VISHAY 60EPF06PBF

VS-60EPF0.PbF, VS-60CPF0.PbF Series
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Vishay Semiconductors
Fast Soft Recovery Rectifier Diode, 60 A
FEATURES
TO-247AC
TO-247AC modified
• Designed and
JEDEC-JESD47
qualified
according
to
• Compliant to RoHS Directive 2002/95/EC
Base cathode
2
Base cathode
2
APPLICATIONS
• Output rectification and
choppers and converters
1
Cathode
3
Anode
1
Anode
VS-60EPF..
• Input rectifications where severe
conducted EMI should be met
3
Anode
VS-60CPF..
60 A
VR
200 V, 400 V, 600 V
VF at IF
1.3 V
IFSM
830 A
trr
70 ns
TJ max.
150 °C
Diode variation
Single die
Snap factor
0.5
inverters,
restrictions
on
The VS-60EPF..PbF and VS-60CPF..PbF fast soft recovery
rectifier series has been optimized for combined short
reverse recovery time and low forward voltage drop.
TO-247AC modified (2 pins), TO-247AC
IF(AV)
in
DESCRIPTION
PRODUCT SUMMARY
Package
freewheeling
The glass passivation ensures stable reliable operation in
the most severe temperature and power cycling conditions.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
VRRM
IF(AV)
Sinusoidal waveform
VALUES
UNITS
200 to 600
V
60
A
830
IFSM
trr
1 A, 100 A/μs
VF
30 A, TJ = 25 °C
70
TJ
ns
1.1
V
- 40 to 150
°C
VOLTAGE RATINGS
VRRM, MAXIMUM PEAK
REVERSE VOLTAGE
V
VRSM, MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
VS-60EPF02PbF, VS-60CPF02PbF
200
300
VS-60EPF04PbF, VS-60CPF04PbF
400
500
VS-60EPF06PbF, VS-60CPF06PbF
600
700
PART NUMBER
IRRM
AT 150 °C
mA
5
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
Maximum average forward current
IF(AV)
TC = 106 °C, 180° conduction half sine wave
60
Maximum peak one cycle
non-repetitive surge current
IFSM
Maximum I2t for fusing
I2t
Maximum I2t for fusing
I2t
Revision: 18-Aug-11
10 ms sine pulse, rated VRRM applied
700
10 ms sine pulse, no voltage reapplied
830
10 ms sine pulse, rated VRRM applied
2450
10 ms sine pulse, no voltage reapplied
3460
t = 0.1 ms to 10 ms, no voltage reapplied
34 600
UNITS
A
A2s
A2s
Document Number: 94104
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VS-60EPF0.PbF, VS-60CPF0.PbF Series
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ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum forward voltage drop
Forward slope resistance
VFM
rt
Threshold voltage
VF(TO)
Maximum reverse leakage current
IRM
TEST CONDITIONS
60 A, TJ = 25 °C
TJ = 150 °C
TJ = 25 °C
UNITS
1.3
V
5.0
m
0.88
V
0.1
VR = Rated VRRM
TJ = 150 °C
VALUES
mA
5.0
RECOVERY CHARACTERISTICS
PARAMETER
SYMBOL
VALUES
UNITS
IF at 60 Apk
180
ns
3.4
A
Qrr
25 A/μs
25 °C
0.5
μC
S
Typical
0.5
Reverse recovery time
trr
Reverse recovery current
Irr
Reverse recovery charge
Snap factor
TEST CONDITIONS
IFM
trr
ta
tb
t
dir
dt
Qrr
IRM(REC)
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
Maximum thermal resistance,
junction to case
RthJC
Maximum thermal resistance,
junction to ambient
RthJA
Typical thermal resistance,
case to heatsink
RthCS
DC operation
Marking device
Revision: 18-Aug-11
UNITS
- 40 to 150
°C
0.4
40
Mounting surface, smooth and greased
Approximate weight
Mounting torque
VALUES
minimum
maximum
°C/W
0.2
6
g
0.21
oz.
6 (5)
kgf · cm
(Ibf · in)
12 (10)
Case style TO-247AC modified
60EPF02, 60EPF04, 60EPF06
Case style TO-247AC
60CPF02, 60CPF04, 60CPF06
Document Number: 94104
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VS-60EPF0.PbF, VS-60CPF0.PbF Series
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Vishay Semiconductors
140
60.PF.. Series
RthJC (DC) = 0.4 K/W
140
130
Ø
Conduction angle
120
110
120°
60°
100
90°
30°
180°
Maximum Average Forward
Power Loss (W)
Maximum Allowable Case
Temperature (°C)
150
0
10
30
20
40
50
DC
80
RMS limit
60
Ø
40
Conduction period
60.PF.. Series
TJ = 150 °C
20
70
60
0
20
40
60
80
100
Average Forward Current (A)
Average Forward Current (A)
Fig. 1 - Current Rating Characteristics
Fig. 4 - Forward Power Loss Characteristics
150
800
60.PF.. Series
RthJC (DC) = 0.4 K/W
140
130
Ø
Conduction period
120
110
60°
100
90°
30°
At any rated load condition and with
rated VRRM applied following surge.
