F-214 (Rev 15MAY14) QFS–026–04.25–L–D–A TM QFS–032–04.25–L–D–DP–A QFS–026–04.25–L–D–A–GP (0,635 mm) .025" QFS SERIES RUGGED GROUND PLANE SOCKET Increased insertion depth for rugged applications SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QFS Insulator Material: Liquid Crystal Polymer Contact & Ground Plane Material: Phosphor Bronze Plating: Au over 50µ" (1,27 µm) Ni (Tin on Ground Plane Tail) Current Rating: Contact: 2.6 A per pin (1 pin powered per row) Ground Plane: 15.7 A per ground plane (1 ground plane powered) Voltage Rating: 300 VAC mated with QMS Operating Temp: -55°C to +125°C RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (026-078) Board Stacking: For applications requiring more than two connectors per board contact [email protected] Board Mates: QMS Cable Mates: 6QCD ALSO AVAILABLE (1,60 mm) .063" NOMINAL WIPE (MOQ Required) Type PINS PER ROW NO. OF PAIRS QFS For complete scope of recognitions see www.samtec.com/quality –026, –052, –078 (52 total pins per bank = –D) –016, –032, –048 PLATING OPTION Specify LEAD STYLE from chart –L TM s ocol Prot orted Supp = Guide Holes ( –04.25 lead style only) –D = Single-Ended –D–DP = Differential Pair (–04.25 lead style only) –SL QMS LEAD STYLE LEAD STYLE A –04.25 (7,44) .293 10 mm 11 mm 14 mm –06.25 (9,42) .371 12 mm 13 mm 16 mm –05.75 –06.75 –09.75 (–06.25 lead style only) = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane (Tin on Signal Pin tails, and Ground Plane tails) (0,10) .004 *Processing conditions will affect mated height. GP = No. of Banks x (21,34) .840 + (12,45) .490 (0,89) .035 (1,02) .040 DIA STACK HEIGHT (0,44) .017 Requires Standoff SO-1524-03-01-01-L for 15,24 mm or SO-2215-02-01-01-L for 22 mm board spacing. Connectors designed to not fully seat when mated. (8,13) .320 (8,13) .320 01 APPLICATION A No. of Banks x (21,34) .840 + (1,02) .040 (0,635) (21,34) .840 .025 02 –D OTHER OPTION A TYPE –GP (–04.25 lead style only) = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane (Tin on Signal Pin tails, and Ground Plane tails) MATED HEIGHT* SUMIT TM 4-Express 10 I/ PC Note: Some lengths, styles and options are non-standard, non-returnable. LEAD STYLE (16 pairs per bank = –D–DP) stry Indu ards d Stan notes at Download app ppnote /a om c.c te m www.sa @ samtec.com Contact SIG on protocols for questions • Other platings • Without PCB Alignment Pins • Hot Pluggable • 4 banks (104 -SE, 64 -DP) Contact Samtec. Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling –D 9 GHz / 18 Gbps 8 GHz / 16 Gbps Differential Pair Signaling –D 8 GHz / 16 Gbps 8.5 GHz / 17 Gbps Differential Pair Signaling –DP 7.5 GHz / 15 Gbps 9 GHz / 18 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?QFS or contact [email protected] QMS/QFS 10 mm Stack Height RECOGNITIONS 100 GbE nel Fibre Chan XAUI ® s PCI Expres SATA Integral metal plane for power or ground INDUSTRY STANDARD INTERCONNECTS TERMINAL SOCKET SUMIT™ ASP-129637-01 ASP-129646-01 PCI/104-Express™ ASP-129637-03 ASP-129646-03 PCI/104-Express™ ASP-142781-02 ASP-129646-02 PCI/104-Express™ ASP-142781-03 ASP-129646-03 –D–DP WWW.SAMTEC.COM STACK BANKS HEIGHT 1 3 2 3 15,24 mm 15,24 mm 22 mm 22 mm