40dB IF Gain Control 5dB Max. Noise Figure SSB RFIN 2 LNA Input Internally Matched to 75Ω GND 3 LOB LO 14 13 RFDEC 1 12 RFAGC 11 MIXLOAD 10 MIXLOADB Single 5V Supply IF AMP IFVCC 4 Cable Set Top Box General Purpose Downconverter Commercial and Consumer Systems 5 6 7 8 IFOUTB 9 GND IFOUT Applications 15 IFSETB 16 IFSET GND Features RFVCC RoHS Compliant & Pb-Free Product Package Style: QFN, 16-Pin, 4 x 4 Functional Block Diagram Product Description The RF3334 is an IF LNA/Mixer suitable for downconversion of forward channel control data in a set-top box application. It consists of a single-ended 75Ω terminated LNA, followed by a differential gain control stage with 30dB of analog gain control and a double-balanced mixer. The mixer load is available via pins 10 and 11 should an external filter be required. The mixer output is connected to an IF amplifier that can be configured from 10dB to 40dB gain with an external resistor. The amplifier is capable of 6V pk-pk output into a 1kΩ load. Ordering Information RF3334 RF3334PCBA-41X LNA Mixer Fully Assembled Evaluation Board Optimum Technology Matching® Applied GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS 9Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc. Rev A6 DS061016 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 1 of 12 RF3334 Absolute Maximum Ratings Parameter Supply Voltage IF Input Level Rating Unit -0.5 to 7.0 VDC 500 mVpp Operating Ambient Temperature -40 to +85 °C Storage Temperature -40 to +150 °C Parameter Min. Specification Typ. Max. 5.25 Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. Unit Condition DC Specifications Supply Voltage 4.75 5 Supply Current 20 24 RFAGC Control Voltage 0.5 RFAGC Input Impedance V mA 4.5 V 0.5V=Minimum Gain 4.5V=Maximum Gain 300 kΩ 0 to 700 MHz On-chip signal path is DC-coupled, minimum frequency depends on external AC coupling components. 700 MHz On-chip signal path is DC-coupled, minimum frequency depends on external AC coupling components. RF Input Impedance 75 Ω RF Input VSWR 1.4 AC Specifications LNA+AGC+Mixer RF Frequency Range RF Input 3dB Bandwidth At 100MHz Mixer Output 3dB Bandwidth 100 MHz Mixer Output Impedance 300 Ω Mixer Output VSWR Maximum Gain Minimum Gain 1.2 27 Defined by on-chip first-order low-pass filter Differential At 100MHz 30 dB RFAGC=4.5V -2 dB RFAGC=0.5V Output 1dB Compression 90 dBμV(rms) Maximum Gain Input IP3, Maximum Gain 78 dBμV(rms) LNA Input to Mixer Output Input IP3, Minimum Gain 79 dBμV(rms) LNA Input to Mixer Output Noise Figure 2 of 12 5 dB SSB, Cascaded LNA, AGC & Mixer 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. Rev A6 DS061016 RF3334 Parameter Min. Specification Typ. Max. Unit Condition LO LO Frequency Range LO Input Impedance LO Input VSWR LO Input Level 0 to 800 MHz 75 Ω Differential 1.6:1 80 dBuV LO Bandwidth 800 MHz LO Rejection to RF Input 50 dB LO Rejection to Input of IF Amplifier 65 dB 0 to 120 MHz 4000 Ω Differential 10 Ω Differential R1=1kΩ IF Amplifier IF Frequency Range Input Impedance Output Impedance Differential Voltage Gain Gain Set Resistor=2500Ω 10 dB Gain Set Resistor=140Ω 31 dB R1=1kΩ Gain Set Resistor=5Ω 40 dB R1=1kΩ 1.5 μVrms IF 3dB Bandwidth Equivalent Input Noise Output Swing 140 MHz 6 8 Gain Set=140Ω VP-P Into 1kΩ load, at 50MHz Into 1kΩ load, at 50MHz Output 1dB Compression 127 dBμV(rms) Output IP3 137 dBμV(rms) Into 1kΩ load, at 