700
Peak Half Sine Wave
Forward Current (A)
Maximum Allowable Case
Temperature (°C)
100
0
90
Initial TJ = 175 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
600
500
400
300
120°
60.PF.. Series
DC
180°
200
90
20
0
40
80
60
100
1
Average Forward Current (A)
10
100
Number of Equal Amplitude Half Cycle
Current Pulses (N)
Fig. 5 - Maximum Non-Repetitive Surge Current
Fig. 2 - Current Rating Characteristics
900
90
180°
120°
90°
60°
30°
80
70
60
800
Peak Half Sine Wave
Forward Current (A)
Maximum Average Forward
Power Loss (W)
180°
120°
90°
60°
30°
120
RMS limit
50
40
30
Ø
Conduction angle
20
60.PF.. Series
TJ = 150 °C
10
0
10
20
30
40
50
60
70
Initial TJ = 195 °C
No voltage reapplied
Rated VRRM reapplied
700
600
500
400
300
200
0
Maximum non-repetitive surge current
versus pulse train duration.
100
0.01
60.PF.. Series
0.1
1
Average Forward Current (A)
Pulse Train Duration (s)
Fig. 3 - Forward Power Loss Characteristics
Fig. 6 - Maximum Non-Repetitive Surge Current
Revision: 18-Aug-11
Document Number: 94104
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VS-60EPF0.PbF, VS-60CPF0.PbF Series
Instantaneous Forward Current (A)
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Vishay Semiconductors
1000
100
TJ = 25 °C
TJ = 150 °C
10
60.PF.. Series
1
0.5
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Instantaneous Forward Voltage (V)
Fig. 7 - Forward Voltage Drop Characteristics
4
0.20
Qrr - Maximum Reverse
Recovery Charge (µC)
trr - Maximum Reverse
Recovery Time (µs)
IFM = 60 A
IFM = 30 A
0.15
IFM = 10 A
0.10
IFM = 5 A
60.PF.. Series
TJ = 25 °C
60.PF.. Series
TJ = 25 °C
IFM = 60 A
3
IFM = 30 A
2
IFM = 10 A
1
IFM = 5 A
IFM = 1 A
IFM = 1 A
0.05
0
0
80
40
160
120
200
0
120
200
160
dI/dt - Rate of Fall of Forward Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 8 - Recovery Time Characteristics, TJ = 25 °C
Fig. 10 - Recovery Charge Characteristics, TJ = 25 °C
5
0.45
60.PF.. Series
TJ = 150 °C
0.35
IFM = 60 A
0.30
IFM = 30 A
0.25
IFM = 10 A
0.20
IFM = 5 A
0.15
60.PF.. Series
TJ = 150 °C
Qrr - Maximum Reverse
Recovery Charge (µC)
0.40
trr - Maximum Reverse
Recovery Time (µs)
80
40
IFM = 60 A
4
IFM = 30 A
3
IFM = 10 A
2
IFM = 5 A
1
IFM = 1 A
IFM = 1 A
0
0.10
10
20
30
40
50
60
70
80
90
100
10
20
30
40
50
60
70
80
90
100
dI/dt - Rate of Fall of Forward Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 9 - Recovery Time Characteristics, TJ = 150 °C
Fig. 11 - Recovery Charge Characteristics, TJ = 150 °C
Revision: 18-Aug-11
Document Number: 94104
4
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-60EPF0.PbF, VS-60CPF0.PbF Series
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25
60.PF.. Series
TJ = 25 °C
20
60.PF.. Series
TJ = 150 °C
IFM = 60 A
Irr - Maximum Reverse
Recovery Current (A)
Irr - Maximum Reverse
Recovery Current (A)
25
IFM = 30 A
15
IFM = 10 A
10
IFM = 5 A
IFM = 1 A
5
0
IFM = 60 A
IFM = 30 A
IFM = 10 A
IFM = 5 A
IFM = 1 A
15
10
5
0
40
0
80
120
160
200
10
dI/dt - Rate of Fall of Forward Current (A/µs)
20
30
40
50
60
70
80
90
100
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 12 - Recovery Current Characteristics, TJ = 25 °C
ZthJC - Transient Thermal Impedance (K/W)
20
Fig. 13 - Recovery Current Characteristics, TJ = 150 °C
1
Steady state value
(DC operation)
0.1
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
Single pulse
60.PF.. Series
0.01
0.001
0.01
0.1
1
10
Square Wave Pulse Duration (s)
Fig. 14 - Thermal Impedance ZthJC Characteristics
Revision: 18-Aug-11
Document Number: 94104
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-60EPF0.PbF, VS-60CPF0.PbF Series
