TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3001 Series SP3001 Series 0.65pF Diode Array RoHS Pb GREEN Description The SP3001 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Features Pinout I/O 1 I/O 4 GND VCC I/O 2 • Low leakage current of 0.5μA (MAX) at 5V • ESD protection of ±8kV contact discharge, ±15kV air discharge, (IEC61000-4-2) • Small SC70 ( JEDEC MO203) package saves board space • EFT protection, IEC61000-4-4, 40A (5/50ns) I/O 3 • Lightning Protection, IEC61000-4-5, 2.5A (8/20µs) Applications Functional Block Diagram I/O2 • Low capacitance of 0.65pF (TYP) per I/O I/O4 VCC • Computer Peripherals • Network Hardware/Ports • Mobile Phones • Test Equipment • PDA’s • Medical Equipment • Digital Cameras GND I/O1 Application Example I/O3 +5V D2+ Additional Information D2+ Gnd D2- D26 5 4 SP300x-04 1 2 3 D1+ Datasheet Resources Samples D1+ Gnd D1HDMI or DVI Connector D1HDMI or DVI Interface IC D0+ D0+ Gnd D0- D06 5 4 SP300x-04 1 2 3 Clk+ Clk+ Gnd Clk- ClkGnd A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be floated or NC. Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3001 Series Absolute Maximum Ratings Symbol Thermal Information Parameter Value Units 2.5 A Operating Temperature –40 to 125 °C Storage Temperature –55 to 150 °C IPP Peak Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Parameter Rating Units Storage Temperature Range –55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Max Units Reverse Standoff Voltage Parameter VRWM IR ≤ 1µA 6 V Reverse Leakage Current ILEAK VR=5V 0.5 µA Clamp Voltage1 VC ESD Withstand Voltage1 VESD Diode Capacitance1 CI/O-GND Diode Capacitance CI/O-I/O 1 Min Typ IPP=1A, tp=8/20µs, Fwd 9.5 11.0 V IPP=2A, tp=8/20µs, Fwd 10.6 13.0 V IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 kV Reverse Bias=0V 0.7 0.8 0.9 pF Reverse Bias=1.65V 0.55 0.65 0.75 pF Reverse Bias=0V 0.35 pF Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1 1.00 0 0.95 0.90 -2 I/O Capacitance (pF) Insertion Loss [dB] -1 -3 -4 -5 -6 -7 0.85 0.80 0.70 0.60 -9 0.55 1.E+06 VCC = 3.3V 0.65 -8 -10 VCC = Float 0.75 VCC = 5V 0.50 1.E+07 1.E+08 Frequency [Hz] © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 1.E+09 1.E+10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 I/O DC Bias (V) 3.5 4.0 4.5 5.0 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3001 Series Capacitance vs. Frequency Product Characteristics Lead Plating Matte Tin 1.2E-12 Capacitance [F] 1.4E-12 Lead Material Copper Alloy 1E-12 Lead Coplanarity 0.0004 inches (0.102mm) 8E-13 Substitute Material Silicon 6E-13 Body Material Molded Epoxy Flammability UL 94 V-0 4E-13 2E-13 0 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tP) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3001 Series Package Dimensions — SC70-6 6 Package e e 4 5 E 1 6 JEDEC MO-203 Millimeters HE B D Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 A2 A A1 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 C Solder Pad Layout L 0.65 BSC e 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Part Numbering System Part Marking System D* 4 D*4 Inches Min 3 2 SC70-6 Pins Product Series SP3001-04 J T G Number of Channels D = SP3001 series TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Assembly Site (varies) Package Series J = SC70-6 Number of Channels -04 = 4 channel Ordering Information Part Number Package Marking Min. Order Qty. SP3001-04JTG SC70-6 D*4 3000 Embossed Carrier Tape & Reel Specification — SC70-6 Symbol Inches Max Min Max E 1.65 1.85 0.064 0.072 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.062 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.153 0.161 10P0 40.0± 0.20 W 7.70 8.10 1.574±0.007 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.960 K0 1.12 1.32 0.044 0.052 t © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 Millimetres Min 0.27 max 0.010 max