Material Declaration Report Package Type: SC70-3 Component Weight (mg): 6.254 Pericom Package Code: C03 (Pb-free) MSL Rating: 1 Termination Plating: Matte Tin RoHS Compliance: Yes Peak Body Temp (C): 260 JESD 97 Pb-free Category: e3 Applicable Exemption: N/A Max Time (sec): 10 Plating Thickness (um): 7~17 Reflow Cycles: 3 Tin Whisker Mitigation: Anneal, 150C/1.5hr Rev Date: Mar.27.2012 Homogeneous Material Declaration MATERIAL ITEM MATERIAL WEIGHT(mg) ASSEMBLY SUBCON CJE MATERIAL COMPOSITION Silica, vitreous Silicon dioxide Boron zinc hydroxide oxide (B12Zn4(OH)14O15) Phenol-formaldehyde polymer Carbon black 60676-86-0 7631-86-9 138265-88-0 9003-35-4 1333-86-4 1 850 1.850 Nickel Manganese Cobalt Silicon Phosphorus Sulfur Carbon Iron Silver 7440 02 0 7440-02-0 7439-96-5 7440-48-4 7440-21-3 7723-14-0 7704-34-9 7440-44-0 7439-89-6 7440-22-4 41 000 41.000 0.800 0.500 0.300 0.025 0.025 0.050 57.290 0.010 0 759 0.759 0.015 0.009 0.006 0.000 0.000 0.001 1.060 0.000 TERMINATION PLATING 0.1400 Tin Impurity 7440-31-5 Proprietary 99.90 0 10 0.10 0.13986 0 00014 0.00014 SILICON DIE 0.350 Silicon Aluminum(AI) Copper(Cu) Titanium(Ti) Phosphorus(P) Boron(B) 7440-21-3 7429-90-5 7440-50-8 7440-32-6 7664-38-2 7440-42-8 99.763 0.200 0.001 0.028 0.003 0.005 0.34917 0.00070 0.00000 0.00010 0.00001 0.00002 DIE ATTACH EPOXY 0.350 Silica, crystalline Epoxy resin Epoxy resin Epoxy resin modifier Amine 14808-60-7 Secret Secret Secret Secret 42.500 25.000 25 000 15.000 15.000 2.500 0.14875 0.08750 0 08750 0.05250 0.05250 0.00875 GOLD WIRE 0.029 Au Other materials 7440-57-5 Secret 99.99 0.01 0.0289971 0.0000029 3.535 MOLD COMPOUND LEAD FRAME CAS NO. NOTE: The device contents disclosed are approximated and are based on engineering estimates. 3rd Party Analysis Results (PPM) MATERIAL Mold Compound Leadframe Silicon Die Die Attach Epoxy Gold Wire Solder Plating Device Pb Hg Cr+6 Cd PBB PBDE <2 <50 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <5 <5 <5 <5 <5 <5 <2 <2 <2 <2 <2 <2 <5 <5 <5 <5 <5 <5 ROHS MATERIAL COMPOSITION DECLARATION EU RoHS Directive 2002/95/EC Declaration Statement: Quantity limit of 0.1% (1000 PPM) by mass in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium(Cr+6), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE); and Quantity limit of 0.01% (100 PPM) for Cadmium and Pb China RoHS Directive Hg <1000ppm O Cr+6 Cd <1000ppm <1000ppm O O <100ppm O PBB <1000ppm O PBDE <1000ppm O SJ/T11363-2006 O: Indicates that this toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006. X: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement in SJ/T11363-2006. COMPOSITION % 80.000 17.000 1.000 1.000 1.000 COMPOSITION WEIGHT(mg) 2.828 0.601 0.035 0.035 0.035