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Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
60
E
P
F
06
PbF
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Current rating (60 = 60 A)
3
-
Circuit configuration:
E = Single diode, 2 pins
C = Single diode, 3 pins
4
-
Package:
P = TO-247AC/AC modified
5
-
Type of silicon:
6
-
Voltage code x 100 = VRRM
7
-
F = Fast recovery
PbF = Lead (Pb)-free
02 = 200 V
04 = 400 V
06 = 600 V
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
SPICE model
Revision: 18-Aug-11
TO-247AC modified
www.vishay.com/doc?95253
TO-247AC
www.vishay.com/doc?95223
TO-247AC modified
www.vishay.com/doc?95255
TO-247AC
www.vishay.com/doc?95226
www.vishay.com/doc?95275
Document Number: 94104
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
DIMENSIONS in millimeters and inches
A
A
(3)
(6) Ø P
E
B
(2) R/2
N
A2
S
(Datum B)
Ø K M DBM
FP1
A
D2
Q
2xR
(2)
D1 (4)
D
1
4
D
3
2
Thermal pad
(5) L1
C
L
A
See view B
2 x b2
3xb
0.10 M C A M
Planting
(4)
E1
0.01 M D B M
View A - A
C
2x e
A1
b4
(b1, b3, b5)
Lead assignments
Base metal
D DE
(c)
c1
E
C
C
Diodes
1. - Anode/open
2. - Cathode
3. - Anode
(b, b2, b4)
(4)
Section C - C, D - D, E - E
SYMBOL
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.65
5.31
2.21
2.59
1.50
2.49
0.99
1.40
0.99
1.35
1.65
2.39
1.65
2.37
2.59
3.43
2.59
3.38
0.38
0.86
0.38
0.76
19.71
20.70
13.08
-
INCHES
MIN.
MAX.
0.183
0.209
0.087
0.102
0.059
0.098
0.039
0.055
0.039
0.053
0.065
0.094
0.065
0.094
0.102
0.135
0.102
0.133
0.015
0.034
0.015
0.030
0.776
0.815
0.515
-
View B
NOTES
SYMBOL
3
4
D2
E
E1
e
FK
L
L1
N
P
P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.30
15.29
15.87
13.72
5.46 BSC
2.54
14.20
16.10
3.71
4.29
7.62 BSC
3.56
3.66
6.98
5.31
5.69
4.52
5.49
5.51 BSC
INCHES
MIN.
MAX.
0.020
0.051
0.602
0.625
0.540
0.215 BSC
0.010
0.559
0.634
0.146
0.169
0.3
0.14
0.144
0.275
0.209
0.224
1.78
0.216
0.217 BSC
NOTES
3
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC outline TO-247 with exception of dimension c
Revision: 16-Jun-11
Document Number: 95223
1
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
DIMENSIONS in millimeters and inches
A
A
(3)
(6) ΦP
E
B
(2) R/2
N
A2
S
(Datum B)
Ø K M DBM
ΦP1
A
D2
Q
2xR
(2)
D1 (4)
D
1
4
D
3
2
Thermal pad
(5) L1
C
L
A
See view B
2 x b2
3xb
Planting
View A - A
C
2x e
A1
b4
0.10 M C A M
(4)
E1
(b1, b3, b5)
Lead assignments
Base metal
D DE
(c)
c1
E
C
C
Diodes
1. - Anode/open
2. - Cathode
3. - Anode
(b, b2, b4)
(4)
Section C - C, D - D, E - E
SYMBOL
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.65
5.31
2.21
2.59
1.50
2.49
0.99
1.40
0.99
1.35
1.65
2.39
1.65
2.37
2.59
3.43
2.59
3.38
0.38
0.86
0.38
0.76
19.71
20.70
13.08
-
INCHES
MIN.
MAX.
0.183
0.209
0.087
0.102
0.059
0.098
0.039
0.055
0.039
0.053
0.065
0.094
0.065
0.094
0.102
0.135
0.102
0.133
0.015
0.034
0.015
0.030
0.776
0.815
0.515
-
View B
NOTES
SYMBOL
3
4
D2
E
E1
e
K
L
L1
N
P
P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.30
15.29
15.87
13.72
5.46 BSC
2.54
14.20
16.10
3.71
4.29
7.62 BSC
3.56
3.66
6.98
5.31
5.69
4.52
5.49
5.51 BSC
INCHES
MIN.
MAX.
0.020
0.051
0.602
0.625
0.540
0.215 BSC
0.010
0.559
0.634
0.146
0.169
0.3
0.14
0.144
0.275
0.209
0.224
1.78
0.216
0.217 BSC
NOTES
3
Notes
(1) Dimensioning and tolerance per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC outline TO-247 with exception of dimension c
Revision: 21-Jun-11
Document Number: 95253
1
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
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product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Document Number: 91000
Revision: 11-Mar-11
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