SG-BGA-6082 Dwg.mcd - Ironwood Electronics

GHz BGA Socket - Direct mount, solderless
Features
Top View
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
47.725mm
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
A
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 7.5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 4.0mm.
47.725mm
4
Recommended torque = 32.5 in/lbs.
Side View
(Section AA)
5
4
1
3
Assembled
10.01mm +
IC thickness
9
Elastomer Guide: Cirlex or equivalent.
Thickness = 0.725mm.
7
Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10
Insulation Plate: FR4/G10, 1.59mm thick.
8
6
10
Customer's
BGA IC
11
SG-BGA-6082 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
11
5
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
2
7
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Backing Plate: Anodized Aluminum 6.35mm thick.
Customer's Target PCB
Status: Released
Scale: -
Rev: D
Drawing: Heidi Hansen
Date: 4/3/03
File: SG-BGA-6082 Dwg.mcd
Modified: 4/13/11, RP
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4
Recommended PCB Layout
Top View
*Note: BGA pattern is not symmetrical
with respect to the mounting holes. It is
offset 0.375mm to the right of center with
respect to mounting holes.
1.25mm±0.13mm(x4)
Orientation Mark
2.49mm*
1mm typ.
1.25mm±0.13mm(x4)
2.54mm
2.11mm
Ø 0.85mm±0.025mm(x2)
Non plated alignment hole
47.725mm±0.125mm(x4)
Socket size
Ø 0.51mmxPAD
5.08mm
2.5mm±0.13mm
22.6125mm(x8)
Ø 1.61mm±0.05mm(x8)
Mounting Hole
2.5mm±0.13mm
50.225mm±0.125mm(x4)
Backing plate size
Target PCB Recommendations
Total thickness: 2.4mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: Steel backing plate may be required based on end user's application
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
Full pattern shown. Please adjust as per individual requirements.
SG-BGA-6082 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: D
Drawing: Heidi Hansen
Date: 4/3/03
File: SG-BGA-6082 Dwg.mcd
Modified: 4/13/11, RP
PAGE 2 of 4
Compatible BGA Spec: BGA1764 (and sub-set arrays)
DETAIL
Y
D
X
e
E
3 Øb
Ø0.25 Z X Y
Ø0.10
0.20
BOTTOM VIEW
SIDE VIEW
TOP VIEW
1.
Dimensions are in millimeters.
2.
Interpret dimensions and tolerances
per ASME Y14.5M-1994.
5
DETAIL
0.20 Z
3
A
A1
Z
4
SG-BGA-6082 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
DIM
Dimension b is measured at the
maximum solder ball diameter, parallel
to datum plane Z.
4
Datum Z (seating plane) is defined by
the spherical crowns of the solder balls.
5
Parallelism measurement shall exclude
any effect of mark on top surface of
package.
0.2 Z
Status: Released
Scale: -
MIN
MAX
3.45
A
A1
0.60
0.40
b
0.70
D
42.50 BSC
E
42.50 BSC
e
1.0 BSC
Array: 42x42
Rev: D
Drawing: Heidi Hansen
Date: 4/3/03
File: SG-BGA-6082 Dwg.mcd
Modified: 4/13/11, RP
PAGE 3 of 4
2.5mm
1.27mm (x4)
2.5mm
22.613mm±0.025mm (x8)
50.225mm
Top View
10mm Sqr.
23mm (x4)
50.225mm
1.59mm
Side View
Insulation Plate
6.35mm
Backing Plate
Description: Backing Plate with Insulation Plate
SG-BGA-6082 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: D
Drawing: Heidi Hansen
Date: 4/3/03
File: SG-BGA-6082 Dwg.mcd
Modified: 4/13/11, RP
All dimensions are in mm.
All tolerences are +/- 0.125mm.
(Unless stated otherwise)
PAGE 4 of 4