50MHz VCC =5.25V, VRFAGC=4.5V, ICC =29mA, PDISS =154mW Thermal ThetaJC 65 °C/W Maximum Measured Junction Temperature at DC Bias Conditions 95 °C Rev A6 DS061016 Gain Set=5Ω TAMB =+85°C 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 3 of 12 RF3334 Pin 1 Function RFDEC Description Interface Schematic External decoupling capacitor for RF single-ended to differential converter. VCC 100 Ω 2 RF LNA Input, Internally matched to 75Ω. Should be AC-coupled. RFDEC VBIAS RF 3 4 5 6 7 GND IFVCC IFSET IFSETB IFOUT Ground. 5V supply for IF section. IF Gain select. The resistance between this pin and pin 6 (IFSETB) determines the gain of the IF amplifier. Maximum gain is achieved by placing a short circuit between the pins. Larger values of resistance will reduce the IF gain according to the following equation where R is the value of resistance between pins 5 and 6. IFGain=20log(1600/(R=75))15. IFSET IFSETB IFSET IFSETB Complementary IF Gain select. IF Amplifier Output. Differential output of the IF amplifier. The differential load across this pin and pin 8 (IFOUTB) should be 1kΩ or greater for optimal performance. The differential output impedance across this pin and pin 8 in 10Ω. VCC VBIAS 8 IFOUTB Complementary IF Amplifier Output. VCC VBIAS 9 10 GND MIXLOADB 11 MIXLOAD 4 of 12 IF OUT IF OUTB Ground. Complementary Mixer load. MIXLOAD MIXLOADB Differential output of the RF mixer. A resonant load should be applied to this pin and pin 10 (MIXLOADB) that will act as a bandpass filter at the desired IF frequency. VCC should be supplied to this pin via an inductor or a resistor. Use of a resistor will degrade intermodulation performance. MIXLOAD MIXLOADB 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. Rev A6 DS061016 RF3334 Pin 12 Function RFAGC 13 LO Description Interface Schematic RF Gain select voltage input. The voltage applied to this pin sets the gain of the RF amplifier. The voltage applied to this pin should be between 0.5V and 4.5V. The RF gain characteristic is such that 0.5V yields a gain of -2dB and 4.5V yields a gain of +30dB as measured from the input of the LNA to the output of the mixer stage. Differential LO Input. This pin and pin 14 (LOB) are the differential LO inputs. This input should be AC-coupled. The differential input impedance across pins 13 and 14 is 75Ω. The LO may be driven single ended but will require a higher drive level. If a single ended LO is applied, pin 14 should be AC-coupled to ground. RFAGC 100 kΩ 10 kΩ VREF LOB 300 Ω VBIAS 75 Ω 300 Ω LO 14 LOB Complementary LO Input. Should be AC-coupled. LOB 300 Ω VBIAS 75 Ω 300 Ω LO 15 16 GND GND RFVCC Paddle Ground. 5V supply for RF section. Backside of package should be connected to ground. Package Drawing 2 PLCS 0.10 C A -A- 0.05 C 0.90 0.85 4.00 SQ . 0.70 0.65 2.00 TYP 0.05 0.00 0.10 C B 2 PLCS 12° M AX 0.10 C B 2 PLCS -B- -C- 1.87 TYP 3.75 SQ 0.10 C A 2 PLCS SEATING PLANE Shaded lead is pin 1. D im ensions in m m. 0.10 M C A B 0.60 0.24 TYP 0.35 0.23 Pin 1 ID 0.20 R 2.25 SQ . 