TVS Diode Arrays (SPA® Diodes) SESD Series Enhanced ESD Diode Arrays SESD Series Ultra Low Capacitance Diode Arrays RoHS Pb GREEN ELV Description The SESD series Ultra Low Capacitance Diode Arrays provides signal integrity-preserving unidirectional ESD protection for the world’s most challenging high speed serial interfaces. Compelling packaging options including the standard 2.5mmx1.0mm layout, the SOD883, and boardspace-friendly 0802 and 1103 DFN minimizes trace layout complexity, saves significant PCB space. Providing in excess of 20kV contact ESD protection (IEC61000-4-2) while maintaining extremely low leakage and dynamic resistance, offered in the industry’s most progressive and soon to be popular footprints, the SESD series sets higher standards for signal integrity and usability. Features Pinout 0402 DFN array 1 2 1 3.G ±20kV contact, ±20kV air 3 • Low clamping voltage of 9.2V @ IPP=2.0A (tP=8/20μs) 2 G 1004 DFN array ACE-Q101 qualified) 2 • ESD, IEC61000-4-2, 4 3 1 • 0.20pF TYP capacitance 0802 DFN array 4 5 3 2 G 1 8.G 7 4 6 5 6 4 5 1 0802/1004 DFN array 0402 DFN array 3 4 G • Applications requiring high ESD performance in small packages 2 3 2 • V-by-One®) • Tablet PC and external storage with high speed interfaces • C onsumer, mobile and portable electronics G, 3, 8 1 • ELV Compliant • LVDS interfaces Functional Block Diagram 2 • DisplayPort(TM) • Thunderbolt (Light Peak) Bottom View 1 • AEC-Q101 qualified (1004) Applications • HDMI 2.0, 1.4a, 1.3 9 • Facilitates excellent signal integrity 1103 DFN array • USB 3.1, 3.0, 2.0 10 • Low profile DFN array packages 5 6 1103 DFN array © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/10/15 TVS Diode Arrays (SPA® Diodes) SESD Series Enhanced ESD Diode Arrays Thermal Information Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 2.0 A Storage Temperature Range TOP Operating Temperature -55 to 125 °C °C Storage Temperature TSTOR -55 to 150 Parameter Rating Units -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics - (TOP=25°C) Typ Max Units Input Capacitance Parameter @ VR = 0V, f = 3GHz Test Conditions Min 0.20 0.22 pF Breakdown Voltage VBR @ IT=1mA 9.00 V Reverse Working Voltage Reverse Leakage Current IL @ VRWM=5.0V 25 Clamping Voltage VCL @ IPP=2.0A 9.20 ESD Withstand Voltage IEC61000-4-2 (Contact) ±20 IEC61000-4-2 (Air) ±20 0 0 -5.0 -5.0 S21 Insertion Loss (dB) S21 Insertion Loss (dB) 50 nA 2.0 A kV Insertion Loss Diagram - 1103 DFN Array Insertion Loss Diagram -10.0 -15.0 -20.0 -25.0 -30.0 1.E+06 V V tP=8/20μs Peak Pulse Current 7.0 -10.0 -15.0 -20.0 -25.0 -30.0 1.E+07 1.E+08 Frequency (Hz) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/10/15 1.E+09 1.E+10 1.E+06 1.E+07 1.E+08 Frequency (Hz) 1.E+09 1.E+10 TVS Diode Arrays (SPA® Diodes) SESD Series Enhanced ESD Diode Arrays Device IV Curve 1.0 0.8 0.6 0.4 Current (mA) 0.2 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 -2 -1 0 1 2 3 4 5 6 7 8 9 10 Voltage (V) USB3.0 Eye Diagram 5.0 Gb/s, 1000mV differential, CPO Compliant