TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP0504S Series SP0504S Series 0.85pF Diode Array RoHS Pb GREEN The SP0504S has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features I/O 1 I/O 4 VCC GND I/O 2 I/O 3 ow leakage current of • L 0.5μA (MAX) at 5V • E SD protection of ±12kV contact discharge, ±15kV air discharge, (IEC61000-4-2) • Small packaging options saves board space FT protection, • E IEC61000-4-4, 40A (5/50ns) SOT23-6 Functional Block Diagram I/O2 ow capacitance of • L 0.85 pF (TYP) per I/O ightning Protection, • L IEC61000-4-5, 4.5A (8/20µs) Applications I/O4 VCC • Computer Peripherals • Network Hardware/Ports • Mobile Phones • Test Equipment • PDA’s • Medical Equipment • Digital Cameras Application Example I/O1 GND RJ-45 Connector I/O3 Ethernet PHY Tx+ J1 Tx- Rx+ Rx- J8 NC GND A single 4 channel SP0504S device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP0504S devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP0504S, the +VCC pins on the SP0504S can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP0504S can be floated or NC. Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. SP0504S 1 Revision: August 13, 2012 SP0504S Series SP0504S Description TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP0504S Series Thermal Information Absolute Maximum Ratings Symbol IPP Parameter Parameter Value Units Peak Current (tp=8/20μs) 4.5 A Storage Temperature Range TOP Operating Temperature -40 to 85 °C Maximum Junction Temperature TSTOR Storage Temperature -50 to 150 °C Maximum Lead Temperature (Soldering 20-40s) Rating Units -65 to 150 °C 150 °C 260 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Max Units Reverse Standoff Voltage Parameter VRWM IR ≤ 1µA 6.0 V Reverse Leakage Current ILEAK VR=5V 0.5 µA Clamp Voltage1 VC ESD Withstand Voltage1 VESD Diode Capacitance1 CI/O-GND Diode Capacitance CI/O-I/O 1 Min Typ IPP=1A, tp=8/20µs, Fwd 9.5 11.0 V IPP=2A, tp=8/20µs, Fwd 10.6 13.0 V IEC61000-4-2 (Contact) ±12 kV IEC61000-4-2 (Air) ±15 kV Reverse Bias=0V 0.95 1.1 1.25 pF Reverse Bias=1.65V 0.7 0.85 1.0 pF Reverse Bias=0V 0.5 pF Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1.50 0 1.40 I/O Capacitance (pF) Insertion Loss [dB] 1.30 -5 -10 -15 1.20 VCC = Float 1.10 1.00 VCC = 3.3V 0.90 0.80 VCC = 5V 0.70 0.60 -20 1.E+06 0.50 1.E+07 1.E+08 1.E+09 0.0 1.E+10 SP0504S Series 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O DC Bias (V) Frequency [Hz] 2 Revision: August 13, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP0504S Series Capacitance vs. Frequency Product Characteristics 2E-12 Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 1.6E-12 Capacitance [F] 1.4E-12 1.2E-12 1E-12 8E-13 6E-13 SP0504S 1.8E-12 4E-13 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. 2E-13 0 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Ordering Information Part Number Package Marking Min. Order Qty. SP0504SHTG SOT23-6 E*4 3000 Part Marking System E*4 SP0504S HTG Series ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Time °C Part Numbering System Silicon Protection Array (SPATM) Family of TVS Diode Arrays Critical Zone TL to TP Ramp-up 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition E*4 G= Green T= Tape & Reel Product Series Number of Channels E = SP0504S series Assembly Site (varies) Package H = SOT23-6 3 Revision: August 13, 2012 SP0504S Series TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP0504S Series Package Dimensions — SOT23-6 Package SOT23 Pins 6 JEDEC MO-178AB Millimeters Min Max Inches Min Max Notes A 0.900 1.450 0.035 0.057 - A1 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 ref e1 1.9 Ref 0.0748 Ref 0.30 L 0.600 0.012 8º 0º 6 N a 0º - 0.023 6 4,5 6 8º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - Recommended Solder Pad Layout Notes: 1. Dimensioning and tolerancing Per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Foot length L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. 6. “N” is the number of terminal positions. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. M P R O Embossed Carrier Tape & Reel Speciﬁcation — SOT23-6 8mm TAPE AND REEL 1.5mm DIA. HOLE ACCESS HOLE 14.4mm 4.0mm 1.75mm 2.0mm CL 8mm 4.0mm 13mm 180mm GENERAL INFORMATION SOT-23 (8mm POCKET PITCH) 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 60mm 8.4mm USER DIRECTION OF FEED SP0504S Series 4 Revision: August 13, 2012 PIN 1 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.