Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 2.52% 0.0197 Mold 41.27% 0.323 D/A Epoxy 0.25% 0.78% 0.0061 Solder Balls 25.87% 0.202 Foil 22.97% 6.33% with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. MSL: 3 Peak Reflow Temp: 250°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 5.05 x 4.41 mm 36.40% 2.06% 2.06% 0.62% 0.12% 0.285 0.0161 0.0161 0.0048 0.0010 Silica (Fused or Amorphous) Epoxy resin Phenol resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 0.20% 0.05% 0.0016 0.0004 Silver (Ag) Organic esters and resins 7440-22-4 - Mold Compound composition: 75 to 95% Silica Fused or Amorphous (LSC uses 88.2% in our calculation) 2 to 10% Epoxy resin (LSC uses 5% in our calculation) 2 to 10% Phenol resin (LSC uses 5% in our calculation) 0 to 2.5% Metal Hydroxide (LSC uses 1.5% in our calculation) 0 to 0.5% Carbon black (LSC uses 0.3% in our calculation) Mold Compound Density ranges between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 1.00 mil diameter; 1 wire per package lead; wire length 3 mm Qualified Solder ball compositions: Sn95.5/Ag4/Cu0.5 Sn96.5/Ag3/Cu0.5 LSC uses: Sn96/Ag3.5/Cu0.5 for calculations 0.0020 Wire Substrate 208 fpBGA 0.78 Grams 24.84% 0.91% 0.13% 0.1942 0.0071 0.0010 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 15.62% 7.35% 0.1222 0.0575 Glass fiber BT Resins 65997-17-3 - Copper (Cu) 7440-50-8 0.180 0.0495 60 to 75% glass fiber (LSC uses 68% in our calculation) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B4