RC-LED-650-02 v 1.2 04.11.2014 Description RC-LED-650-02 is a Resonant Cavity LED module emitting at 660 nm with rated output power of about 185 µW. The module’s body is made of black anodized aluminium, enclosing RC-LED and an adjustable 3-glass collimator lens. Maximum Ratings Parameter Values Symbol Unit Forward Current IF Max. 30 Reverse Voltage VR 5 V Reverse Current IR 10 µA Min. mA Operating Temperature TCASE - 20 + 75 °C Storage Temperature TSTG - 40 + 100 °C Soldering Temperature TSOLD 260 °C Specifications (TCASE=25°C) Parameter Symbol Peak Wavelength λP Min. 640 Optical Power PO 170 Spectral Width Δλ Output Aperture Beam Character Values Typ. 650 Max. 660 185 200 Unit nm µW 7 nm Ø5 mm Round Forward Current IF 20 Forward Voltage VF 2.0 Rise Time (10 - 90%) tR 3 ns Fall Time (10 - 90%) tF 3 ns Δλ/ΔT 0.07 nm/°C ΔPO/ΔT -0.6 %/°C Wavelength Shift Power Drift Focus Lens Type Material Body mA 2.2 V adjustable 3-glass lens, AR coated Aluminium, black anodized Dimensions Ø10 x 18 mm PIN Leads Ø0.25 x 13.5 and ~10 (short pin) mm www.roithner-laser.com 1 Drawing 18.0 0.2 x 45° 9.8 Ø 9.4 Ø 10.0 PIN 1 PIN 2 6.4 14.0 All dimensions units are mm Electrical Connection Lead Description PIN 1 PIN 2 Anode Cathode Additional Information RC-LED chip structure www.roithner-laser.com Collimated far field beam pattern 2 Precaution for Use 1. Cautions DO NOT look directly into the emitted light or look through the optical system. To prevent in adequate exposure of the radiation, wear protective glasses. 2. Lead Forming • When forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. DO NOT use the base of the lead frame as a fulcrum during lead forming. • Lead forming should be done before soldering. • DO NOT apply any bending stress to the base of the lead. The stress to the base may damage the LED’s characteristics or it may break the LEDs. • When mounted the LEDs onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the LEDs. 3. Soldering Conditions • Solder the LEDs no closer than 3 mm from the base of the lead. • DO NOT apply any stress to the lead particularly when heat. • The LEDs must not be reposition after soldering. • After soldering the LEDs, the lead should be protected from mechanical shock or vibration until the LEDs return to room temperature. • When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. • Cut the LED leads at room temperature. Cutting the leads at high temperature may cause the failure of the LEDs. 4. Static Electricity • The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. © All Rights Reserved The above specifications are for reference purpose only and subjected to change without prior notice www.roithner-laser.com 3