ESD/TESD** Series TESD05EB Bidirectional TVS Diode APPLICATIONS ◆ Cell Phone Handsets and Accessories SOD-523 ◆ Microprocessor based equipment ◆ Personal Digital Assistants (PDA’s) ◆ Notebooks, Desktops, and Servers ◆ Portable Instrumentation 2 ◆ Peripherals ◆ Pagers IEC COMPATIBILITY 1 ◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) ◆ IEC61000-4-4 (EFT) 40A (5/50ηs) PIN CONFIGURATION FEATURES ◆ 250 Watts Peak Pulse Power per Line (tp=8/20µs) ◆ Protects one birectional I/O line ◆ Low clamping voltage ◆ Working voltages : 5V ◆ Low leakage current MECHANICAL CHARACTERISTICS ◆ SOD-523 Package ◆ Molding Compound Flammability Rating : UL 94V-O ◆ Weight 0.5 Millgrams (Approximate) ◆ Quantity Per Reel : 5,000pcs ◆ Reel Size : 7 inch ◆ Lead Finish : Lead Free REV.2015.02.01 01 | www.spsemi.cn ESD/TESD** Series ESDA05CP TESD05EB DEVICE CHARACTERISTICS MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified) PARAMETER SYMBOL Peak Pulse Power (tp=8/20µs waveform) VALUE UNITS PPP 250 Watts TL 260 (10 sec.) ℃ TJ -55 ~ 150 ℃ TSTG -55 ~ 150 ℃ Lead Soldering Temperature Operating Temperature Range Storage Temperature Range ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified) PART NUMBER DEVICE MARKING VRWM VB (V) (V) (max.) (min.) ETESD05EB REV.2015.02.01 0 5 6 IT VC IR VC (µA) (pF) (@A) (max.) (typ.) 5 1 @1A (mA) 1 (max.) (max.) 10 12 CT 10 02 | www.spsemi.cn ESD/TESD** Series TESD05EB SOD-523 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT REV.2015.02.01 03 | www.spsemi.cn