RF5722 3.0V TO 3.6V, 2.4GHz TO 2.5GHz LINEAR POWER AMPLIFIER Features VC1 RF IN 1 Single Power Supply 3.0V to 3.6V 24dB Minimum Gain Input Matched to 50 2400MHz to 2500MHz Frequency Range +18dBm at <2.5% typ EVM, 120mA at 3.3VCC 6 VC2 Input Match IEEE802.11b/g/n WiFi Applications 2.5GHz ISM Band Applications Commercial and Consumer Systems Portable Battery-Powered Equipment Spread-Spectrum and MMDS Systems Interstage Match 2Fo Filter VREG 2 Bias Circuit 3 Applications 7 Power Detector 5 RF OUT 4 NC 8 PDETECT VCC Package Style: QFN, 8-Pin, 2.2mmx2.2mmx0.45mm Functional Block Diagram Product Description The RF5722 is a linear, medium-power, high-efficiency, two-stage amplifier IC designed specifically for battery-powered WiFi applications such as PC cards, mini PCI, and compact flash applications. The device is manufactured on an advanced InGaP Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as the final RF amplifier in 2.5GHz OFDM and other spreadspectrum transmitters. The device is provided in a 2.2mmx2.2mm, 8-pin, QFN with a backside ground. The RF5722 is designed to maintain linearity over a wide range of supply voltages and power outputs. The RF5722 also has built-in power detector and incorporates the input, and interstage components internally which reduces the component count used externally and makes it easier to incorporate on any design. Ordering Information RF5722 RF5722SR RF5722TR7 RF5722PCK-410 Standard 25 piece bag Standard 100 piece reel Standard 2500 piece reel Fully assembled evaluation board tuned for 2.4GHz to 2.5GHz and 5 loose sample pieces Optimum Technology Matching® Applied GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT RF MEMS LDMOS RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc. DS110619 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 1 of 10 RF5722 Absolute Maximum Ratings Parameter Rating Unit Supply Voltage -0.5 to +5.0 VDC Power Control Voltage (VREG) -0.5 to 3.5 V DC Supply Current 400 mA Input RF Power +5 dBm -30 to +85 °C -30 to -10 °C -40 to +150 °C Operating Ambient Temperature Degraded Performance Storage Temperature Moisture Sensitivity Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. TBD ESD HBM TBD V MM TBD V Parameter Min. Specification Typ. Max. Unit Condition Temperature=+25°C, VCC =3.3V, VREG =2.85V pulsed at 1% to 100% duty cycle, Frequency=2450MHz, circuit per evaluation board schematic, unless otherwise specified Overall 2.40 Frequency Output Power 17 EVM* 2.50 18 2.5 Gain 24 dBm 4 IEEE802.11g IEEE802.11n At max data rate, OFDM modulation % RMS, mean dB At +18dBm RF POUT and 54Mbps 1.25 ±dB -30°C to +85°C 1.25 V 25.5 Gain Variance GHz Power Detector POUT =18dBm 0.85 Current Operating 120 160 mA At +18dBm RF POUT and 54Mbps 175 mA At +20dBm and 1Mbps 85 mA Data rate at <3.5% EVM RMS, mean, T=-30°C to +50°C 2 mA VCC =+3.3VDC 11b Operating Quiescent IREG Current 10 A Power Supply 3.0 3.3 3.6 VDC Operating Range VREG1, VREG2 Input Voltage 2.75 2.85 2.9 VDC Operating Range Shutdown Output VSWR 10:1 Input Return Loss -15 -10 Turn-on Time** 0.5 1.0 S -43 dBm Second Harmonic dB Output stable to within 90% of final gain Fundamental frequency is between 2400MHz and 2500MHz; RF POUT =+18dBm. See note 2. ACP Lower -53 -50 18.5dBm (min), -20dBm (typ.) ACP Upper -33 -30 18.5dBm (min), -20dBm (typ.) Notes: *The EVM specification is obtained with a signal generator that has an EVM floor of less than 0.7%. **The PA must operate with gated bias voltage input at 1% to 99% duty cycles without any EVM or other parameter degradation. Note 2: For best harmonic rejection please refer to the harmonic rejection application schematic. 2 of 10 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS110619 RF5722 Pin 1 2 3 Function RF IN VREG PDETECT 4 5 6 7 8 GND RF OUT VC2 VC1 VCC Pkg Base GND Description RF input. Input is matched to 50 and DC block is provided internally. Bias current control voltage for the first and second amplifier stage. Power detector which provides an output voltage proportional to the RF output power level. May need external decoupling capacitor for stability. May need external circuitry to bring output voltage to desired level. Ground. RF Output. Voltage supply for the second amplifier stage. Voltage supply for the first amplifier stage. Supply voltage for the bias reference and control circuit. May be connected with VC1 and VC2 (with a single supply voltage) as long as VCC does not exceed +4.5VDC in this configuration. The center metal base of the QFN package provides DC and RF ground as well as heat sink for the amplifier. Package Drawing 0.50 0.40 2 PLCS 0.10 C INDEX AREA 0.152 REF 0.10 C 2 PLCS 2.20 0.05 0.00 -B-A- 2.20 SEATING PLANE 0.65 0.10 MAX 1.20 TYP 1.00 Dimensions in mm. Shaded lead is pin 1. DS110619 -C- 0.31 0.21 0.28 0.18 0.10 M C A B 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 