Package Details - Case 106 Mechanical Drawing Lead Code: Cathode band Packing options: Bulk - Packing Code: D D = White corrugated box with black conductive coating (surface resistivity of <105 ohms per square). Bulk Packing Quantity: 250 Tape and Reel - Packing Code: A A = Axial taped and reeled in accordance with EIA-296-E. If required, individual reels placed in poly antistatic coated bags (surface resistivity of >109 and <1013 ohms per square). Tape and Reel Packing Quantity: 800 Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R0 (17-July 2008) Material Composition Specification CASE 106 Device average mass . . . . . . 1.95 g Fluctuation margin . . . . . . . . +/-10% Material Component Material (%wt) (mg) active device doped Si 0.29% 5.71 die attach high temperature solder 0.57% 11.11 leadframe Cu alloy EMC 54.1% 41.4% 1055 807.6 encapsulation* EMC GREEN plating** ink 41.4% 807.6 tin/lead process 3.62% 70.55 100% tin process 3.62% 70.55 N/A Substance Substance CAS No. 0.0015% 0.03 (%wt) (mg) (ppm) Si 7440-21-3 0.28% 5.43 2,785 Pb 7439-92-1 0.01% 0.28 144 Pb 7439-92-1 0.53% 10.275 5,269 Sn 7440-31-5 0.03% 0.556 285 Ag 7440-22-4 0.01% 0.279 143 Cu 7440-50-8 54.05% 1054 540,513 Fe 7439-89-6 0.05% 1.0 513 silica 7631-86-9 31.87% 621.37 318,651 epoxy resin 29690-82-2 4.14% 80.76 41,415 phenol resin 9003-35-4 4.01% 78.29 40,149 Sb2O3 Br 1309-64-4 0.70% 13.59 6,969 7726-95-6 0.70% 13.59 6,969 silica 7631-86-9 31.89% 621.85 318,897 epoxy resin 29690-82-2 4.14% 80.76 41,415 phenol resin 9003-35-4 4.02% 78.337 40,173 carbon black 1333-86-4 0.12% 2.423 1,243 metal hydroxide 1309-42-8 1.24% 24.23 12,426 Sn 7440-31-5 2.89% 56.44 28,944 Pb 7439-92-1 0.72% 14.11 7,236 Sn 7440-31-5 3.62% 70.55 36,179 2-propenic acid 53192-18-0 0.001% 0.0204 10 Al 7429-90-5 0.0003% 0.0054 3 silica methanone isoamyl 4benzoate 112945-52-5 0.00005% 0.0009 947-19-3 0.00005% 0.0009 21245-01-2 0.0001% 0.0024 0.5 0.5 1 *EMC GREEN molding compound is Halogen-Free. **For Lead Free plating, add suffix “LEAD FREE” to part number. For Tin/Lead plating, add suffix “TIN/LEAD” to part number. No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company. R0 (11-April 2012) w w w. c e n t r a l s e m i . c o m