Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 Package: Total Device Weight April, 2004 % of Total Pkg. Wt. Weight (g) Die 2.77% 0.029 Mold 66.87% 0.675 D/A Epoxy 0.24% 0.07% 0.001 Lead Plating 2.34% 0.024 27.71% with SnPb Plating % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon 7440-21-3 Die size: 4.0 x 6.0 mm. Mold Compound Density varies between 1.7 and 2.3 grams/cc 60 to 90% Silica Fused (LSC uses 69.7% in our calculation) 15 to 40% Epoxy Resin (LSC uses 25% in our calculation). o) NOTE: Total includes Phenol and Epoxy resins (exact % is Trade secret) 1% to 5% Antimony Trioxide (LSC uses 3% in our calculation) 1 to 3% Brominated Epoxy Resin (LSC uses 2% in our calculation). 0.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation) 0.471 0.169 0.020 0.014 0.002 Silica Epoxy Resin Antimony Trioxide Brominated Epoxy resin Carbon black 60676-86-0 129915-35-1 1309-64-4 68928-70-1 1333-86-4 0.19% 0.05% 0.002 0.0005 Silver-filled Epoxy Silver (Ag) other 7440-22-4 - Die attach epoxy Density: 4 grams/cc (silver content: 60-100%; LSC uses 80% in our calculation) Gold (Au) 7440-57-5 1.2 mil wire diameter; 1 wire for each package lead; wire length 3 mm Nominal: 85% Sn, 15% Pb Thickness is 0.015mm 1.99% 0.35% 0.020 0.004 Tin (Sn) Lead (Pb) 7440-31-5 7439-92-1 27.01% 0.65% 0.03% 0.02% 0.273 0.007 0.0003 0.0002 Copper (Cu) Iron (Fe) Zinc (Zn) Phosphorus (P) 7440-50-8 0.280 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Notes / Assumptions: 46.61% 16.72% 2.01% 1.34% 0.20% 0.002 Wire Leadframe 16 PDIP 1.01 Grams 7439-89-6 7440-66-6 7723-14-0 Leadframe composition (C194): 97.46% Cu 2.35% Fe 0.12% Zn 0.07% P Leadframe thickness is nominal (per Case Outline).