TESD03G2B

ESD/TESD** Series
TESD**G2B SERIES
BIDIRECTIONAL TVS DIODE ARRAY
FOR LATCH-UP PROTECTION
APPLICATIONS
◆ RS-232, RS-422 & RS-423 Data Lines
◆ Audio/Video Inputs
SOT-23
◆ Wireless Network Systems
◆ Digit Video Interface (DVI)
◆ Medical Sensors
◆ Notebook Computers
IEC COMPATIBILITY
◆ IEC61000-4-2 (ESD) ±30kV (air), ±30kV (contact) -- 3.3V~18V
◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) -- 24V~36V
◆ IEC61000-4-4 (EFT) 40A (5/50ηs)
◆ IEC61000-4-5 (Lightning) 21A (8/20µs)
PIN CONFIGURATION
FEATURES
◆ 350 Watts Peak Pulse Power per Line (tp=8/20µs)
◆ Protects two bi-directional I/O lines
◆ Low clamping voltage
◆ Working voltages : 3.3V to 36V
◆ Low leakage current
MECHANICAL CHARACTERISTICS
◆ SOT-23 Package
◆ Molding Compound Flammability Rating : UL 94V-O
◆ Weight 8.0 Millgrams (Approximate)
◆ Quantity Per Reel : 3,000pcs
◆ Reel Size : 7 inch
◆ Lead Finish : Lead Free
REV.2015.02.01
01 | www.spsemi.cn
ESD/TESD** Series
SMCxx SERIES
TESD**G2B SERIES
DEVICE CHARACTERISTICS
MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified)
VALUE
UNITS
Peak Pulse Power (tp=8/20µs waveform)
PPP
350
Watts
Lead Soldering Temperature
TL
260 (10 sec.)
℃
Operating Temperature Range
TJ
-55 ~ 150
℃
TSTG
-55 ~ 150
℃
PARAMETER
SYMBOL
Storage Temperature Range
ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified)
PART NUMBER
DEVICE
MARKING
VRWM
VB
(V)
(V)
(max.) (min.)
IT
VC
IR
CT
(µA)
(pF)
(@A)
(max.)
(typ.)
VC
@1A
(mA)
(max.) (max.)
TESD03G2B
C03
3.3
4
1
7
10.5
20
40
220
TESD05G2B
C05
5
6
1
9.8
18
10
10
150
TESD08G2B
C08
8
8.5
1
13.4
24
12
1
75
TESD12G2B
SMC12
C12
12
13.3
1
19
32
11
5
1
65
TESD15G2B
C15
15
16.7
1
24
38
5
1
60
TESD18G2B
C18
18
20
1
29
45
9
1
55
TESD24G2B
C24
24
26.7
1
43
52
7
1
40
TESD36G2B
C36
36
40
1
60
75
5
1
15
REV.2015.02.01
02 | www.spsemi.cn
ESD/TESD** Series
TESD**G2B SERIES
SOT-23 PACKAGE OUTLINE & DIMENSIONS
* SOLDERING FOOTPRINT
REV.2015.02.01
03 | www.spsemi.cn