Material Declaration Report

Material Declaration Report
Package Type: UQFN 10L
Component Weight (mg): 3.5410
Pericom Package Code: ZM10(Pb-free)
MSL Rating: 1
Termination Plating: NiPdAu
RoHS Compliance: Yes
Peak Body Temp (C): 260
JESD 97 Pb-free Category: e4
Applicable Exemption: N/A
Max Time (sec): 30
Plating Thickness (um): 0.5~2.2
Reflow Cycles: 3
Tin Whisker Mitigation: N/A
Rev Date: 10/28/2009
Homogeneous Material Declaration
MATERIAL
ITEM
MATERIAL
WEIGHT(mg)
MOLD COMPOUND
2.4900
LEADFRAME
ASSEMBLY
SUBCON
MATERIAL
COMPOSITION
UTL
CAS NO.
COMPOSITION
%
COMPOSITION
WEIGHT(mg)
Silica fuse
Epoxy resin
Phenol resin
Carbon black
60676-86-0
Proprietary
Proprietary
1333-86-4
90.500
4.500
4.500
0.500
2.2535
0.1121
0.1121
0.0125
0.6060
Copper (Cu)
Chrome
Tin
Zinc
Nickel
Palladium
Gold
7440-50-8
24613-89-6
7440-31-5
7440-66-6
7440-02-0
7440-05-3
7440-57-5
97.933
0.246
0.247
0.217
1.280
0.049
0.030
0.5935
0.0015
0.0015
0.0013
0.0078
0.0003
0.0002
SILICON DIE
0.2360
Silicon (Si)
Non-hazardous Metal
7440-21-3
Proprietary
99.192
0.808
0.2341
0.0019
DIE ATTACH EPOXY
0.1010
Epoxy Resin
Metal Oxide
Glycol Ethers
Curing Agent & Hardener
Treated Silica
Proprietary
Proprietary
Proprietary
Proprietary
14808-60-7
31.000
31.000
21.000
8.500
8.500
0.0313
0.0313
0.0212
0.0086
0.0086
GOLD WIRE
0.1080
Gold(Au)
Impurities
7440-57-5
-
99.990
0.010
0.1080
0.0000
NOTE: The device contents disclosed are approximated and are based on engineering estimates.
3rd Party Analysis Results (PPM)
Device
MATERIAL
Pb
Hg
Cr+6
Cd
PBB
Mold Compound
Leadframe
Silicon Die
Die Attach Epoxy
Gold Wire
Solder Plating
<2
<50
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<5
<5
<5
<5
<5
<5
PBDE
<5
<5
<5
<5
<5
<5
ROHS MATERIAL COMPOSITION DECLARATION
EU RoHS
Directive
2002/95/EC
Declaration
Statement:
Quantity limit of 0.1% (1000 PPM) by mass in homogeneous material for: Lead (Pb), Mercury,
Hexavalent Chromium(Cr+6), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE);
and Quantity limit of 0.01% (100 PPM) for Cadmium
and
Pb
China RoHS
Directive
<1000ppm
O
Hg
<1000ppm
O
Cr+6
<1000ppm
O
Cd
<100ppm
O
PBB
<1000ppm
PBDE
<1000ppm
O
SJ/T11363-2006
O: Indicates that this toxic or hazardous substance contained in all of the homogeneous
materials for this part is below the limit requirement in SJ/T11363-2006.
X: Indicates that this toxic or hazardous substance contained in at least one of the
homogeneous materials used for this part is above the limit requirement in SJ/T11363-2006.
O