Test Pattern Without SESD Device With SESD Device Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Product Characteristics of 0402 DFN Package Ramp-down Rate 6°C/second max Lead Plating Pre-Plated Frame Time 25°C to peak Temperature (TP) 8 minutes Max. Lead Material Copper Alloy Do not exceed 260°C Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/10/15 TVS Diode Arrays (SPA® Diodes) SESD Series Enhanced ESD Diode Arrays Package Dimensions — 0402 DFN Array Symbol Millimeters Inches Min Typ Max Min Typ Max A 0.33 0.38 0.43 0.013 0.015 0.017 A1 0 - 0.05 0 - 0.002 A3 0.13 ref. 0.005 ref. D 0.55 0.60 0.65 0.022 0.024 0.026 E 0.95 1.00 1.05 0.037 0.039 0.041 K 0.35 0.40 0.45 0.014 0.016 0.018 L1 0.45 0.50 0.55 0.018 0.020 0.022 L2 0.20 0.25 0.30 0.008 0.010 0.012 b 0.10 0.15 0.20 0.004 0.006 0.008 e1 0.35 BSC 0.014 BSC e2 0.65 BSC 0.026 BSC Symbol Millimeters Inches A 0.60 0.024 B 1.00 0.039 C 0.23 0.009 0.014 D 0.35 D1 0.35 0.014 E 0.15 0.006 F 0.30 0.012 Pad Layout Embossed Carrier Tape & Reel Specification — 0402 DFN Array D0 T Y P0 P2 E1 D1 F B0 K0 Section Y - Y A0 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/10/15 Y P1 W Symbol Millimeters A0 0.70+/-0.05 B0 1.15+/-0.05 D0 ø 1.55 + 0.05 D1 ø 0.40 +/- 0.05 E1 1.75+/-0.10 F 3.50+/-0.05 K0 0.47+/-0.05 P0 4.00+/-0.10 P1 2.00+/-0.05 P2 2.00+/-0.05 W 8.00 +/-0.10 T 0.20+/-0.05 TVS Diode Arrays (SPA® Diodes) SESD Series Enhanced ESD Diode Arrays Package Dimensions — 0802 DFN Array Symbol Millimeters Inches Min Typ Max Min Typ A 0.33 0.38 0.43 0.013 0.015 0.017 A1 0 0.02 0.05 0 -- 0.002 0.70 0.020 A3 D 0.127 ref 0.005 ref. 0.50 0.60 E 1.90 2.00 2.10 b 0.15 0.20 0.25 b1 0.25 0.30 0.36 L 0.25 0.30 0.36 L1 0.35 0.40 0.45 0.014 L2 0.05 BSC Max 0.024 0.028 0.075 0.079 0.083 0.006 0.008 0.010 0.010 0.012 0.014 0.010 0.012 0.014 0.016 0.018 0.002 BSC e 0.40 BSC 0.016 BSC e1 0.45 BSC 0.018 BSC e2 0.25 BSC 0.010 BSC N 4 4 Symbol Millimeters Inches A 0.60 2.00 0.30 0.30 0.30 0.10 0.15 0.40 BSC 0.45 BSC 0.024 0.079 0.012 0.012 0.012 0.004 0.006 0.016 BSC 0.018 BSC B C D E F F1 G G1 Pad Layout Embossed Carrier Tape & Reel Specification — 0802 DFN Array D0 T Y P0 P2 E1 D1 F B0 K0 Section Y - Y A0 Y P1 W Symbol Millimeters A0 B0 D0 D1 E1 F K0 P0 P1 P2 W T 0.81+/-0.05 2.21+/-0.05 ø 1.50+0.10/-0 ø 0.40 min 1.75+/-0.10 3.50+/-0.05 0.46+/-0.05 4.00+/-0.10 2.00+/-0.10 2.00+/-0.05 8.00+0.30/-0.10 0.25+/-0.20 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/10/15 TVS Diode Arrays (SPA® Diodes) SESD Series Enhanced ESD Diode Arrays A1 D LxN 8xb 5 A1 D 6 Package Dimensions — 1004 DFN Array LxN Symbol 4 5 4 7 Gnd 8 R1 Gnd 3 2 Pin 1 ID Marking Location Pin 1 ID Marking Location SIDE VIEW 1 TOP VIEW SIDE VIEW 1 TOP VIEW END VIEW 1 0.43 0.013 0.015 0.017 0.02 0.05 0 -- 0.002 0.035 0.127 ref. E 2.40 2.50 2.60 b 0.15 0.20 0.25 BOTTOM VIEW END VIEW 2 0.043 0.094 0.098 0.102 0.006 0.008 0.010 b1 0.35 0.40 0.45 0.014 0.016 0.018 L 0.33 0.38 0.43 0.013 0.015 0.017 L1 0.00 0.10 0.15 0.000 0.004 0.006 e 0.50 BSC e1 0.50 