RF2878 0 3V LOW NOISE AMPLIFIER/ 3V PA DRIVER AMPLIFIER RoHS Compliant & Pb-Free Product Typical Applications • TDMA/CDMA/FM Cellular PCS LNA • General Purpose Amplification • Low Noise Transmit Driver Amplifier • Commercial and Consumer Systems Product Description The RF2878 is a low noise amplifier with a very high dynamic range designed for digital cellular applications. The device functions as an outstanding front end low noise amplifier or power amplifier driver amplifier in the transmit chain of digital subscriber units where low transmit noise power is a concern. When used as an LNA, the bias current can be set externally. When used as a PA driver, the IC can operate directly from a single cell Li-ion battery and includes a power down feature that can be used to completely turn off the device. The IC is featured in a standard SOT 5-lead plastic package. 1.60 + 0.01 0.15 0.05 0.400 1 2.90 + 0.10 0.950 2.80 + 0.20 3° MAX 0° MIN Dimensions in mm. 0.127 NOTE: The RF2878 is a Pb-free product. If a non-Pb-free product with the same functionality and package is desired, please see the RF2361. Optimum Technology Matching® Applied 9GaAs HBT Si BJT 1.44 1.04 0.45 + 0.10 Package Style: SOT 5-Lead GaAs MESFET Si Bi-CMOS SiGe HBT Si CMOS InGaP/HBT GaN HEMT SiGe Bi-CMOS Features • Low Noise and High Intercept Point • Adjustable Bias Current • Power Down Control • Single 2.5V to 6.0V Power Supply RF IN 1 5 GND2 • 150MHz to 2500MHz Operation • Extremely Small SOT 5-Lead Package GND1 2 VPD 3 4 RF OUT Ordering Information RF2878 3V Low Noise Amplifier/ 3V PA Driver Amplifier RF2878 PCBA-D Fully Assembled Evaluation Board (Driver) RF2878 PCBA-L Fully Assembled Evaluation Board (LNA) Functional Block Diagram Rev A0 060206 RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com 4-331 RF2878 Absolute Maximum Ratings Parameter Supply Voltage, VCC Power Down Voltage, VPD Input RF Level Operating Ambient Temperature Storage Temperature Parameter Rating Unit -0.5 to +8.0 <VCC +10 -40 to +85 -40 to +150 VDC VDC dBm °C °C Caution! ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. RoHS marking based on EUDirective2002/95/EC (at time of this printing). However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s). Specification Min. Typ. Max. Unit 150 to 2500 MHz Condition Overall RF Frequency Range Low Noise Amplifier 881MHz Performance Gain 19.5 19.5 Noise Figure Input IP3 20 20 1.4 1.4 +6.0 +5.5 1.6 1.6 dB dB dB dB dBm dBm 1.5 1.5 dB dB dB dB dBm dBm Low Noise Amplifier 1950MHz Performance Gain 12.5 12.5 Noise Figure Input IP3 13 13 1.3 1.3 +16.5 +16.0 Driver Amplifier 836MHz Performance Gain Output IP3 19.5 19.5 19.5 25 Noise Figure Reverse Isolation Input VSWR Output VSWR P1dB 4-332 13 12 10.5 20.5 20.5 20.5 +32.0 +29.0 +27.8 1.9 1.85 1.8 25 25 25 1.8:1 1.25:1 14.4 12.5 11.5 21.5 21.5 21.5 35 2.0 2.0 2.0 Schematic per LNA Application; T=25°C, RF=881MHz, VPD =2.8V, R1=1kΩ VCC =3.0V, ICC =7.6mA VCC =2.7V, ICC =7.5mA VCC =3.0V, ICC =7.6mA VCC =2.7V, ICC =7.5mA VCC =3.0V, ICC =7.6mA VCC =2.7V, ICC =7.5mA Schematic per LNA Application; T=25°C, RF=1950MHz, VPD =2.8V, R1=1kΩ VCC =3.0V, ICC =6.4mA VCC =2.7V, ICC =6.3mA VCC =3.0V, ICC =6.4mA VCC =2.7V, ICC =6.3mA VCC =3.0V, ICC =6.4mA VCC =2.7V, ICC =6.3mA Schematic per Driver Amplifier Application; T=25°C, RF=836MHz, VPD =2.8V dB dB dB dBm dBm dBm dB dB dB dB dB dB VCC =3.5V VCC =3.0V VCC =2.7V VCC =3.5V VCC =3.0V VCC =2.7V VCC =3.5V VCC =3.0V VCC =2.7V VCC =3.5V VCC =3.0V VCC =2.7V dBm dBm dBm Using External LC network used on evaluation board. VCC =3.5V VCC =3.0V VCC =2.7V 2.0:1 2.0:1 Rev A0 060206 RF2878 Parameter Min. Specification Typ. Max. Unit Power Supply Voltage (VCC) Voltage (VPD) Current Consumption Driver Amplifier T = 25 °C 2.7 12.5 2.5 to 6.0 2.8 21.5 2.9 27 V V mA 18 19 20 23 22 29 10 mA mA μA 13.0 13.0 13.0 27 14.0 14.0 14.0 +35.0 +31.0 +28.8 1.85 1.8 1.75 19 19 19 1.6:1 1.6:1 14.5 14.5 14.5 38 dB dB dB dBm dBm dBm dB dB dB dB dB dB VCC =3.5V VCC =3.0V VCC =2.7V VCC =3.5V VCC =3.0V VCC =2.7V VCC =3.5V VCC =3.0V VCC =2.7V VCC =3.5V VCC =3.0V VCC =2.7V dBm dBm dBm Using External LC network used on evaluation board. VCC =3.5V VCC =3.0V VCC =2.7V T = 25 °C Power Down Driver Amplifier 1880MHz Performance Gain Output IP3 Noise Figure Reverse Isolation Input VSWR Output VSWR P1dB 14 13 12 15.6 14.1 13.1 2.7 11.5 2.5 to 6.0 2.8 19.5 16 18 18 20.5 2.0 2.0 2.0 2.0:1 2.0:1 Power Supply Voltage (VCC) Voltage (VPD) Current Consumption Driver Amplifier Power Down Rev A0 060206 Condition 2.9 25.5 V V mA 20 27 10 mA mA μA VCC =3.5V; VPD =2.8V; VPD +VCC - Current Consumption from VPD is 2.0mA Typ. @ VPD =2.8V and 3.0mA Max @ VPD =2.9 V VCC =3.5V; VPD =2.7V; VPD + VCC VCC =3.5V; VPD =2.9V; VPD + VCC VCC =3.5V; VPD ≤ 0.9 V Schematic per Driver Amplifier Application; T=25°C, RF=1880MHz, VPD =2.8V VCC =3.5V; VPD =2.8V; VPD +VCC - Current Consumption from VPD is 2.0mA Typ.@ VPD =2.8V and 3.0mA Max @ VPD =2.9 V VCC =3.5V; VPD =2.7V; VPD + VCC VCC =3.5V; VPD =2.9V; VPD + VCC VCC =3.5V; VPD ≤ 0.9 V 4-333 RF2878 Pin 1 Function RF IN Description Interface Schematic RF input pin. This pin is DC coupled and matched to 50Ω at 836 MHz. To Bias Circuit RF OUT RF IN 2 GND1 3 VPD Ground connection. For best performance, keep traces physically short and connect immediately to ground plane. For low noise amplifier applications, this pin is used to control the bias current. See plots for bias current settings. An external resistor (R1) can be used to set the bias current for any VPD voltage. PD For driver amplifier applications, this is the Power Down pin for the IC. VPD =2.8V +/- 0.1V is required for proper operation. VPD< 0.9V turns off the Part. External RF bypassing is required. The trace length between the pin and the bypass capacitors should be minimized. The ground side of the bypass capacitors should connect immediately to ground plane. Nominal current required for VPD =2.8V is 2.0mA typical and 3.0mA Max (@ VPD =2.9V). 4 RF OUT 5 GND2 4-334 Amplifier Output pin. This pin is an open-collector output. It must be biased to either VCC or pin 4 through a choke or matching inductor. This pin is typically matched to 50Ω with a shunt bias/matching inductor and series blocking/matching capacitor. Refer to application schematics. Ground connection. For best performance, keep traces physically short and connect immediately to ground plane. Rev A0 060206 RF2878 Application Schematic: Low Noise Amplifier ~881MHz Operation 22 nF J1 RF IN 1 5 2 2 pF 1k Ω VPD 3 10 nF J2 RF OUT 4 100 pF 12 nH VCC 100 pF 10 nF Application Schematic: Low Noise Amplifier ~1950MHz Operation 22 nF J1 RF IN 1 5 2 1 pF 1k Ω VPD 3 10 nF 100 pF J2 RF OUT 4 3.3 nH VCC 100 pF Rev A0 060206 10 nF 4-335 RF2878 Application Schematic: Driver Amplifier ~836MHz Operation 22 nF J1 RF IN 1 5 2 2 pF 0Ω VPD 3 10 nF J2 RF OUT 4 100 pF 12 nH VCC 100 pF 10 nF Application Schematic: Driver Amplifier ~1880MHz