1.95 0.75 TYP 0.50 0.65 Rev A6 DS061016 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 5 of 12 RF3334 RFVCC GND LOB LO Pin-Out 16 15 14 13 RFDEC 1 12 RFAGC RFIN 2 11 MIXLOAD GND 3 10 MIXLOADB IFVCC 4 6 7 IFSETB IFOUT 8 IFOUTB 5 IFSET 9 GND Application Schematic LOB 10 nF VCC + LO 1 uF 1 nF 10 nF 1 kΩ RFAGC 10 nF 10 pF 16 15 14 13 C 10 nF 1 12 L RFIN 2 11 10 nF R 3 L VCC 10 VCC IF AMP 4 9 10 n 5 6 7 C 8 IFOUT IFOUTB R* 6 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. Rev A6 DS061016 RF3334 Evaluation Board Schematic T1 50 Ω μstrip TTWB-1-A R1 1 kΩ VCC + C1 1 uF C10 1 nF 50 Ω μstrip J3 RF IN C3 10 nF 16 15 14 C5 82 pF 13 1 12 2 11 3 L1 120 nH R6 750 Ω 4 C6 10 nF J1-3 1 VCC 2 GND 3 RF AGC 5 6 7 8 R3 475 Ω R2 140 Ω R4 475 Ω R5 100 Ω C7 10 n C9 10 n CON3 Rev A6 DS061016 VCC C8 82 pF 9 J1 J1-1 L2 120 nH 10 IF AMP VCC RFAGC C4 10 nF C11 10 pF C2 10 nF J2 LO 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. J4 IFOUT J5 IFOUTB 7 of 12 RF3334 Evaluation Board Layout Board Size 2.0” x 2.0” Board Thickness 0.032”, Board Material FR-4, Multi-layer 8 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. Rev A6 DS061016 RF3334 35.0 LNA + AGC + Mixer Gain versus Control Voltage over Temperature (Freq = 100 MHz, VCC = 5.0 V) 90.0 LNA + AGC + Mixer + IF AMP - IIP3 versus Gain over Temperature (Freq = 100 MHz, VCC = 5.0 V) 88.0 30.0 86.0 25.0 84.0 IIP3 (dBμV) Gain (dB) 20.0 15.0 10.0 82.0 80.0 78.0 76.0 5.0 74.0 -40°C 0.0 +25°C -40°C +25°C 72.0 +85°C +85°C -5.0 70.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 30.0 35.0 40.0 45.0 RFAGC (V) 35.0 50.0 55.0 60.0 65.0 Gain (dB) SSB, Cascaded Noise Figure versus Gain over Temperature (Freq = 100 MHz, VCC = 5.0 V) RF Input VSWR versus Frequency Across Temperature (VCC = 5.0 V) 1.40 -40°C 1.38 +25°C 30.0 +85°C 1.36 1.34 RF Input VSWR Noise Figure (dB) 25.0 20.0 15.0 1.32 1.30 1.28 1.26 10.0 1.24 -40°C 5.0 +25°C 1.22 +85°C 0.0 25.0 1.20 30.0 35.0 40.0 45.0 50.0 55.0 60.0 65.0 Gain (dB) 1.75 70.00 80.00 90.00 100.00 110.00 120.00 130.00 Frequency (MHz) LO Input VSWR versus Temperature Across Temperature (VCC = 5.0 V) LO Input VSWR 1.70 1.65 1.60 -40°C 1.55 +25°C +85°C 1.50 118.00 128.00 138.00 148.00 158.00 168.00 178.00 Frequency (MHz) Rev A6 DS061016 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 9 of 12 RF3334 1.0 Swp Max 0.2GHz 2.0 2. 0 0.6 0.8 Swp Max 0.2GHz 1.0 0.8 LO Input, Temp = +25°C 0. 4 0.6 RF Input, Temp = +25°C 0. 3.0 3.0 4.0 5. 0 0.2 4 4.0 5.0 10.0 0.2 10.0 4.0 5.0 3.0 2.0 1.0 0.8 0.6 0.4 0.2 0 10.0 3.0 4.0 5.0 2.0 1.0 0.8 0.6 0.4 0.2 0 10.0 -10.0 .0 -2 -1.0 -0.8 -1.0 -0.8 6 .4 -0. 6 0 .0 -2 -3 . -0. -0 -3 .0 -4 . 0 -5.0 10 of 12 Swp Min 0.05GHz -0.2 -4. 0 -5.0 .4 -0 -10.0 -0.2 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. Swp Min 0.05GHz Rev A6 DS061016 RF3334 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch to 8μinch gold over 180μinch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Pattern A = 0.69 x 0.28 (mm) Typ. B = 0.28 x 0.69 (mm) Typ. C = 2.40 (mm) Sq. Dimensions in mm. 1.95 Typ. 0.65 Typ. Pin 16 B B B B Pin 12 Pin 1 0.65 Typ. A A A A C A A A A 0.98 1.95 Typ. 0.81 Typ. B B B B Pin 8 0.81 Typ. 0.98 Figure 1. PCB Metal Land Pattern (Top View) Rev A6 DS061016 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 11 of 12 RF3334 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. A = 0.79 x 0.38 (mm) Typ. B = 0.38 x 0.79 (mm) Typ. C = 2.50 (mm) Sq. Dimensions in mm. 1.95 Typ. 0.65 Typ. Pin 16 B B B B Pin 1 0.65 Typ. Pin 12 A A A A C A A A A 0.98 1.95 Typ. 0.81 Typ. B B B B Pin 8 0.81 Typ. 0.98 Figure 2. PCB Solder Mask Pattern (Top View) Thermal Pad and Via Design The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. 12 of 12 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. Rev A6 DS061016