BSC 0.020 BSC R 0.08 BSC 0.003 BSC R1 0.13 BSC 0.005 BSC N 10 2x F 10 A 0.020 BSC 2x F 2x F AA 2x2x F1F1 2x D1 2x D1 B B G1 4x G 4x G G1 4x G D1 B D1 B G1 4x G 4x G 8x D 8x D E 8x C Pad Layout Millimeters Inches A 1.20 0.047 B 2.20 0.087 C 0.50 0.020 D 0.20 0.008 D1 0.40 0.016 E 0.20 0.008 F 0.30 0.012 0.20 0.008 Alternate G 0.50 BSC 0.020 BSC Alternate G1 1.00 BSC 0.039 BSC E E 8x C Recommended Symbol F1 8x D E Recommended G1 4x G 8x D 8x C 0.039 2x F 2x2xF1F1 8x C Max 0.005 ref. 1.10 BOTTOM VIEW (Front) 0.38 1.00 2xR 1 SIDE VIEW 2 (Front) SIDE VIEW 2 0.33 0.00 0.90 A3 A A A1 D END VIEW 2 END VIEW 1 A A Typ A3 b1 2x N=10 2xR e A3 b1 2x 9 Gnd 8 Gnd 3 R1 1 e1e Min 9 2 L1e1 2x E Max N=10 E Inches Typ 6 L1 2x Millimeters Min 7 8xb Pad Layout Embossed Carrier Tape & Reel Specification — 1004 DFN Array D0 T Y P2 P0 E1 D1 F B0 K0 Section Y - Y A0 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/10/15 Y P1 W Symbol Millimeters A0 B0 D0 D1 E1 F K0 P0 P1 P2 W T 1.20+/-0.05 2.70+/-0.05 ø 1.50+0.10/-0 ø 0.50 min 1.75+/-0.10 3.50+/-0.05 0.51+/-0.10 4.00+/-0.10 4.00+/-0.10 2.00+/-0.05 8.00+0.30/-0.10 0.25+/-0.05 TVS Diode Arrays (SPA® Diodes) SESD Series Enhanced ESD Diode Arrays Package Dimensions — 1103 DFN Array Symbol Millimeters Inches Min Typ Max Min Typ A 0.33 0.38 0.43 0.013 0.015 0.017 A1 0.00 0.02 0.05 0 -- 0.002 0.90 0.027 A3 4 0.127 ref. Max 0.005 ref. D 0.70 0.80 0.031 0.035 E 2.70 2.80 2.90 0.106 0.110 0.114 b 0.15 0.20 0.25 0.006 0.008 0.010 b1 0.25 0.30 0.35 0.010 0.012 0.014 L 0.30 0.35 0.40 0.012 0.014 0.016 L1 0.50 0.55 0.60 0.019 0.021 0.024 L2 0.05 BSC 0.002 BSC e 0.40 BSC 0.016 BSC e1 0.45 BSC 0.018 BSC e2 0.40 BSC 0.016 BSC N 6 6 Pad Layout Symbol Millimeters Inches A 0.80 0.031 B 2.80 0.110 C 0.35 0.014 D 0.30 0.012 E 0.45 0.018 0.004 F 0.10 F1 0.15 0.006 G 0.40 BSC 0.016 BSC G1 0.45 BSC 0.018 BSC Embossed Carrier Tape & Reel Specification — 1103 DFN Array D0 T Y P2 P0 E1 D1 F B0 K0 Section Y - Y A0 Y P1 W Symbol Millimeters A0 B0 D0 D1 E1 F K0 P0 P1 P2 W T 1.00+/-0.05 3.00+/-0.05 ø 1.50+0.10/-0 ø 0.50 min 1.75+/-0.10 3.50+/-0.05 0.51+/-0.05 4.00+/-0.10 4.00+/-0.10 2.00+/-0.05 8.00+0.30/-0.10 0.25+/-0.05 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/10/15 TVS Diode Arrays (SPA® Diodes) SESD Series Enhanced ESD Diode Arrays Part Numbering System Part Marking System SESD xxxx Q x U G 0020 – 090 SESD product Package 0402 0802 1004 1103 DFN Array Package Breakdown Voltage 090: 9.0V (TYP) C Input Capacitance 0020: 0.20pF (TYP) 0402 Common GND pin Directional U: Unidirectional 4C No of channel 2: Two Channels 4: Four Channels 6: Six Channels 1004 MC 0802 6C 1103 Ordering Information Part Number Package Marking SESD0402Q2UG-0020-090 0402 DFN Array I C RF2946-000 50000 SESD0802Q4UG-0020-090 0802 DFN Array I MC RF3076-000 25000 SESD1004Q4UG-0020-090 1004 DFN Array I 4C RF3077-000 25000 SESD1103Q6UG-0020-090 1103 DFN Array I 6C RF3078-000 25000 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/10/15 Ordering Part Number Reel Quantity