Product Specification Series: MEC2-DV 2.00 mm (.0787”) Mini Edge Card Connector, Vertical Surface Mount Socket MEC2 Series – Socket, Vertical Orientation See www.samtec.com for more information. Revision: A Date: August 27, 2015 Page 1 © Samtec, Inc. Product Specification Series: MEC2-DV 2.00 mm (.0787”) Mini Edge Card Connector, Vertical Surface Mount Socket 1.0 SCOPE 1.1 This specification covers performance, testing and quality requirements for Samtec’s MEC2-DV Series 2.00 mm (.0787”) Mini Edge Card Connector, Surface Mount socket. All information contained in this specification is for a Vertical 1.57 mm (.062”) Edge Card configuration unless otherwise noted. 2.0 DETAILED INFORMATION 2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at http://www.samtec.com/?MEC2-DV. 3.0 TESTING 3.1 Current Rating: 3.5 A (One pin powered per row) 3.2 Voltage Rating: 235 VAC 3.3 Operating Temperature Range: -55°C to +125°C 3.4 Electrical: ITEM TEST CONDITION REQUIREMENT STATUS Withstanding Voltage EIA-364-20 (No Flashover, Sparkover, or Breakdown) 710 VAC Pass Insulation Resistance EIA-364-21 (1000 MΩ minimum) 5,000 MΩ Pass Contact Resistance (LLCR) EIA-364-23 Δ 15 mΩ maximum (Samtec defined)/ No damage Pass REQUIREMENT STATUS 3.5 Mechanical: ITEM TEST CONDITION Durability EIA-364-09C 100 cycles Pass Random Vibration EIA-364-28 Condition V, Letter B 7.56 G 'RMS', 50 to 2000 Hz, 2 hours per axis, 3 axis total , PSD 0.04 Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Pass Mechanical Shock EIA-364-27 100 G, 6 milliseconds, sawtooth wave, 11.3 fps, 3 shocks/direction, 3 axis (18 total shocks) Visual Inspection: No Damage LLCR: Δ 15 mΩ maximum Pass Normal Force EIA-364-04 30 grams minimum for Gold interface Pass Revision: A Date: August 27, 2015 Page 2 © Samtec, Inc. Product Specification Series: MEC2-DV 2.00 mm (.0787”) Mini Edge Card Connector, Vertical Surface Mount Socket 3.6 Environmental: ITEM TEST CONDITION REQUIREMENT STATUS Thermal Shock EIA-364-32 Thermal Cycles: 100 (30 minute dwell) Hot Temp: +85°C Cold Temp: -55°C Hot/Cold Transition: Immediate Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 710 VAC IR: >10,000 MΩ Pass Thermal Aging (Temp Life) EIA-364-17 Test Condition 4 @ 105°C Condition B for 250 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 710 VAC IR: >10,000 MΩ Pass Cyclic Humidity EIA-364-31 Test Temp: +25°C to +65°C Relative Humidity: 90 to 95% Test Duration: 240 hours Visual Inspection: No Damage LLCR: Δ 15 mΩ DWV: 710 VAC IR: >10,000 MΩ Pass Gas Tight EIA-364-36 Gas Exposure: Nitric Acid Vapor Duration: 60 min. Drying Temp.: 50°C +/- 3°C Measurements: Within 1 hour of Exposure LLCR: Δ 15 mΩ Pass 4.0 MATED SYSTEM 4.1 Mated Views Mated view information can be found at link below: http://suddendocs.samtec.com/prints/mec2%20mated%20document-mkt.pdf Revision: A Date: August 27, 2015 Page 3 © Samtec, Inc. Product Specification Series: MEC2-DV 2.00 mm (.0787”) Mini Edge Card Connector, Vertical Surface Mount Socket 5.0 POLARIZING FEATURES 6.0 HIGH SPEED PERFORMANCE 6.1 Based on a 3 dB insertion loss 6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair Single-Ended Signaling 12.5 GHz/25 Gbps Revision: A Differential Pair Signaling 14.5 GHz/29 Gbps Date: August 27, 2015 Page 4 © Samtec, Inc. Product Specification Series: MEC2-DV 2.00 mm (.0787”) Mini Edge Card Connector, Vertical Surface Mount Socket 7.0 PROCESSING RECOMMENDATIONS 7.1 Mating Alignment Requirements: 7.1.1 The parts can be rigidly misaligned by no more than .07 mm (.003”) in the X- and .19 mm (.008”) in the Y-direction to ensure a good mate. 7.2 Mating Angle Requirements: 7.2.1 Revision: A 7.2.2 Date: August 27, 2015 Page 5 © Samtec, Inc. Product Specification Series: MEC2-DV 2.00 mm (.0787”) Mini Edge Card Connector, Vertical Surface