SODF151T-SH thru SODF157T-SH Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.5A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Cavity-free glass passivated junction * Capable of meeting environmental standards of MIL-S-19500 * Typical IR less than 1.0µA * High temperature soldering guaranteed: 260°C/10 seconds Mechanical Data Case: JEDEC SOD123-FL/MINI SMA, molded plastic over glass DIE We declare that the material of product is Terminals: Plated leads, solderable per Haloggen free (green epoxy compound) MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0155 g Handling precautin:None Electrical Characteristic 1.Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol Device marking code SOD F151TSH SOD F152TSH SOD F153TSH SOD F154TSH SOD F155TSH SOD F156TSH SOD F157TSH Unit G1T G2T G3T G4T G5T G6T G7T Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward rectified current lead length at TC = 75°C(Note 2) IF(AV) 1.5 A Peak forward surge current 8.3ms single half sinewave superimposed on rated load (JEDEC Method) IFSM 50 A Typical reverse recovery time (Note 1) trr Typical thermal resistance (Note 2) Operating junction temperature range storage temperature range 100 160 150 V ns RθJA 75 °C/W TJ –55 to +150 °C TSTG –65 to +175 °C Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol SOD F151TSH SOD F152TSH SOD F153TSH SOD F154TSH SOD F155TSH SOD F156TSH SOD F157TSH Unit Maximum instantaneous forward voltage at 1.5A VF 1.3 V Maximum DC reverse current TJ= 25°C at rated DC blocking voltage TJ = 125°C IR 5.0 100 µA Typical junction capacitance at 4.0V, 1MHz (Note 2) CJ 15.0 PF NOTES: 1. IF = 0.5A, IR = 1.0A, IRR = 0.25A 2. 8.0mm2 (.013mm thick) land areas SODF151T-SH thru SODF157T-SH 2. Characteristic Curves ( TA = 25°C unless otherwise noted ) Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current 60 Hz Resistive or Inductive Load 1.5 0.75 0.375" (9.5mm) Lead Length 0 0 0.1 TJ = 25°C Pulse width = 300µs 1% Duty Cycle 0.01 0.001 0.6 25 0 0.8 1.0 1.2 1.4 Instantaneous Forward Voltage 10 Number of Cycles at 60Hz 100 10 Tj=125℃ 1.0 Tj=75℃ 0.1 Tj=25℃ 0.01 1.6 Fig 5. –typical transient thermal impedance 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Fig 6. – Typical Junction Capacitance 10 1.0 0.1 100 10 TJ = 25°C f = 1.0 MHz Vsig = 50mVp-p 1.0 0.01 0.1 1.0 10 t,Pulse duration,sec 100 100 Fig 4. – Typical Reverse Characteristics Junction Capacitance (pF) Transient thermal impedance(° 50 1 Instantaneous Reverse Current (µA) 1.0 100 TJ = TJ max 8.3ms Single Half Sine-wave (JEDEC Method) 25 50 75 100 125 150 175 CASE TEMPERATURE:Tc(°C) Fig 3. – Typical Instantaneous Forward Characteristics 10 Instantaneous Forward Current (A) Average Forward Rectified Current (A) Average Forward Rectified Current (A) Fig. 1 – Forward Current Derating Curve 0.1 1 10 Reverse Voltage (V) SODF151T-SH thru SODF157T-SH 3. dimension: SOD123-FL MILLIMETERS MIN MAX 3.5 3.9 0.75 0.95 2.6 3.0 1.6 2.0 0.45Typ 0.9 1.2 0.12 0.22 0.8Typ DIM A B C D E H J K INCHES MIN MAX 0.138 0.159 0.029 0.037 0.103 0.119 0.063 0.079 0.018Typ 0.036 0.047 0.005 0.009 0.032Typ Suggested solder pad layout B C A Dimensions in inches and (millimeters) PACKAGE A B C SOD123-FL 0.044(1.10 0.040(1.00) 0.079(2.00) Title : DOC NO.： Power Diode SMD Package Pa cking Spec Version: 5 WI-258 Modification: 0 Page: 2 5.1 、SMD Packing Reel Spec & Packing Quantity 5.1.1 Reel Packing A. Reel Spec unit：mm SPEC SMA 7" reel SMA13" reel SMA-FL13" reel TO277 13" reel SOD123FL 7" reel SOD323HE 7" reel SMB-FL 13" reel A 177.0±2.0 330.0±2.0 330.0±2.0 330.0±2.0 177.0±2.0 177.0±2.0 330.0±2.0 B 54.0±0.5 75.0±0.5 75.0±0.5 75.0±0.5 50.0±0.5 50.0±0.5 75.0±0.5 C 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 W 13.2±0.2 13.2±0.2 13.2±0.2 13.2±0.2 9.4±1.5 9.4±1.5 13.2±0.2 Quantity/Reel 2K 5K 5K 5K 3K 3K 5K B. 13" reel packing box unit：mm A 335±5.0 size B 335±2.0 as per above packing Spec SMA13" reel TO277 13" reel SMB-FL 13" reel Q'ty/Box 10K 10K 10K C 40±1.0 Title : Power Diode SMD Package Packing Spec DOC NO.： WI-258 DOC NO.