Datasheet - Littelfuse

TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SD05 Series
SD05 Series 450W Discrete Unidirectional TVS Diode
RoHS
Pb GREEN
Description
The SD05 TVS diode is designed to replace multilayer
varistors (MLVs) in electronic equipment for low speed and
DC applications. It will protect any sensitive equipment
from damage due to electrostatic discharge (ESD) and
other transient events.
The SD05 can safely absorb repetitive ESD strikes
at ±30kV (contact discharge, IEC 61000-4-2) without
performance degradation and safely dissipate 30A of
8/20μs induced surge current (IEC61000-4-5) with very low
clamping voltages.
Pinout and Functional Block Diagram
1
Features
• ESD, IEC61000-4-2,
±30kV contact, ±30kV air
• Low clamping voltage
• EFT, IEC61000-4-4, 40A
(5/50ns)
• Small SOD323 package
fits 0805 footprints
• Low leakage current
• Lightning, IEC61000-4-5,
30A (tP=8/20μs)
Applications
2
• Switches / Buttons
• Medical Equipment
• Test Equipment /
Instrumentation
• Notebooks / Desktops /
Servers
• Point-of-Sale Terminals
• Computer Peripherals
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Additional Information
Datasheet
Resources
Samples
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SD05 Series
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
IPP
Peak Current (tp=8/20μs)
30
A
Ppk
Peak Pulse Power (tp=8/20μs)
450
W
TOP
Operating Temperature
–40 to 125
°C
TSTOR
Storage Temperature
–55 to 150
°C
Notes:
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Storage Temperature Range
Rating
Units
–55 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 20-40s)
260
°C
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Test Conditions
Min
VR
IR=1mA
6
Reverse Standoff Voltage
VRWM
IR≤1μA
5.0
V
Leakage Current
ILEAK
VR=5V
1.0
μA
Reverse Voltage Drop
Clamp Voltage1
VC
Dynamic Resistance
RDYN
ESD Withstand Voltage1
VESD
Diode Capacitance1
Typ
Max
Units
V
IPP=1A, tp=8/20µs, Fwd
8.0
V
IPP=2A, tp=8/20µs, Fwd
8.5
V
IPP=10A, tP=8/20μs, Fwd
11.8
V
IPP=24A, tP=8/20μs, Fwd
16.8
V
(VC2 - VC1) / (IPP2 - IPP1)
0.5
Ω
IEC61000-4-2 (Contact Discharge)
±30
kV
IEC61000-4-2 (Air Discharge)
±30
kV
CD
Reverse Bias=0V, f=1MHz
350
pF
Note:
Parameter is guaranteed by design and/or device characterization.
1
Capacitance vs. Reverse Bias
Non-Repetitive Peak Pulse Power vs. Pulse Time
300.0
pk (kW)
10
200.0
Peak Pulse Power - P
Capacitance (pF)
250.0
150.0
100.0
50.0
0.0
1
0.1
0.01
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Bias Voltage (V)
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
3.5
4.0
4.5
5.0
0.1
1
10
100
Pulse Duration - t p (µs)
1000
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SD05 Series
Pulse Waveform
110
110%
100
100%
90
90%
80
80%
70
Percent of IPP
% of Rated Power I PP
Power Derating Curve
60
50
40
30
50%
40%
30%
20
20%
10
0
70%
60%
10%
0
25
50
75
100
125
150
0%
Ambient Temperature - T A (oC)
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Time (μs)
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
tP
TP
Temperature
Reflow Condition
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
Time
Product Characteristics
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SD05 Series
Part Marking System
Part Numbering System
SD05 – 01 F T G
G= Green
g
TVS Diode Arrays
(SPA® Diodes)
Series
Number of
Channels
T= Tape & Reel
Package
F: SOD323
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SD05-01FTG
SOD323
g
3000
Package Dimensions -SOD323
SOD323
E
A2
A1
Symbol
Millimeters
Min
D
b
A
L1
L
0.2
L
Max
0.039
A1
0.00
0.10
0.000
0.004
A2
0.80
0.90
0.031
0.035
b
0.25
0.35
0.010
0.014
c
0.08
0.15
0.003
0.006
D
1.20
1.40
0.047
0.055
E
1.60
1.80
0.063
0.071
E1
2.50
2.70
0.098
0.106
0.475 REF
L
c
Min
1.00
A
E1
Inches
Max
0.019 REF
L1
0.25
0.40
0.010
0.016
Ø
0º
8º
0º
8º
Embossed Carrier Tape & Reel Specification — SOD323
2.00
4.00
ø1.50
ø178
6
R7
5.
R2
12.3
0
1.75
8.
3000
2500
2000
500
54.4
5.6
.5
1000
R2
R6
A
8.00
A
3.50
1500
B
12.3
4.00
B
9.5
0.254
1.25
2.90
1.46
Cover Tape
A-A
B-B
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/13