Mount Socket 7.3 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec does not specify a recommended reflow profile for our connectors. The processing parameters provided by the solder paste manufacturer should be employed and can usually be found on their website. All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile parameters detailed in IPC/JEDEC J-STD-020E which requires that components be capable of withstanding a peak temperature of 260°C as well as 30 seconds above 255°C. Samtec Recommended Temperature Profile Ranges (SMT) Sn-Pb Eutectic Assembly Preheat/Soak (100°C-150°C) Max Ramp Up Rate Reflow Time (above 183°C) Peak Temp Time within 5°C of 235°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 235°C 20 sec. max. 6°C/s max. 6 min. max. Preheat/Soak (150°C-200°C) Max Ramp Up Rate Reflow Time (above 217°C) Peak Temp Time within 5°C of 260°C Max Ramp Down Rate Time 25°C to Peak Temp 60-120 sec. 3°C/s max. 40-150 sec. 260°C 30 sec. max. 6°C/s max. 8 min. max. Pb-Free Assembly 7.3.1 These guidelines should not be considered design requirements for all applications. Samtec recommends testing interconnects on your boards in your process to guarantee optimum results. 7.4 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum component temperature of 260°C. Revision: A Date: August 27, 2015 Page 6 © Samtec, Inc. Product Specification Series: MEC2-DV 2.00 mm (.0787”) Mini Edge Card Connector, Vertical Surface Mount Socket 7.5 Stencil Thickness: The stencil thickness is .006” (.15 mm). 7.6 Placement: Machine placement of the parts is strongly recommended. 7.7 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through Nitrogen gas infusion) in the reflow process to improve solderability. 7.8 Cleaning: Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and conditions designated in the EIA-364-11A standard. 8.0 ADDITIONAL RESOURCES 8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at [email protected] 8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at [email protected] 8.3 For additional processing information, contact our Interconnect Processing Group at [email protected]. 8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental Compliance Group at [email protected] USE OF PRODUCT SPECIFICATION SHEET This Product Specification Sheet (“PSS”) is a brief summary of information related to the Product identified. As a summary, it should only be used for the limited purpose of considering the purchase/use of Product. For specific, detailed information, including but not limited to testing and Product footprint, refer to Section 2.0 of this document and the links there provided to test reports and prints. This PSS is the property of Samtec, Inc. (“Samtec”) and contains proprietary information of Samtec, our various licensors, or both. Samtec does not grant express or implied rights or license under any patent, copyright, trademark or other proprietary rights and the use of the PSS for building, reverse engineering or replication is strictly prohibited. By using the PSS, the user agrees to not infringe, directly or indirectly, upon any intellectual property rights of Samtec and acknowledges that Samtec, our various licensors, or both own all intellectual property therein. The PSS is presented “AS IS”. While Samtec makes every effort to present excellent information, the PSS is only provided as a guideline and does not, therefore, warrant it is without error or defect or that the PSS contains all necessary and/or relevant information about the Product. The user agrees that all access and use of the PSS is at its own risk. NO WARRANTIES EXPRESSED OR IMPLIED, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR OF ANY KIND WHATSOEVER ARE PROVIDED. Revision: A Date: August 27, 2015 Page 7 © Samtec, Inc.