GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 26.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 26.225mm Side View (Section AA) 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Black anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, 1.59mm thick. 11 Backing Plate: Anodized Aluminum 6.35mm thick. Recommended torque = 5 - 7 in lbs. 4 1 3 Assembled 8.25mm + IC thickness 9 2 8 7 10 6 Customer's BGA IC 11 5 Customer's Target PCB Scale: - SG-BGA-6202 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/27/06 File: SG-BGA-6202 Dwg.mcd Modified: 7/8/09, AE Rev: C All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 *Note: BGA pattern is not symmetrical with respect to the mounting holes. Recommended PCB Layout Top View 1.25mm±0.13mm(x4) 2.74mm* Orientation Mark 1mm typ. 1.25mm±0.13mm(x4) 2.36mm 2.54mm Ø 0.85mm±0.025mm (x2) 26.225mm±0.125mm(x4) Socket size 5.08mm Ø 0.51mm PAD Ø 1.61mm±0.05mm (x4) 19mm(x4) Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 23.725mm(x4) 28.725mm sq. backing plate Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6202 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: 2:1 Rev: C Drawing: J. Glab Date: 10/27/06 File: SG-BGA-6202 Dwg.mcd Modified: 7/8/09, AE PAGE 2 of 4 Compatible BGA Spec SIDE VIEW (Reference Only) TOP VIEW (Reference Only) DETAIL Y X 5 DETAIL D 0.25 Z A Z A1 0.15 Z 4 E 0.20 BOTTOM VIEW (Reference Only) e 3 DIM 1 Dimensions are in millimeters. 2 Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. MIN MAX 2.2 A A1 0.5 0.3 b 0.7 D 21.00 BSC E 21.00 BSC e 1.0 BSC Øb Array 20x20 Ø0.25 Z X Y Ø0.10 Scale: - SG-BGA-6202 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/27/06 File: SG-BGA-6202 Dwg.mcd Modified: 7/8/09, AE Rev: C PAGE 3 of 4 28.73mm 2.5mm 1.27mm (x4) 2.5mm Top View 28.73mm 23.725mm±0.025mm 3mm 6.5mm 6mm sqr. Note: Backing plate holes are tapped to accept 0-80 screws. 14.94mm 23.725mm±0.025mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Backing Plate with Insulation Plate Scale: - SG-BGA-6202 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/27/06 File: SG-BGA-6202 Dwg.mcd Modified: 7/8/09, AE Rev: C All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 4 of 4