CYSTEKEC MEP4435Q8

CYStech Electronics Corp.
Spec. No. : C391Q8-A
Issued Date : 2008.07.17
Revised Date :
Page No. : 1/7
P-CHANNEL ENHANCEMENT MODE POWER MOSFET
MEP4435Q8
Description
The MEP4435Q8 is a P-channel enhancement-mode MOSFET, providing the designer with the best
combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness.
The SOP-8 package is universally preferred for all commercial-industrial surface mount applications
and suited for low voltage applications such as DC/DC converters.
Features
• RDS(ON)[email protected]=-10V, ID=-10A
RDS(ON)[email protected]=-5V, ID=-7A
• Simple drive requirement
• Low on-resistance
• Fast switching speed
• Pb-free package
Equivalent Circuit
MEP4435Q8
Outline
SOP-8
G:Gate
S:Source
D:Drain
MEP4435Q8
CYStek Product Specification
Spec. No. : C391Q8-A
Issued Date : 2008.07.17
Revised Date :
Page No. : 2/7
CYStech Electronics Corp.
Absolute Maximum Ratings (Ta=25°C)
Parameter
Drain-Source Breakdown Voltage
Gate-Source Voltage
Continuous Drain Current @TA=25 °C
Continuous Drain Current @TA=100 °C
Pulsed Drain Current (Note 1)
Total Power Dissipation @ TA=25 °C (Note 2)
Linear Derating Factor
Operating Junction Temperature
Storage Temperature
Thermal Resistance, Junction-to-Ambient (Note 2)
Symbol
Limits
Unit
BVDSS
VGS
ID
ID
IDM
Pd
-30
±25
-10
-8
-40
2.5
0.02
-55~+150
-55~+150
50
V
V
A
A
A
W
W / °C
°C
°C
°C/W
Tj
Tstg
Rth,j-a
Note : 1.Pulse width limited by maximum junction temperature.
2. Surface mounted on 1 in² copper pad of FR-4 board; 125 °C/W when mounted on minimum copper pad
Electrical Characteristics (Tj=25°C, unless otherwise specified)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
Static
BVDSS
ΔVDSS/ΔTj
VGS(th)
IGSS
IDSS
IDSS
ID(ON)
*RDS(ON)
*GFS
Dynamic
Ciss
Coss
Crss
td(ON)
tr
td(OFF)
tf
Qg
Qgs
Qgd
Rg
MEP4435Q8
-30
-1
40
-
-0.037
15
25
24
-3
±100
-1
-10
20
35
-
-
2815
1060
955
12
10
35
7
25
7
9
4
-
V
V/°C
V
nA
μA
μA
A
S
VGS=0, ID=-250μA
Reference to 25°C, ID=-1mA
VDS=VGS, ID=-250μA
VGS=±25V, VDS=0
VDS=-24V, VGS=0
VDS=-20V, VGS=0, Tj=125°C
VDS=-5V, VGS=-10V
ID=-10A, VGS=-10V
ID=-7A, VGS=-5V
VDS=-5V, ID=-10A
pF
VDS=-15V, VGS=0, f=1MHz
ns
VDD=-15V, ID=-1A,
VGS=-10V, RG=2.7Ω
nC
VDS=-15V, ID=-10A,
VGS=-10V,
Ω
VGS=15mV, VDS=0, f=1MHz
mΩ
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C391Q8-A
Issued Date : 2008.07.17
Revised Date :
Page No. : 3/7
Electrical Characteristics(Cont.) (Tj=25°C, unless otherwise specified)
Symbol
Min.
Source-Drain Diode
IS
ISM
*VSD
*trr
*Qrr
-
Typ.
Max.
32
26
-3
-12
-1.3
-
Unit
A
V
ns
nC
Test Conditions
VD=VG=0, VS=-1.2V
VGS=0V, ISD=-2.1A
IF=IS, VGS=0V
IF=IS, dIF/dt=100A/μs
*Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%
MEP4435Q8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C391Q8-A
Issued Date : 2008.07.17
Revised Date :
Page No. : 4/7
Characteristic Curves
MEP4435Q8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C391Q8-A
Issued Date : 2008.07.17
Revised Date :
Page No. : 5/7
Characteristic Curves(Cont.)
MEP4435Q8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C391Q8-A
Issued Date : 2008.07.17
Revised Date :
Page No. : 6/7
Characteristic Curves(Cont.)
MEP4435Q8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C391Q8-A
Issued Date : 2008.07.17
Revised Date :
Page No. : 7/7
SOP-8 Dimension
Right side View
G
Top View
A
Marking:
4435SC
□□□□
I
Date Code
C
B
H
J
E
D
K
Front View
Part A
Part A
M
L
8-Lead SOP-8 Plastic Package
CYStek Package Code: Q8
N
O
F
*: Typical
Inches
Min.
Max.
0.1909
0.2007
0.1515
0.1555
0.2283
0.2441
0.0480
0.0519
0.0145
0.0185
0.1472
0.1527
0.0570
0.0649
0.1889
0.2007
DIM
A
B
C
D
E
F
G
H
Millimeters
Min.
Max.
4.85
5.10
3.85
3.95
5.80
6.20
1.22
1.32
0.37
0.47
3.74
3.88
1.45
1.65
4.80
5.10
DIM
I
J
K
L
M
N
O
Inches
Min.
Max.
0.0019
0.0078
0.0118
0.0275
0.0074
0.0098
0.0145
0.0204
0.0118
0.0197
0.0031
0.0051
0.0000
0.0059
Millimeters
Min.
Max.
0.05
0.20
0.30
0.70
0.19
0.25
0.37
0.52
0.30
0.50
0.08
0.13
0.00
0.15
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Tin plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MEP4435Q8
CYStek Product Specification