LED490-series TECHNICAL DATA Visible LED InGaN LED490-series are InGaN LEDs mounted on a lead frame and encapsulated in various types of epoxy lens, which offers different design settings. On forward bias, it emits a band of visible light at a peak wavelength of 490 nm. Specifications • • • • • Structure: InGaN Peak Wavelength: typ. 490 nm Optical Ouput Power: typ. 12 mW Resin Material: Epoxy resin Solder: Lead free Absolute Maximum Ratings (Ta=25°C) Type Power Dissipation Forward Current Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature (for 5 sec.) Symbol PD IF VR TOP TSTG TSOL Value 200 50 5 -40 … +85 -40 … +100 265 Unit mW mA V °C °C °C Electro-Optical Characteristics (Ta=25°C) Item Forward Voltage Reverse Current Radiated Power Peak Wavelength Half Width 07.10.2014 Symbol VF IR PO λP Δλ Condition IF = 20 mA VR = 5 V IF = 20 mA IF = 20 mA IF = 20 mA LED490-series Min. 480 - Typ. 3.3 12 490 30 Max. 4.0 10 500 - Unit V µA mW nm nm 1 of 3 Type LED490-01 LED490-02 LED490-03 LED490-04 LED490-05 LED490-06 LED490-09 LED490-31 LED490-33 LED490-34 LED490-36 LED490-41 LED490-42 Viewing Half Angle Outer Dimension Dimension Figure ±9° ±4° ±12° ±20° ±30° ±7° ±18° (long) ±14° (short) Ø5 Ø5 Ø5 Ø5 Ø5 Ø5 Ø5 Oval Ø3 Ø3 Ø3 Ø3 Ø4 Ø4 1 2 3 4 5 6 ±16° ±32° 7 8 9 10 11 12 13 * Brightness is measured by Tektronix J-16 * Total Radiated Power is measured by Photodyne #500 The above specifications are for reference purpose only and subjected to change without prior notice. Precaution for Use 1. Cautions • DO NOT look directly into the emitted light or look through the optical system. To prevent in adequate exposure of the radiation, wear protective glasses. 2. Lead Forming • When forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. DO NOT use the base of the leadframe as a fulcrum during lead forming. • Lead forming should be done before soldering. • DO NOT apply any bending stress to the base of the lead. The stress to the base may damage the LED’s characteristics or it may break the LEDs. • When mounted the LEDs onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the LEDs. 07.10.2014 LED490-series 2 of 3 Recommended Land Layout (Unit: mm) 3. Soldering Conditions • Solder the LEDs no closer than 3 mm from the base of the lead. • DO NOT apply any stress to the lead particularly when heat. • The LEDs must not be reposition after soldering. • After soldering the LEDs, the lead should be protected from mechanical shock or vibration until the LEDs return to room temperature. • When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. • Cut the LED leads at room temperature. Cutting the leads at high temperature may cause the failure of the LEDs. Soldering Conditions 4. Static Electricity • The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 07.10.2014 LED490-series 3 of 3