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Product Specification
Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array
HDAF Series – Socket, Vertical Orientation
HDAM Series – Terminal, Vertical Orientation
Revision: C
Date: May 12, 2015
Page 1
© Samtec, Inc.
Product Specification
Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array
1.0 SCOPE
1.1 This specification covers performance, testing and quality requirements for Samtec HDAF/HDAM Series 2,00 mm
TM
(.0787”) X 1,20 mm (.0472”) HD Mezz Rugged, High Density Open Pin Field Array connectors. All information
contained in this specification is for a HDAF Series -08.0 lead style mated to a HDAM Series -12.0 lead style for a
20 mm (.787”) stack height, vertical configuration unless otherwise noted.
2.0 DETAILED INFORMATION
2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at
www.samtec.com?HDAF and www.samtec.com?HDAM.
3.0 TESTING
3.1 Current Rating: 1.8A (6 Pins Powered)
3.2 Voltage Rating: 230 VAC
3.3 Operating Temperature Range: -55°C to +125°C
3.4 Electrical:
ITEM
TEST CONDITION
REQUIREMENT
Withstanding Voltage
EIA-364-20 (No Flashover,
Sparkover, or Breakdown)
690 VAC
Insulation Resistance
EIA-364-21 (1000 MΩ
minimum)
5,000 MΩ
Contact Resistance (LLCR)
EIA-364-23
Δ 15 mΩ maximum (Samtec defined)/
No damage
3.5 Mechanical:
ITEM
TEST CONDITION
REQUIREMENT
STATUS
Durability
EIA-364-09C
100 cycles
Pass
Random Vibration
EIA-364-28 Condition V, Letter B
7.56 G 'RMS', 50 to 2000 Hz, 2
hours per axis, 3 axis total , PSD
0.04
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Pass
Mechanical Shock
EIA-364-27 100 G, 6
milliseconds, sawtooth wave,
11.3 fps, 3 shocks/direction, 3
axis (18 total shocks)
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Pass
Normal Force
EIA-364-04
30 grams minimum for gold
interface
Pass
Revision: C
Date: May 12, 2015
Page 2
© Samtec, Inc.
Product Specification
Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array
3.6 Environmental:
ITEM
REQUIREMENT
STATUS
Thermal Shock
EIA-364-32
Thermal Cycles: 100 (30 minute dwell)
Hot Temp: +85°C
Cold Temp: -55°C
Hot/Cold Transition: Immediate
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 690 VAC
IR: >15,000 MΩ
Pass
Thermal Aging
(Temp Life)
EIA-364-17
Test Condition 4 @ 105°C
Condition B for 250 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 690 VAC
IR: >15,000 MΩ
Pass
Cyclic Humidity
EIA-364-31
Test Temp: +25°C to +65°C
Relative Humidity: 90 to 95%
Test Duration: 240 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 690 VAC
IR: >15,000 MΩ
Pass
Gas Tight
EIA-364-36
Gas Exposure: Nitric Acid Vapor
Duration: 60 min.
Drying Temp.: 50°C +/- 3°C
Measurements: Within 1 hour of
Exposure
LLCR: Δ 15 mΩ
Pass
Revision: C
TEST CONDITION
Date: May 12, 2015
Page 3
© Samtec, Inc.
Product Specification
Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array
4.0 MATED SYSTEM
4.1 Mated Views
Mated view information can be found at link below:
http://cloud.samtec.com/Prints/HDAX%20Mated%20Document.pdf
5.0 POLARIZING FEATURES
6.0 HIGH SPEED PERFORMANCE
6.1 Based on a 3 dB insertion loss
6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair
Revision: C
Stack Height
Single-Ended Signaling
Differential Pair Signaling
20 mm
9.5 GHz
9.0 GHz
25 mm
8.5 GHz
8.5 GHz
30 mm
10.0 GHz
7.5 GHz
35 mm
9.0 GHz
9.0 GHz
Date: May 12, 2015
Page 4
© Samtec, Inc.
Product Specification
Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array
7.0 PROCESSING RECOMMENDATIONS
7.1 Mating Alignment Requirements:
Revision: C
7.1.1
Maximum guidance/capture in applications where at least one half of the interface is free to float.
7.1.2
The parts can be rigidly misaligned by no more than .005" (0,13 mm) in the X- and .001” (0,03 mm) in the
Y-direction to ensure a good mate.
Date: May 12, 2015
Page 5
© Samtec, Inc.
Product Specification
Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array
7.2 Mating Angle Requirements: The connector can be zippered in the longitudinal direction.
7.2.1
7.2.2
Revision: C
Date: May 12, 2015
Page 6
© Samtec, Inc.
