LED660N-03 TECHNICAL DATA Infrared LED, 5 mm AlGaInP LED660N-series are AlGaInP LEDs mounted on a lead frame and encapsulated in various types of epoxy lens, which offers different design settings. On forward bias, it emits a high power radiation of typical 15 mW at a peak wavelength at 660 nm. Specifications • • • • • Structure: AlGaAs Peak Wavelength: typ. 660 nm Optical Ouput Power: typ. 15 mW Resin Material: Epoxy resin Solder: Lead free Absolute Maximum Ratings (Ta=25°C) Type Power Dissipation Forward Current Forward pulsed Current* Reverse Voltage Junction Temperature Thermal Resistance Operating Temperature Storage Temperature Soldering Temperature (for 5 sec.) Symbol PD IF IFP VR TJ Rthjp TOP TSTG TSOL Value 120 50 200 5 100 190 -30 … +80 -40 … +100 265 Unit mW mA mA V °C K/W °C °C °C * Pulse condition: Duty 1%, Puls Width 10µs Electro-Optical Characteristics (Ta=25°C) Item Forward Voltage Reverse Current Radiated Power Peak Wavelength Half Width Rise Time Fall Time Symbol VF IR PO λP Δλ tr tf Condition IF = 50 mA VR = 5 V IF = 50 mA IF = 50 mA IF = 50 mA IF = 50 mA IF = 50 mA Min. 8 650 - Typ. 2.1 15 660 18 80 80 Max. 2.3 10 670 - Unit V µA mW nm nm ns ns Characteristics of Radiant Intensity (Ta=25°C) Type LED660N-03 Viewing Half Angle Brightness / Radiation Intensity (IF = 50 mA) ±12° [Unit: mW/sr] Outer Dimension Typ. 25 Ø 5 mm * Radiant Power is measured by S3584-08 * Brightness is measured by TekTronix J-16 The above specifications are for reference purpose only and subjected to change without prior notice. 12.12.2011 LED660N-03 1 of 4 Typical Performance (Ta=25°C) 12.12.2011 LED660N-03 2 of 4 Outer Dimensions Precaution for Use 1. Cautions • DO NOT look directly into the emitted light or look through the optical system. To prevent in adequate exposure of the radiation, wear protective glasses. 2. Lead Forming • When forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. DO NOT use the base of the leadframe as a fulcrum during lead forming. • Lead forming should be done before soldering. • DO NOT apply any bending stress to the base of the lead. The stress to the base may damage the LED’s characteristics or it may break the LEDs. • When mounted the LEDs onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the LEDs. 12.12.2011 LED660N-03 3 of 4 Recommended Land Layout (Unit: mm) 3. Soldering Conditions • • • • • • Solder the LEDs no closer than 3 mm from the base of the lead. DO NOT apply any stress to the lead particularly when heat. The LEDs must not be reposition after soldering. After soldering the LEDs, the lead should be protected from mechanical shock or vibration until the LEDs return to room temperature. When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. Cut the LED leads at room temperature. Cutting the leads at high temperature may cause the failure of the LEDs. Soldering Conditions 4. Static Electricity • The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 12.12.2011 LED660N-03 4 of 4