MCM3216B900HBE

(Chip Common Mode Filter) Engineering Specification
MCM3216B Series
Features and Application
Powerful components with composite co-fired material to
solve
EMI
problem
for
high
speed differential
signal
transmission line as USB, and LVDS, without distortion to high
speed signal transmission
PRODUCT DETAIL
Imp.Com.
(Ω)±25%
@100MHz
DCR
Max.
(Ω)
Rated
Current
Max.(m A)
Rated
Voltage
(V)
Withstand
Voltage
(V)
Insulation
Resistance
Min.(MΩ)
MCM3216B900HBE
90
0.50
500
10
25
200
MCM3216B121HBE
120
0.50
500
10
25
200
Part Number
◆
◆
◆
◆
Test Instruments
Agilent E4991A RF IMPEDANCE / MATERIAL ANALYZER
HP4338 MILLIOHMMETER
Agilent E5071C ENA SERIES NETWORK ANALYZER
Keithley 2410 1100V SOURCE METER
PART NUMBER CODE
MCM
3216
B
1
2
3
90 0
4
H
B E
5 6
7 8
1: Series name
2: Size Code:the first two digitals:length(mm),the last two digitals:width(mm)
3: Material code
4: Impedance(Ω) ±25%
(ex:900=90Ω ;121=120Ω)
5: Fixed Decimal Point
6: Rated Current Code
A=50mA
B=80mA
C=100mA D=150mA E=200mA F=300mA
G=400mA
H=500mA
I=600mA
J=700mA
K=800mA
7: Soldering:Green Parts:A-Soldering Lead-FREE B-Lead-Free for whole chip
8: Packaging style P – Embossed paper tape, 7”reel.
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
Revision December 18, 2014
2014
1/6
Specifications are subject to change without notice.
(Chip Common Mode Filter) Engineering Specification
MCM3216B Series
TYPICAL CHARACTERISTIC
MCM3216B900
Fig1. IMPEDANCE vs. FREUQENCY CHARACTERISTICS
Fig2. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
MCM3216B121
Fig3. IMPEDANCE vs. FREUQENCY CHARACTERISTICS
Fig4. INSERTION LOSS vs. FREUQENCY CHARACTERISTICS
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
Revision December 18, 2014
2014
2/6
Specifications are subject to change without notice.
(Chip Common Mode Filter) Engineering Specification
MCM3216B Series
SHARES AND DIMENSIONS
TYPE
Dimension
L
3.20±0.20
W
1.60±0.20
T
1.00±0.10
P
2.10±0.20
C1
0.70±0.20
C2
0.30±0.20
Unit : mm
MEASURING CIRCUITS
CIRCUIT CONFIGURATION & LAYOUT PAD
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
Revision December 18, 2014
2014
3/6
Specifications are subject to change without notice.
(Chip Common Mode Filter) Engineering Specification
MCM3216B Series
TAPE AND REEL SPECIFICATIONS / TAPING DIMENSIONS
Type : Paper Carrier
Unit : mm
Symbol
size
symbol
size
A
1.20±0.05
Po
4.00±0.10
B
1.45±0.05
P1
4.00±0.10
W
8.00±0.10
P2
2.00±0.05
E
1.75±0.05
Do
1.55±0.05
F
3.50±0.05
T
0.60±0.03
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
Revision December 18, 2014
2014
4/6
Specifications are subject to change without notice.
(Chip Common Mode Filter) Engineering Specification
MCM3216B Series
REEL DIMENSIONS
STANDARD QUANTITY FOR PACKAGING
Packaging style : Taping
Reel packaging quantity : 3000 pcs/reel
Inner box : 5 reel/inner box
RECOMMENDED SOLDERING CONDITIONS
GENERAL TECHNICAL DATA
Opertation temperatur range : -40℃ ~ +85℃
Storage Condition : Less than 40℃ and 70% RH
Storage Time: 6 months Max.
Soldering method: Reflow or Wave Soldering
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
Revision December 18, 2014
2014
5/6
Specifications are subject to change without notice.
(Chip Common Mode Filter) Engineering Specification
MCM3216B Series
RELIABILITY AND TEST CONDITION
Test item
Temperature Cycle
Test condition
A. Temperature : -40 ~ +85℃
B. Cycle : 100 cycles
C. Dwell time : 30minutes
Measurement : at ambient temperature
24 hrs after test completion
Operational Life
A. Temperature : 85℃ ± 5℃
B. Test time : 1000 hrs
C. Apply current : full rated current
Measurement : at ambient temperature
24 hrs after test completion
Biased Humidity
A. Temperature : 40 ± 2℃
B. Humidity : 90 ~ 95 % RH
C. Test time : 1000 hrs
D. Apply current : full rated current
Measurement : at ambient temperature
24 hrs after test completion
A. Solder temperature : 260 ± 5℃
Resistance to Solder
B. Flux : Rosin
Heat
C. DIP time : 10 ± 1 sec
Steam Aging Test
A. Temperature : 93 ± 2℃
B. Test time : 4 hrs(MCA)
Others : 8 hrs
C. Solder temperature : 235 ± 5℃
D. Flux : Rosin
E. DIP time : 5 ± 1 sec
UN Semiconductor Co., Ltd.
Criteria
A. No mechanical damage
B. Impedance value should be
within ± 20 % of the initial
value
A. No mechanical damage
B. Impedance value should be
within ± 20 % of the initial
value
A. No mechanical damage
B. Impedance value should be
within ± 20 % of the initial
value
A. More than 95 % of terminal
electrode should be covered
with new solder
B. No mechanical damage
C .Impedance value should be
within ± 20 % of the initial
value
More than 95 % of terminal
electrode should be covered
with new solder
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd.
Revision December 18, 2014
2014
6/6
Specifications are subject to change without notice.