CYStech Electronics Corp. Spec. No. : C395Q8 Issued Date : 2006.10.25 Revised Date : Page No. : 1/3 Dual N-CHANNEL ENHANCEMENT MODE POWER MOSFET MTDN4228Q8 Description The MTDN4228Q8 provides the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness. The SOP-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Features • RDS(ON)=40mΩ@VGS=4.5V, ID=4A • Simple drive requirement • Low on-resistance • Fast switching speed • Dual N-ch MOSFET package • Pb-free package Equivalent Circuit MTDN4228Q8 Outline SOP-8 G：Gate S：Source D：Drain MTDN4228Q8 CYStek Product Specification Spec. No. : C395Q8 Issued Date : 2006.10.25 Revised Date : Page No. : 2/3 CYStech Electronics Corp. Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit BVDSS 30 V Gate-Source Voltage VGS ±20 V Continuous Drain Current @TA=25 °C (Note 1) ID 6.8 A Continuous Drain Current @TA=70 °C (Note 1) ID 5.5 A Pulsed Drain Current (Note 2) IDM 40 A Total Power Dissipation @ TA=25 °C Linear Derating Factor Pd 2 W 0.016 W / °C Operating Junction Temperature Tj -55~+150 °C Tstg -55~+150 °C Rth,ja 62.5 °C/W Drain-Source Breakdown Voltage Storage Temperature Thermal Resistance, Junction-to-Ambient Note : 1.Surface mounted on 1 in² copper pad of FR-4 board, t≤10s. 2.Pulse width limited by maximum junction temperature. Electrical Characteristics (Ta=25°C) Symbol Min. Typ. Max. BVDSS 30 VGS(th) 1 3 IGSS ±100 IDSS 1 26 *RDS(ON) 40 *GFS 15 Ciss 580 930 Coss 150 Crss 108 td(ON) 10 tr 9 td(OFF) 18 tf 6 Qg 9 15 Qgs 2 Qgd 6 *VSD 1.3 Unit V V nA μA S Test Conditions VGS=0, ID=250μA VDS=VGS, ID=-250μA VGS=±20V, VDS=0 VDS=30V, VGS=0 ID=6A, VGS=10V ID=4A, VGS=4.5V VDS=10V, ID=5A pF VDS=25V, VGS=0, f=1MHz mΩ ns ns ns ns nC nC nC V VDD=15V, ID=1A, VGS=10V, RGEN=3.3Ω, RD=15Ω VDS=24V, ID=6.8A, VGS=4.5V, VGS=0V, ISD=1.7A *Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2% MTDN4228Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C395Q8 Issued Date : 2006.10.25 Revised Date : Page No. : 3/3 SOP-8 Dimension Right side View G Top View A Marking: I C B 4228SS H J K E D Front View Part A Part A M L 8-Lead SOP-8 Plastic Package CYStek Package Code: Q8 N O F *: Typical Inches Min. Max. 0.1909 0.2007 0.1515 0.1555 0.2283 0.2441 0.0480 0.0519 0.0145 0.0185 0.1472 0.1527 0.0570 0.0649 0.1889 0.2007 DIM A B C D E F G H Millimeters Min. Max. 4.85 5.10 3.85 3.95 5.80 6.20 1.22 1.32 0.37 0.47 3.74 3.88 1.45 1.65 4.80 5.10 DIM I J K L M N O Inches Min. Max. 0.0019 0.0078 0.0118 0.0275 0.0074 0.0098 0.0145 0.0204 0.0118 0.0197 0.0031 0.0051 0.0000 0.0059 Millimeters Min. Max. 0.05 0.20 0.30 0.70 0.19 0.25 0.37 0.52 0.30 0.50 0.08 0.13 0.00 0.15 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTDN4228Q8 CYStek Product Specification