A Technological Breakthrough Fluid Free Operation Fast Thermal Cycling 50°C/min Compact & Portable Design No Compressed Air Required Ultra Quiet Operation 40dBA Low Cost of Ownership Flex TC BENCHTOP TEMPERATURE FORCING SYSTEM FOR THERMAL CYCLING OF DUT’S FROM -55C° TO +250C° and testing laboratories, semiconductor startups and fabless companies. FlexTC provides a reliable self-contained system that is compact and extremely economical to own and operate. The system requires a 10A wall outlet and clean dry air or nitrogen for frost and humidity free operation. For additional flexibility the system can be controlled remotely through Developed for Laboratory Environments the Ethernet communication port. Experienced thermal engineers designed FlexTC to meet the stringent standards Fast & Powerful Cooling Capacity required for failure analysis or device FlexTC offers unmatched cooling speed and characterization within vertically integrated capacity achieving -40°C within 2 minutes. In semiconductor companies, chip debugging addition, this is the only system robust and powerful enough to cool high power devices. FlexTC stimulates DUT’s to the desired temperature by direct conduction between the thermal head’s plunger and the DUT. FlexTC can then maintain that temperature for an extended period of time. Benefits of Fluid Free Operation One of the biggest advantages of FlexTC is its fluid free operation. By eliminating the coolant fluid you eliminate any risk of fluid leaks that would severally damage expensive test equipment located anywhere near the spill. Features Temperature range of -55°C to +250°C Compact Footprint – Fits easily on a bench top Self-Contained – No external chiller and no compressed air required Rapid Temperature Cycling Rates (50°C/min Max, not on the entire range) Fluid-Free Operation Low cost of ownership Maintenance-Free system Environmentally Friendly Operation ESD-SAFE Integrates into production test handlers Tcase and embedded thermal diode temperature sensing Ethernet (TCP/IP) Remote Interface Suitable for testing soldered devices and devices in sockets Integrates with every existing socket on the market Packages Supported: •BGA •FCBGA •LGA •QFN •QFP Very convenient and compact. •CSP •WLCSP •Bare Die and more (FlexTC operating in a customer’s lab) Specifications System General Maximum Temperature Minimum Temperature Temperature Accuracy Typical Transition Rates Temperature Sensor Remote Interface Ports System Indicators and Fail-safes Operating Units DUT Pressure Force DUT Dimensions DB Rating MTBF 250 °C -55°C < 0.2° C 25°C to -40°C in, < 2 minutes Tcase PT100 Thermisor/ K-type thermocouple/ Thermal-Diode through the Ethernet or Analog ports Ethernet (TCP / IP) Thermal head overtemperature, Fans operation, Cooling units operation, °C 2 - 100 Kg / Force ≤ 2 x 2 mm 40 d BA 70,000hr Mechanical Dimensions System Enclosure mm / (inch) System Weight Thermal Head (mm) Thermal Head Hose L 420 (16.5) x W 320 (12.5) x H 220 (8.5) 22 KG 80mm Diameter 2 meter (6.5ft )standard/ 3 meter (10ft) max. System Requirments Electrical Ambient Temperature Ambient Humidity 100/115/120/220/230/240 VAC ±10% 50/60 Hz, single phase, 10A Max. 5°C to 35 °C (40 to 95°F) 20% to 95% RH Operator Interface FlexTC is operated by a robust PLC, controlled by a full color 7” touch-screen with a menu driven graphical user interface that is intuitive and easy-to-use. -30-+20 10-60 50-100 90-140 20.0 15.0 10.0 5.0 0.0 -5.0 -10.0 -15.0 -20.0 -25.0 -30.0 01:00:14 9/3/2010 · USER · SYSTEM TC control 01:02:14 9/3/2010 Temp Graph Temperature set points Preset temperature key buttons Ramp/Soak/Cycle profile programming, save & upload Ramp rate increment controls Stand-by operation mode Temperature is displayed and recorded Temperature overshooting control LabVIEW/C++/MATLAB /Visual Basic /Perl / Tickle command interfaces Software screen temperature graph Thermal head interface options FlexTC creates a direct mechanical contact with the DUT using one of the following interface options: 1. Custom Adaptor plate - for sockets and soldered device applications 2. Universal Adaptor plate - for sockets and soldered device applications 3. Thermocouple inserted Lids - for sockets applications 4. Open Frame thermal lids - for sockets and soldered device applications 5. Boom Stand Arm - For soldered device applications Universal adapter plate attched to board 6. Pneumatic Head Assembly - for sockets applications 7. FlexTC ready sockets - eliminates the need for a mechanical Interface, consult with your sockets manufacturer Interchangeable Device Plungers Device Plungers are installed in the FlexTC thermal head by operators in the field , their selection determines the temperature range and the cooling power performances of the FlexTC. Device plungers are constructed of Nickel-plated copper. PN# Temp Range *Thermal Load (Watt) MDDT-485 -55C to +155C 21Watt @ -40C MDDT-486 -45C to +155C 45watt @ -30C MDDT-488 Up to +250C DUT Dimensions ≤ 2 x 2 mm ≤ 2 x 2 mm ≤ 2 x 2 mm *Thermal Load = Device Power Dissipation + Board Thermal Mass + Purge influences Inserting device plunger into thermal head Humidity and Frost Free Control The FlexTC thermal head includes nozzles for dry air or dry nitrogen purging Purging is software controlled via the access line on the rear back panel A constant flow creates a frost and humidity free shield around the DUT Flow is diverted away from the test area to avoid unwanted thermal losses Back panel purge inlet Device plunger