GHz BGA Socket - Direct mount, solderless Features • Directly mounts to target PCB (needs tooling holes) with hardware • High speed reliable elastomer connection • Minimum real estate required • Compression plate distributes forces evenly • Easily removable swivel socket lid 40.00 fan size A1 corner G G 55.00 Heat Sink TOP VIEW Recommended torque is 8 in lb for 835 pin BGA and 9 in lb for 961 pin BGA. Remove fan before torquing 32.00 Fan Sunon ME40101VX-000U-A99, 12V, 130 mA, 2 wire, 9.9 CFM Customer's target PCB customer's BGA device 10.00 fan 37.85 12.3540 11.7940 11.3875 SECTION G-G A 11.3875 32.225 socket size 11.3875 34.725 backing plate size 7.00 heat sink screw 3.40 backing plate 1.2060 dowel pin 11.3875 Description: Ghz Socket for 27x27mm, 31x31 0.8mm pitch BGA DETAIL A SCALE 4 : 1 Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SG-BGA-6424 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 117.97 STATUS: Released SHEET: 1 OF 4 REV. A ENG: E. Smolentseva DRAWN BY: M. Raske SCALE: 2:2 FILE: SG-BGA-6424 Dwg DATE: 4/16/2015 *Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.70±0.10 (x4) non plated mounting holes A1 corner 11.625 12.375 0.850±0.025 (x2) non plated alignment holes 12.3225±0.0250 12.00 34.7250±0.1250 backing plate outline 32.225±0.125 socket outline 9.7825±0.025 14.8625±0.025 (x4) 2.8625 3.2375* 0.50 pad 24.00 14.8625±0.025 14.8625±0.025 Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 117.97 The full array is shown. Adjust for your pattern. Target PCB Recommendations Total thickness: 2.1mm (1.6mm min). Plating: Gold or Solder finish Description: Recommended PCB layout SG-BGA-6424 Drawing Note: PCB Pad height: Same or higher than solder mask STATUS: Released SHEET: 2 OF 4 REV. A ENG: E. Smolentseva DRAWN BY: M. Raske SCALE: 3:1 FILE: SG-BGA-6424 Dwg DATE: 4/16/2015 A 27.0 0.50±0.05 0.20 M C A B 0.08 M C 2.48 MAX A1 corner 23.0 D 0.3 1.78±0.18 27.0 A1 corner 0.80 22.2 23.0 C 1.50 0.20 C 0.4±0.1 4x R0.5 - 1.25 0.15 M 0.10 C 1.06 NOM 0.80 1.50 0.20 C 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. 31 x 31 array Description: BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SG-BGA-6424 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 117.97 STATUS: Released SHEET: 3 OF 4 REV. A ENG: E. Smolentseva DRAWN BY: M. Raske SCALE: 2.75:1 FILE: SG-BGA-6424 Dwg DATE: 4/16/2015 ITEM NO. 1 DESCRIPTION Material Socket Base, 32.225 X 32.225 7075-T6 Aluminum Alloy 2 Socket Lid, 32.225 X 32.225 7075-T6 Aluminum Alloy 3 Compression Plate, 26.95 X 26.95 7075-T6 Aluminum Alloy 4 Heatsink assembly with fan and four 4-40 screws Heatsink is Aluminum. Fan is Sunon ME40101VX-000U-A99, 12V, 130mA, 9.9 CFM 2 wire; Screws are black oxide steel alloy 5 Elastomer Guide 27mm IC Ultem 1000 6 Elastomer 0.75mm thick 40 Micron gold plated filaments arranged symmetrically in a silicone rubber( 63.5 degree angle) 20 Micron dia gold plated brass filaments arranged symettrically in a silicon rubber (63.5 degree angle) 7 #0-80 Shoulder Screw, 0.090" thread length Stainless Steel (303) 8 Customer's device FR4 Standard 9 Customer's target PCB FR4 Standard 10 Ball Guide 27x27mm, 0.8mm, 33x33 array Kapton Polyimide/Cirlex 4 2 15 3 7 8 1 11 Insulation Plate 27mm IC FR4 12 Backing Plate 7075-T6 Aluminum Alloy 13 Dowel Pin, 1/32" x 3/16", SS Chrome Stainless Steel 14 #0-80 X 7/16" LG, SOC HD CAP SCREW Stainless Steel (304) 15 IC Frame Torlon 4203 13 1.59 29.725±0.050 14 10 6 1.27 (x4) 5 10.00 9 12 11 5.03 (x4) Description: Skt, Insulation Plate, Pin Det Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SG-BGA-6424 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 117.97 34.725 16.00 (x4) 1.70±0.10 (x4) BACKING AND INSULATING PLATE STATUS: Released SHEET: 4 OF 4 REV. A ENG: E. Smolentseva DRAWN BY: M. Raske SCALE: 3:2 FILE: SG-BGA-6424 Dwg DATE: 4/16/2015 3.40