TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SRV05 Series SRV05 Series 6V 10A Diode Array Pb GREEN RoHS The SRV05 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb surge current per IEC61000-4-5 (tP=8/20µs) without performance degradation and a minimum ±20kV ESD per IEC61000-4-2. Their very low loading capacitance also makes them ideal for protecting high speed signal pins. Features • E SD, IEC61000-4-2, ±20kV contact, ±30kV air • EFT, IEC61000-4-4, 40A (5/50ns) • Lightning, IEC61000-4-5, 10A (8/20μs) Pinout GND VCC I/O 2 I/O 3 Applications • • • • Functional Block Diagram 6 5 • • • • LCD/PDP TVs Monitors Notebooks 10/100/1000 Ethernet Firewire Set Top Boxes Flat Panel Displays Portable Medical 10/100 Ethernet Differential Protection 4 Application Examples 10/100 Ethernet PHY Unused TX + USB Dual Port Protection 1 RT TX - USB RX + Controller RT 2 5 3 4 VCC R VCC 3 D+ DGND 75 CT VBUS T D+ D- CT RJ45 Unused TX + RX + USB Port GND 10/100/1000 Ethernet Protection TX - Unused 75 VBUS75 RT GND 10/100/1000 Ethernet PHY USB Port RX RX + Unused 75 2 VBUS SRV05-4HTG CT RX - 1 TX - VBUS 6 SRV05-4HTG VBUS CT RJ45 Unused TX + To Twisted-Pair Network I/O 4 Unused TX + TX - 1 6 2 5 3 4 RX + RX - SRV05-4HTG Unused To Twisted-Pair Network I/O 1 • L ow capacitance of 2pF (TYP) per I/O • Low leakage current of 0.5μA (MAX) at 5V • Small SOT23-6 (JEDEC MO-178) packaging Unused 75 75 75 75 RX VCC VCC Life Support Note: Not Intended for Use in Life Support or Life Saving Applications GND The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 1 Revision: February 15, 2012 SRV05 Series SRV05 Description TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SRV05 Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value Parameter Rating Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Units IPP Peak Current (tp=8/20μs) 10 A PPK Peak Pulse Power (tp=8/20μs) 150 W TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -50 to 150 °C 1 Storage Temperature Range CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 1 Non-repetitive pulse per waveform on page 3 Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Symbol Test Conditions VRWM IR ≤ 1µA VR IR = 1mA ILEAK VR=5V Reverse Voltage Drop Reverse Leakage Current Min Typ Clamp Voltage VC RDYN ESD Withstand Voltage1 VESD CI/O-GND Diode Capacitance1 CI/O-I/O V 0.5 µA IPP=1A, tp=8/20µs, I/O to GND 8.8 10.0 V IPP=5A, tp=8/20µs, I/O to GND 11.5 13.0 V IPP=8A, tp=8/20µs, I/O to GND 13.2 15.0 V (VC2 - VC1) / (IPP2 - IPP1) 0.7 2 Diode Capacitance1 V 0.1 2 Dynamic Resistance Units 6.0 8.0 2 1 Max Ω IEC61000-4-2 (Contact) ±20 kV IEC61000-4-2 (Air) ±30 kV Reverse Bias=0V 2.4 3.0 pF Reverse Bias=1.65V 2.0 pF Reverse Bias=0V 1.2 pF Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 Repetitive pulse per waveform on page 3. Product Characteristics Clamping Voltage vs. IPP 20.0 18.0 Clamp Voltage (VC ) 16.0 14.0 12.0 Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 10.0 8.0 6.0 4.0 Notes : 2.0 1. All dimensions are in millimeters 0.0 1 2 3 4 5 6 7 8 9 2. Dimensions include solder plating. 10 3. Dimensions are exclusive of mold flash & metal burr. Peak Pulse Current-IPP (A) 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. SRV05 Series 2 Revision: February 15, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SRV05 Series Capacitance vs. Reverse Bias Pulse Waveform 3.0 110% 100% 2.5 90% 80% VCC =3.3V VCC =5V 1.5 1.0 70% SRV05 2.0 Percent of IPP Capacitance (pF) VCC=Float 60% 50% 40% 30% 20% 0.5 10% 0% 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 5.0 10.0 DC Bias (V) 15.0 20.0 25.0 30.0 Time (μs) Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature L*4 SRV05 – 4 H T G L*4 G= Green Product Series L = SRV05 S Ordering Information Package H: SOT23-6 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Number of Channels Assembly Site (Varies) T= Tape & Reel Number of Channels Time Part Marking System Part Numbering System Series Critical Zone TL to TP Ramp-up TL TS(max) 25 Peak Temperature (TP) tP TP Temperature Reflow Condition Part Number Package Marking Min. Order Qty. SRV05-4HTG SOT23-6 L*4 3000 3 Revision: February 15, 2012 SRV05 Series TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SRV05 Series Package Dimensions — SOT23-6 Package SOT23-6 Pins 6 JEDEC MO-178 Millimeters Min Max Max Notes A 0.900 1.450 0.035 0.057 - 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 ref e1 1.9 Ref 0.0748 Ref 0.100 0.600 0.004 10º 0º 6 N - 0.023 6 0º a M Min A1 L Recommended Solder Pad Layout Inches 4,5 6 10º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - Notes: 1. Dimensioning and tolerances per ANSI 14.5M-1982. 2. Package conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. 6. “N” is the number of terminal positions. 7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. P R O Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND REEL 14.4mm ACCESS HOLE 13mm 180mm 4.0mm 1.5mm DIA. HOLE 2.0mm 1.75mm CL 8mm 4.0mm 60mm GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. SOT-23 (8mm POCKET PITCH) 8.4mm USER DIRECTION OF FEED SRV05 Series COVER TAPE 4 Revision: February 15, 2012 PIN 1 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.