Revision: Date: Statement of Materials, Construction LEAD-FREE -- 8L-SOICN -- TABLE OF MATERIAL DECLARATION Component Materials CAS Number Weight Analysis (grams) (Element / Compound) No. Component Name Material Name 1 Leadframe Copper Alloy 0.02426 2 3 Die Die attach material Silicon Chip Conductive Epoxy 0.00263 0.00113 4 5 6 Wire Lead Finish Encapsulation Gold Tin Epoxy Resin Total Package weight 0.00030 0.00146 0.04438 Material Mass (Gram) Material Weight % (of Total Pkg) 1.0 10-Feb-05 Cu Fe Pb P Zn Si Epoxy resin 7440-50-8 7439-89-6 7439-92-1 7723-14-0 7440-66-6 7440-21-3 Proprietary 0.02364 0.00057 0.00001 0.00002 0.00003 0.00262 0.00017 31.87233 0.76876 0.00981 0.02715 0.03598 3.52865 0.22856 97.43 2.35 0.03 0.08 0.11 99.50 15.00 Silver Aromatic Amine Au Sn Fused Silica Epoxy resin Phenol Resin Phenol Novolac Antimony trioxide Brominated Epoxy resin Carbon Black 7440-21-3 Proprietary 7440-57-5 7440-31-5 60676-86-0 Proprietary Proprietary 9003-35-4 1309-64-4 68541-56-0 1333-86-4 0.00090 0.00006 0.00030 0.00146 0.03581 0.00444 0.00067 0.00133 0.00089 0.00111 0.00013 1.21137 0.08381 0.40449 1.96872 48.29377 5.98436 0.89765 1.79531 1.19687 1.49609 0.17953 79.50 5.50 99.99 100.00 80.70 10.00 1.50 3.00 2.00 2.50 0.30 0.07416 Note: Composition derived from MSDS and material C of C from Vendors; Component Weight based on assembly of generic parts. Conclusion: The analysis table above shows that this package meets the following RoHS requirements for EACH PACKAGE COMPONENT (mold compound, lead frame, etc.) Lead* Mercury Cadmium Hexavalent Chromium Polybrominated Biphenyls (PBB) Polybrominated Biphenylethers (PBDE) Maximum Allowable Limit (aximum Allowable Limit (wt %) 1000 ppm 0.10% 1000 ppm 0.10% 100 ppm 0.01% 1000 ppm 0.10% 1000 ppm 0.10% 1000 ppm 0.10% * Lead is allowed up to 4% as an alloying agent in copper-based alloys Material Weight % (of Component)