Product Specification
Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array
7.3 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec
does not specify a recommended reflow profile for our connectors. The processing parameters provided by the
solder paste manufacturer should be employed and can usually be found on their website.
All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile
parameters detailed in IPC/JEDEC J-STD-020D which requires that components be capable of withstanding a peak
temperature of 260°C as well as 30 seconds above 255°C.
Samtec Recommended Temperature Profile Ranges (SMT)
Sn-Pb Eutectic Assembly
Preheat/Soak
(100°C-150°C)
Max Ramp Up
Rate
Reflow Time
(above 183°C)
Peak
Temp
Time within 5°C
of 235°C
Max Ramp
Down Rate
Time 25°C to
Peak Temp
60-120 sec.
3°C/s max.
40-150 sec.
235°C
20 sec. max.
6°C/s max.
6 min. max.
Preheat/Soak
(150°C-200°C)
Max Ramp Up
Rate
Reflow Time
(above 217°C)
Peak
Temp
Time within 5°C
of 260°C
Max Ramp
Down Rate
Time 25°C to
Peak Temp
60-120 sec.
3°C/s max.
40-150 sec.
260°C
30 sec. max.
6°C/s max.
8 min. max.
Pb-Free Assembly
7.3.1
These guidelines should not be considered design requirements for all applications.
Samtec recommends testing interconnects on your boards in your process to guarantee optimum results.
Revision: C
Date: May 12, 2015
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© Samtec, Inc.
Product Specification
Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array
7.4 Multiple Connector System: A customer may elect to place two systems on the same board. Multiple connectors
must have the longitudinal (pin to pin) direction of the connectors parallel (FIG 1 and FIG 3) and not perpendicular
(FIG 2).
All the connectors on a board, in this application, must be the same gender, must come from a single supplier and
process. Furthermore, they must come from either the same package or from successive packages with the same
manufacturing date.
7.5 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum oven temperature of 260°C.
7.6 Stencil Thickness: The stencil thickness is .006” (0,15 mm).
7.7 Placement: Machine placement and complete seating of the parts in the Z-axis is strongly recommended.
7.8 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec’s wide
variety of standoff options can be found here: SO - Board Stacking Standoff
7.9 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through
Nitrogen gas infusion) in the reflow process to improve solderability.
7.10 Rework Guidelines: Samtec recommends following these rework guidelines as needed: Reworking Grid Array
Connectors
7.10.1 Samtec recommends a minimum spacing of .125” (3,18 mm) between adjacent connectors to allow
adequate room for hot-air rework equipment
7.11 Solder Screen Printing Process:
7.11.1 Complete solder pad coverage is critical. Automated inspection of each print is recommended. If solder
paste does not completely cover the solder pad, the assembly should be rejected, cleaned and re-printed.
Revision: C
Date: May 12, 2015
Page 8
© Samtec, Inc.
Product Specification
Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array
7.11.2 Stencil cleaning may need to be monitored more frequently to ensure complete solder pad coverage is
maintained.
7.11.3
Solder charge location relative to solder print. Notice good contact between solder charges and solder
paste.
7.12 Handling:
7.12.1 These connectors are typically packaged in trays or tape-and-reel which protect the solder charges from
damage. They should be handled like any other BGA or IC device.
7.12.2 Avoid resting the connector on the solder charge except during final placement onto the board.
7.12.3 When using tape-and-reel packaging, ensure the bottom of the pocket is protected as it travels through
the feeder.
7.12.4 Avoid touching the solder charges.
7.12.5 When a partially used tray needs to be stored, use the flat cover from the original shipment or an empty
tray to cover connectors. Band trays using flex wrap or rubber bands .
7.13 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec
offers two different types:
7.13.1 Traditional Standoffs (SO) – Rigid design to statically support board-to-board applications. See options
here: SO - Board Stacking Standoff
7.13.2 Jack Screw Standoffs (JSO) – Serve same function as traditional standoffs but unique, nested
construction facilitates the mating and unmating process. This is especially helpful for multiple connector
applications where the mating and unmating forces increase with the number of connectors used. See
options here: JSO - Jack Screw Standoffs
Revision: C
Date: May 12, 2015
Page 9
© Samtec, Inc.
Product Specification
Series: HDAF / HDAM 2,00 mm (.0787”) X 1,20 mm (.0472”) HD MezzTM Rugged, High Density Open Pin Field Array
7.14 Cleaning: Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents
and conditions designated in the EIA-364-11A standard.
8.0 ADDITIONAL RESOURCES
8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at
[email protected]
8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at
[email protected]
8.3 For additional processing information, contact our Interconnect Processing Group at [email protected]
8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental
Compliance Group at [email protected]
Revision: C
Date: May 12, 2015
Page 10
© Samtec, Inc.