Operation 22 nF J1 RF IN 1 5 2 1 pF 0Ω VPD 3 10 nF 100 pF J2 RF OUT 4 3.3 nH VCC 100 pF 4-336 10 nF Rev A0 060206 RF2878 Evaluation Board Schematic: Low Noise Amplifier ~881MHz Operation P1 P1-1 P1-3 1 VPD 2 GND 3 VCC C7 4.7 μF J1 RF IN C3 22 nF 50 Ω μstrip 1 5 2 C4 2 pF R1 0Ω VPD 3 C1 10 nF 50 Ω μstrip 4 C2 220 pF J2 RF OUT L1 12 nH 2878401 r- VCC C5 220 pF C6 10 nF Evaluation Board Schematic: Driver Amplifier ~836MHz Operation P1 P1-1 P1-3 1 VPD 2 GND 3 VCC C7 4.7 μF J1 RF IN 50 Ω μstrip C3 22 nF 1 5 2 R1 0Ω C4 2 pF VPD 3 C1 10 nF 4 C2 220 pF J2 RF OUT L1 12 nH 2878400 r1 VCC C5 220 pF Rev A0 060206 50 Ω μstrip C6 10 nF 4-337 RF2878 Evaluation Board Layout - 900MHz Driver Board Size 0.948” x 1.063” Board Thickness 0.031”; Board Material FR-4 Evaluation Board Layout - 900MHz LNA 4-338 Rev A0 060206 RF2878 Driver Amp 836 MHz ICC versus VPD 26.0 20.92 2.7V Icc (mA) 3.0V Icc (mA) 3.3V Icc (mA) 3.6V Icc (mA) 25.5 25.0 24.5 20.90 20.88 24.0 Driver Amp 836 MHz Gain versus VPD 2.7V Gain (dB) 3.0V Gain (dB) 3.3V Gain (dB) 3.6V Gain (dB) 20.86 Gain (dB) ICC (mA) 23.5 23.0 22.5 22.0 20.84 20.82 20.80 21.5 21.0 20.78 20.5 20.76 20.0 20.74 19.5 19.0 2.7 2.8 2.9 20.72 2.70 3.0 2.80 VPD Driver Amp 836 MHz OIP3 versus VPD 33.0 3.00 Driver Amp 836 MHz POUT 1dB versus VPD 15.0 2.7V OIP3 (dBm) 3.0V OIP3 (dBm) 3.3V OIP3 (dBm) 3.6V OIP3 (dBm) 32.0 14.5 2.7V P 1dB (dBm) 3.0V P 1dB (dBm) 3.3V P 1dB (dBm) 3.6V P 1dB (dBm) 14.0 POUT 1dB (dBm) 31.0 OIP3 (dBm) 2.90 VPD 30.0 13.5 13.0 12.5 29.0 12.0 28.0 11.5 27.0 11.0 2.7 2.8 2.9 3.0 VPD 2.05 2.00 2.7 2.8 2.9 3.0 VPD Driver Amp 836 MHz Noise Figure versus VPD 2.7V NF (dB) 3.0V NF (dB) 3.3V NF (dB) 3.6V NF (dB) NF (dB) 1.95 1.90 1.85 1.80 1.75 1.70 2.70 2.80 2.90 3.00 VPD Rev A0 060206 4-339 RF2878 Low Noise Amplifier 881 MHz Gain versus ICC 19.95 2.7V Gain (dB) 3.0V Gain (dB) 3.3V Gain (dB) 3.6V Gain (dB) 19.90 Low Noise Amplifier 881 MHz OIP3 versus ICC 29.0 2.7V OIP3 (dBm) 3.0V OIP3 (dBm) 3.3V OIP3 (dBm) 3.6V OIP3 (dBm) 28.5 28.0 19.85 27.5 OIP3 (dBm) Gain (dB) 19.80 19.75 19.70 27.0 26.5 26.0 25.5 19.65 25.0 19.60 19.55 6.00 24.5 24.0 6.50 7.00 7.50 8.00 8.50 9.00 9.50 10.00 6.0 6.5 7.0 7.5 ICC Low Noise Amplifier 881 MHz IIP3 versus ICC 9.0 8.0 8.5 9.0 9.5 10.0 9.5 10.0 Low Noise Amplifier 881 MHz POUT 1dB versus ICC 13.5 2.7V IIP3 (dBm) 3.0V IIP3 (dBm) 3.3V IIP3 (dBm) 3.6V IIP3 (dBm) 8.5 8.0 ICC (mA) 2.7V Pout 1dB (dBm) 3.0V Pout 1dB (dBm) 3.3V Pout 1dB (dBm) 3.6V Pout 1dB (dBm) 13.0 12.5 POUT 1dB (dBm) IIP3 (dBm) 7.5 7.0 6.5 6.0 12.0 11.5 11.0 5.5 10.5 5.0 10.0 4.5 4.0 9.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 ICC (mA) 6.0 6.5 7.0 7.5 8.0 8.5 9.0 ICC (mA) Low Noise Amplifier 881 MHz Noise Figure versus ICC 1.42 2.7V NF (dB) 3.0V NF (dB) 3.3V NF (dB) 3.6V NF (dB) 1.41 1.40 NF (dB) 1.39 1.38 1.37 1.36 1.35 1.34 1.33 6.00 6.50 7.00 7.50 8.00 8.50 9.00 9.50 10.00 ICC 4-340 Rev A0 060206 RF2878 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch to 8μinch gold over 180μinch nickel. PCB Land Pattern Recommendation PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. PCB Metal Land Pattern A = 0.70 x 1.00 (mm) Typ. Dimensions in mm. Pin 5 Pin 1 A A 0.95 Typ. 1.90 Typ. A A A 2.60 Figure 1. PCB Metal Land Pattern (Top View) Rev A0 060206 4-341 RF2878 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. A = 0.90 x 1.20 (mm) Typ. Dimensions in mm. Pin 5 Pin 1 A A 0.95 Typ. 1.90 Typ. A A A 2.60 Figure 2. PCB Solder Mask (Top View) 4-342 Rev A0 060206