3 of 10 RF5722 4 of 10 VCC VC1 Pin Out 8 7 VREG 2 5 RF OUT 3 4 N/C 6 VC2 PDETECT RF IN 1 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS110619 RF5722 Application Schematic C3 56 pF VCC 50 strip C1 0.1 F L1 22 nH C2 1 uF 8 J3 RF IN 7 L2 8.2 nH 50 strip 1 6 Input Match Interstage Match 2Fo Filter VREG 2 Bias Circuit R1 0 3 Power Detector L3 1.0 nH 50 strip C6 DNP 5 50 strip J4 RF OUT C4 1.8 pF 4 C5 330 pF PDETECT DS110619 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 5 of 10 RF5722 Theory of Operation and Application Information The RF5722 is a two-stage power amplifier (PA) with a minimum gain of 24dB minimum gain in the 2.4GHz to 2.5GHz ISM band. The RF5722 has integrated input, interstage and output matching components thus allowing minimal bill of material (BOM) parts count in end applications. The RF5722 is designed primarily for IEEE802.11b/g/n WiFi applications where the available supply voltage and current are limited. This amplifier will operate to (and below) the lowest expected voltage made available by a typical PCMCIA slot in a laptop PC, and will maintain required linearity at decreased supply voltages. The RF5722 requires only a single positive supply of 3.3V nominal (or greater) to operate to full specifications. Power control is provided through one bias control input pin (VREG). DC blocking caps are provided internally and the evaluation board circuit (available from RF Micro Devices, Inc. (RFMD)) is optimized for 3.3VDC applications. For best results, the PA circuit layout from the evaluation board should be copied as closely as possible, particularly the ground layout and ground vias. Pin 4 must be left as a no-connect on the PCB in order for the PA to work properly. Other configurations may also work, but the design process is much easier and quicker if the layout is copied from the RF5722 evaluation board. Gerber files of RFMD PCBA designs can be provided on request. The RF5722 is a very easy part to implement, but care in circuit layout and component selection is always advisable when designing circuits to operate at 2.5GHz. The RF5722 evaluation board layout and schematic are available using 0201 (US) size components which will help shrink the overall size of the total area of the PA and components of the intended design. Please contact RFMD Sales or Application Engineering for additional data and guidance. For best performance, it is important to duplicate (as closely as possible) the layout of the evaluation board. The RF5722 has primarily been characterized with a voltage on VREG of 2.8VDC. If you prefer to use a control voltage that is significantly different than 2.8VDC, or a different frequency than the recommended frequency range, contact RFMD Sales or Applications Engineering for additional data and guidance. QFN8 Package Area versus Other Small Form Factor Package Areas Package Type Length (mm) Width (mm) Area (mm2) Delta () (mm2) to QFN8 SOT 23-6 3.1 3.0 9.30 QFN12 3.0 3.0 9.00 4.46 4.16 SOT 23-5 2.9 2.8 8.12 3.28 QFN8 2.2 2.2 4.84 0.00 An application schematic for 2.5GHz operation is included that has two additional components, one shunt inductor, and one shunt capacitor, on the output for improved second harmonic rejection. This layout provides ~20dB rejecetion at 5GHz with a minimal BOM count. 6 of 10 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS110619 RF5722 Evaluation Board Schematic VCC P1 1 GND P1-2 2 VCC P1-3 3 VCC P2-3 P2 3 P2-2 2 PDETECT 1 GND C1 0.1 F L1 22 nH C3 56 pF VREG C2 1 F 8 J3 RF IN 7 1 6 Input Match Interstage Match 2Fo Filter R1 0 VREG L2 8.2 nH 50 strip 2 Bias Circuit 3 Power Detector L3 1.0 nH 50 strip 5 C4 1.8 pF J4 RF OUT 4 C5 330 pF PDETECT DS110619 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 7 of 10 RF5722 Evaluation Board Layout Board Size 1.0” x 1.0” Board Thickness 0.031”; Board Material FR-4; Multi-Layer 8 of 10 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS110619 RF5722 VCC=3.3V: Gain versus POUT VCC=3.3V: EVM versus POUT 30.8 6 30.6 5 30.4 30.2 30.0 Gain (dB) EVM (%) 4 3 2 29.8 29.6 29.4 29.2 29.0 2400 MHz 2450 MHz 2500 MHz 1 2400 MHz 2450 MHz 2500MHz 28.8 28.6 0 0.0 5.0 10.0 15.0 20.0 0.0 25.0 5.0 0.16 1.4 0.14 1.2 Power Detector (V) 0.12 ICC (mA) 0.10 0.08 0.06 0.04 2400 MHz 2450 MHz 2500MHz 20.0 25.0 1.0 0.8 0.6 0.4 2400 MHz 2450 MHz 2500 MHz 0.2 0.0 0.00 0 5 10 15 Output Power (dBm) DS110619 15.0 VCC=3.3V: PDETECT versus POUT VCC=3.3V: ICC versus POUT 0.02 10.0 Output Power (dBm) Output Power (dBm) 20 25 0 5 10 15 20 25 Output Power (dBm) 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. 9 of 10 RF5722 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch to 8inch gold over 180inch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. PCB Recommendations 10 of 10 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or [email protected]. DS110619