TYSEMI KRF7343

Transistors
IC
IC
IC
IC
SMD
SMD Type
Type
Product specification
KRF7343
Features
Generation V Technology
Ultra Low On-Resistance
Dual N and P Channel MOSFET
Surface Mount
Fully Avalanche Rated
Absolute Maximum Ratings Ta = 25
Parameter
Symbol
N-Channel
P-Channel
Unit
VDS
55
-55
V
ID
4.7
-3.4
Continuous Drain Current ,VGS@10V , Ta = 70
ID
3.8
-2.7
Pulsed Drain Current *1
IDM
38
-27
Drain-Source Voltage
Continuous Drain Current,VGS@10V , Ta = 25
Power Dissipation
@Ta= 25
*5
Power Dissipation
@Ta= 70
*5
2.0
PD
20
VGS
Single Pulse Avalanche Energy *3
EAS
72
4.7
Avalanche Current
IAR
Repetitive Avalanche Energy
EAR
Peak Diode Recovery dv/dt *2
dv/dt
Junction and Storage Temperature Range
R
V
114
-3.4
0.20
mJ
A
mJ
5.0
-5.0
V/ns
-55 to + 150
TJ, TSTG
Maximum Junction-to-Ambient *5
W
1.3
Gate-to-Source Voltage
A
62.5
JA
/W
*1 Repetitive rating; pulse width limited by max. junction temperature.
*2 N-Channel ISD
P-Channel ISD
4.7A, di/dt
220A/
s, VDD
V(BR)DSS, TJ
150
-3.4A, di/dt
-150A/
s, VDD
V(BR)DSS, TJ
150
*3 N-Channel Starting TJ = 25 , L = 6.5mH RG = 25 , IAS = 4.7A.
P-Channel Starting TJ = 25 , L = 20mH RG = 25 , IAS = -3.4A.
*5 Surface mounted on FR-4 board, t
*4 Pulse width
300 s; duty cycle
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10sec.
2%.
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IC
Transistors
IC
IC
IC
SMD
SMD Type
Type
Product specification
KRF7343
Electrical Characteristics Ta = 25
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Testconditons
Symbol
VGS = 0V, ID = 250 A
N-Ch
55
P-Ch
-55
V(BR)DSS/
ID = 1mA,Reference to 25
N-Ch
0.059
TJ
ID = -1mA,Reference to 25
P-Ch
0.054
RDS(on)
VGS = 4.5V, ID = 3.8A*1
VGS = -10V, ID = -3.4A*1
VGS = -4.5V, ID = -2.7A*1
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
VGS(th)
gfs
IDSS
IGSS
Total Gate Charge
Qg
Gate-to-Source Charge
Qgs
Gate-to-Drain ("Miller") Charge
Qgd
Turn-On Delay Time
td(on)
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
tr
td(off)
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
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P-Ch
V/
0.043 0.050
0.056 0.065
0.095 0.105
0.150 0.170
VDS = VGS, ID = -250 A
P-Ch
VDS = 10V, ID = 4.5A*1
N-Ch
VDS = -10V, ID = -3.5A*1
P-Ch
VDS = 55V, VGS = 0V
N-Ch
2.0
VDS = -55V, VGS = 0V
P-Ch
-2.0
VDS = 55V, VGS = 0V, TJ = 55
N-Ch
25
P-Ch
-25
VGS =
20V
V
S
N-Ch
100
P-Ch
100
N-Channel
N-Ch
24
36
ID =4.5A,VDS = 44V,VGS =10V
P-Ch
26
38
N-Ch
2.3
3.4
P-Channel
P-Ch
3.0
4.5
ID = -3.1A,VDS = -44V,VGS = -10V
N-Ch
7.0
10
P-Ch
8.4
13
N-Ch
8.3
12
N-Channel
VDD = 28V,ID = 1.0A,RG = 6.0
P-Ch
14
22
RD=16
N-Ch
3.2
4.8
P-Channel
P-Ch
10
15
VDD = -28V,ID = -1.0A,RG = 6.0
N-Ch
32
48
64
RD=16
N-Channel
VGS = 0V,VDS = 25V,f = 1.0MHz
P-Ch
43
N-Ch
13
20
P-Ch
22
32
N-Ch
740
P-Ch
690
N-Ch
190
P-Channel
P-Ch
210
VGS = 0V,VDS = -25V,f = 1.0MHz
N-Ch
71
P-Ch
86
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Unit
V
N-Ch
tf
Ciss
N-Ch
Max
VDS = VGS, ID = 250 A
VDS = -55V, VGS = 0V, TJ = 55
Gate-to-Source Forward Leakage
Typ
VGS = 0V, ID = -250 A
V(BR)DSS
VGS = 10V, ID = 4.7A*1
Static Drain-to-Source On-Resistance
Min
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A
nA
nC
ns
pF
2 of 3
IC
Transistors
IC
IC
IC
SMD
SMD Type
Type
Product specification
KRF7343
Electrical Characteristics Ta = 25
Parameter
Continuous Source Current
Pulsed Source Current
ISM
Body Diode) *2
VSD
Reverse Recovery Time
trr
Reverse RecoveryCharge
Qrr
300 s; duty cycle
Min
IS
Body Diode)
Diode Forward Voltage
*1 Pulse width
Testconditons
Symbol
Typ
Max
N-Ch
2.0
P-Ch
-2.0
N-Ch
38
P-Ch
N-Ch
0.70
1.2
TJ = 25 , IS = -2.0A, VGS = 0V*1
P-Ch
0.80
-1.2
TJ = 25 , IF =2.0A,di/dt = 100A/
s*1
P-Channel
TJ=25 ,IF=-2.0A,di/dt=-100A/
s*1
A
-27
TJ = 25 , IS = 2.0A, VGS = 0V*1
N-Channel
Unit
N-Ch
60
90
P-Ch
54
80
N-Ch
120
170
P-Ch
85
130
V
ns
nC
2%.
*2 Repetitive rating; pulse width limited by max. junction temperature.
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[email protected]
4008-318-123
3 of 3