F-211-1 QSH–060–01–L–D–DP–A ® QSH–060–01–L–D–A–K (0,50mm) .0197" QSH–030–01–F–D–A–RT1 QSH SERIES HIGH SPEED GROUND PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QSH Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27µm) Ni Current Rating: Contact: 1.0A @ 30°C Temperature Rise Ground Plane: 7.8A @ 30°C Temperature Rise Operating Temp Range: -55°C to +125°C Voltage Rating: 125 VAC (5mm Stack Height) Max Cycles: 100 Unmating Force (-RT1 option): -RT1 option increases unmating force up to 50% RoHS Compliant: Yes Cable Mates: HQCD, HQDP, HFHM2 (See Application Specific note) *Note: –C Plating passes 10 year MFG testing Note: Some lengths, styles and options are non-standard, non-returnable. fina s ocol Prot orted Supp l i nch.com sport™ Hypertran XAUI ® s E I PC xpres SATA Infiniband EXTENDED LIFE PRODUCT Blade & Beam Design 10 year Mixed Flowing Gas with 50µ" Gold Call Samtec for maximum cycles mated with QTH 5mm Stack Height Type Rated @ 3dB Insertion Loss Single-Ended Signaling –D 9 GHz / 18 Gbps Differential Pair Signaling –D 8 GHz / 16 Gbps Differential Pair Signaling –DP 9.5 GHz / 19 Gbps Performance data for other stack heights and complete test data available at www.samtec.com?QSH or contact [email protected] PINS PER ROW NO. OF PAIRS QSH notes at Download app ppnote /a m co c. www.samte mtec.com sa @ IG S t Contac protocols on s on for questi ALSO AVAILABLE Board Spacing Standoffs. See SO Series. PLATING OPTION 01 TYPE A OTHER OPTION –F = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails –030, –060, –090, –120 (60 total pins per bank = –D) –020, –040, –060, –080 APPLICATION SPECIFIC OPTION • 14mm, 15mm, 22mm and 30mm stack height (Caution: Some automatic placement/inspection machines may have component height restrictions. Please consult machinery specifications.) • 30µ" (0,76µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount & Guide Posts • 150 positions per row Call Samtec. • Retention pin option ® TM Processing: Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10mm) .004" max (030-060) (0,15mm) .006" max (090-120) Board Stacking: For applications requiring more than two connectors per board or 4 banks or more, contact [email protected] Integral metal plane for power or ground Board Mates: QTH (20 pairs per bank = –D–DP) –L –D = (No. of Pins per Row/30) x (20,00) .7875 + (1,27) .050 = 10µ" (0,25µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –DP = (No. of Pairs per Row/20) x (20,00) .7875 + (1,27) .050 (20,00) .7875 (7,49) .295 (0,50) .0197 (0,15) .006 (3,25) .128 (3,05) .120 (7,24) .285 (0,76) .030 (0,89) .035 DIA –01 (3,81) .150 –RT1 (3,76) .148 DIA –K = (8,25mm) .325" DIA Polyimide Film Pick & Place Pad –D–DP = Differential Pair (–01 only) –C* 02 01 –D = SingleEnded = Electro-Polished Selective 50µ" (1,27µm) min Au over 150µ" (3,81µm) Ni on Signal Pins in contact area, 10µ" (0,25µm) min Au over 50µ" (1,27µm) Ni on Ground Plane in contact area, Matte Tin over 50µ" (1,27µm) min Ni on all solder tails (0,64) .025 –L WWW.SAMTEC.COM –TR = Tape & Reel (–090 positions maximum) –RT1 = Retention Option (–090 positions maximum) QTH MATED LEAD HEIGHT STYLE WITH QSH* –01 –02 –03 –04 –05 –07 (5,00) .197 (8,00) .315 (11,00) .433 (16,00) .630 (19,00) .748 (25,00) .984 *Processing conditions will affect mated height. –L = Latching Option (N/A on –060 (–D–DP), –080, –090 & –120 positions or –RT1 option)