： WI-258 Page: 3 C. 7" reel packing box unit：mm B 188±2.0 C 138±2.0 186±2.0 139±2.0 as per above packing Q'ty/Box 16K SMA/SMA-FL SOD123FL 30K SOD323HE 30K 185±2.0 SMA/SMA-FL A 188±2.0 SOD123FL SOD323HE D. reel packing carton unit：mm A 350±2.0 size B 340±2.0 C 350±2.0 as per above packing Spec SMA/SMA-FL 7" reel SMA13"reel SMA-FL13"reel TO277 13" reel SMB-FL 13" reel Q'ty/Carton 80K 80K 80K 80K 80K unit：mm SOD123FL SOD323HE A B C 455±2.0 400±2.0 410±2.0 as per above packing Spec SOD123-FL 7" reel SOD323HE 7" reel 5.1.2 Tape Spec A. Cover Tape unit：mm A SMA /SMA-FL SMB-FL /TO277 B 9.5±0.10 SOD123FL 5.4±0.10 SOD323HE 0.062±0.007 Q'ty/Carton 360K 360K Title : DOC NO.： Power Diode SMD Package Packing Spec Version: 5 WI-258 Modification: 0 Page: 4 B. Carrier Tape Do P2 Po t P1 A D1 A' Bo W F E B' B SEC.:B-B' Cathode(tape hole side） Ko Ao SEC.:A-A' Item W P1 E F D0 D1 P0 P2 10P0 A0 B0 K0 SOD323HE 8±0.3 4±0.1 1.75±0.1 3.5±.05 1.55±0.05 1.1±0.1 4±0.1 2±0.05 40±0.2 1.45±0.1 2.75±0.1 0.80±0.1 SOD123FL 8±0.3 4±0.1 1.75±0.1 3.5±.05 1.55±0.05 1.1±0.1 4±0.1 2±0.05 40±0.2 1.95±0.1 3.95±0.1 1.30±0.1 SMA 12±0.3 4±0.1 1.75±0.1 5.5±.05 1.55±0.05 1.5±0.1 4±0.1 2±0.05 40±0.2 2.79±0.1 5.33±0.1 2.36±0.1 T 0.25±0.05 0.25±0.05 0.25±0.05 SMA-FL 12±0.3 4±0.1 1.75±0.1 5.5±.05 1.55±0.05 1.5±0.1 4±0.1 2±0.05 40±0.2 2.83±0.1 4.75±0.1 1.42±0.1 SMB-FL TO277 12±0.3 12±0.3 8±0.1 8±0.1 1.75±0.1 1.75±0.1 5.5±0.05 5.5±.05 1.55±0.05 1.55±0.05 1.55±0.05 1.5±0.1 4±0.1 4±0.1 2±0.05 2±0.05 40±0.2 40±0.2 4.3±0.1 3.8±0.1 5.75±0.1 6.8±0.1 1.35±0.1 1.4±0.1 0.25±0.05 0.25±0.05 0.25±0.05 Title : DOC NO.： Power Diode SMD Package Packing Spec Version: 5 WI-258 Modification: 0 Page: 5 5.2、SMD Power Diode General Packing Spec A. 7" reel all labels will be at cathode side of reel ； Ｂ C A C side front A:LRC label; B:Environment Label C:Halide free label B. 13" reel A Ｂ C Ｂ C A A:LRC label; B:Environment Labe C:Halide free label C.Tape lead: face anode side of the reel,upper side is the tape lead position. All labels are at cathode side of the reel. 标题: DOC NO.： Power Diode SMD Package Packing Spec Version: 5 Modification: 0 Page: C. Label Content ： LRC Label WI-258 6 Two-dimension code Manufacturing it P/N ` Lot No. Date code Maker Quantity lot: 140106049X: 140106---2014/1/6；049----lot number:49；X：product code Environment Label Halide-free Label Green SODF151T-SH thru SODF157T-SH Reel packing PACKAGE REEL SIZE SOD123-FL 7" COMPONENT REEL SPACING (PCS) (mm) 3,000 4.0 BOX INNER BOX REEL DIA. (pcs) (mm) (mm) 30,000 183*183*123 178 5.Suggested thermal profile for soldering process 1. Storage environment：Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3℃/sec Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(ts) 150℃ 200℃ 60~120sec Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time(tL) Peak Temperature(TP) Time within 5℃ of actual Peak Temperature(TP) Ramp-down Rate Time 25℃ to Peak Temperature <3sec 217℃ 60-260sec 255 -0/+5℃ 10~30sec <6℃/sec <6minutes CARTON SIZE (mm) 382*262*387 APPOX. CARTON GROSS (PCS) WEIGHT 240,000 (kg) 8.7 SODF151T-SH thru SODF157T-SH 6.High reliability test capabilities Item Test Condition Reference Solder Resistance at 260±5℃ for 10±2sec immerse body into solder 1/16" ± 1/32" MIL-STD-750D METHOD-2031 Solderability at 245±5℃ for 5 sec MIL-STD-202F METHOD-208 High Temperature Reverse Bias VR=80% rate at Tj=150℃ for 168hrs MIL-STD-750D METHOD-1038 Forward Operation Life Rated average rectifier current TA=25℃ for 500hrs MIL-STD-750D METHOD-1027 Intermittent Operation Life TA=25℃，IF=IO On state:power on for 5 min. Off state:power off for 5 min. on and off for 500 cycles MIL-STD-750D METHOD-1036 Pressure Cooker 15PSIG at TA=121℃ for 4hrs JESD22-A102 Temperature Cycling -55℃ to +125℃ dwelled for 30 min. and transferred for 5min. Total 10 cycles MIL-STD-750D METHOD-1051 Thermal Shock 0℃ for 5min. Rise to 100℃ for 5min. Total 10 cycles MIL-STD-750D METHOD-1056 Forward Surge 8.3ms single half sine-wave superimposed on rated load,one surge MIL-STD-750D METHOD-4066-2 Humidity at TA=85℃，RH=85% for 1000hrs MIL-STD-750D METHOD-1021 High Temperature Storage Life at 175℃ for 1000hrs MIL-STD-750D METHOD-1031 SODF151T-SH thru SODF157T-SH 7. Update Record 版次 更新记录 更新作者 更新日期 1 第一版 周杰 2013.03.20