LED1450-series

LED1450-series
TECHNICAL DATA
Infrared LED
InGaAsP
LED1450-series are InGaAsP LEDs mounted on a lead frame and encapsulated in various types of
epoxy lens, which offers different design settings.
On forward bias, it emits a high power radiation of typical 2.5 mW at a peak wavelength at
1450 nm.
Specifications
•
•
•
•
•
Structure: InGaAsP
Peak Wavelength: typ. 1450 nm
Optical Ouput Power: typ. 2.5 mW
Resin Material: Epoxy resin
Solder: Lead free
Absolute Maximum Ratings (Ta=25°C)
Type
Power Dissipation
Forward Current
Pulse Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature (for 5 sec.)
Symbol
PD
IF
IFP
VR
TOP
TSTG
TSOL
Value
140
100
1000
5
-40 … +85
-40 … +100
265
Unit
mW
mA
mA
V
°C
°C
°C
Electro-Optical Characteristics (Ta=25°C)
Item
Forward Voltage
Reverse Current
Radiated Power
Peak Wavelength
Half Width
Rise Time
Fall Time
21.11.2011
Symbol
VF
IR
PO
λP
Δλ
tr
tf
Condition
IF = 50 mA
VR = 5 V
IF = 50 mA
IF = 50 mA
IF = 50 mA
IF = 50 mA
IF = 50 mA
Min.
1.3
1400
-
LED1450-series
Typ.
1.0
2.5
1450
100
10
10
Max.
1.5
10
1500
-
Unit
V
µA
mW
nm
nm
ns
ns
1 of 8
Characteristics of Radiant Intensity (Ta=25°C)
Type
LED1450-01
LED1450-02
LED1450-03
LED1450-04
LED1450-05
LED1450-06
Viewing Half
Angle
Radiation Intensity (IF = 50 mA)
[Unit: mW/sr]
Min.
Typ.
Max.
±10°
18
±7°
32
LED1450-09
LED1450-46
LED1450-41
LED1450-42
LED1450-31
LED1450-33
LED1450-34
LED1450-36
±18°
9
±33°
3
Outer
Dimension
Dimension
Figure
Ø5
Ø5
Ø5
Ø5
Ø5
Ø5
Ø5
Oval
Ø5
Ø4
Ø4
Ø3
Ø3
Ø3
Ø3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
* Radiant Power is measured by G8370-85
* Brightness is measured by TekTronix J-16
Notes
• Do not view directly into the emitting area of the LED during operation!
• The above specifications are for reference purpose only and subjected to change without prior
notice.
21.11.2011
LED1450-series
2 of 8
Outer Dimensions
21.11.2011
Figure-1 Ø 5Mold (Type 01)
Figure-2 Ø 5Mold (Type 02)
Figure-3 Ø 5Mold (Type 03)
Figure-4 Ø 5Mold (Type 04)
Figure-5 Ø 5Mold (Type 05)
Figure-6 Ø 5Mold (Type 06)
Figure-7 Ø 5Mold (Type 09)
Figure-8 Ø 5Mold (Type 46)
Figure-9 Ø 4Mold (Type 41)
Figure-10 Ø 4Mold (Type 42)
LED1450-series
3 of 8
Figure-11 Ø 3Mold (Type 31)
Figure-12 Ø 3Mold (Type 33)
Figure-13 Ø 3Mold (Type 34)
Figure-14 Ø 3Mold (Type 36)
Viewing half angle
21.11.2011
Figure-1 Ø 5Mold (Type 01)
Figure-2 Ø 5Mold (Type 02)
Figure-3 Ø 5Mold (Type 03)
Figure-4 Ø 5Mold (Type 04)
Figure-5 Ø 5Mold (Type 05)
Figure-6 Ø 5Mold (Type 06)
LED1450-series
4 of 8
Figure-7 Ø 5Mold (Type 09)
Figure-8 Ø 5Mold (Type 46)
Figure-9 Ø 4Mold (Type 41)
Figure-10 Ø 4Mold (Type 42)
Figure-11 Ø 3Mold (Type 31)
Figure-12 Ø 3Mold (Type 33)
Figure-13 Ø 3Mold (Type 34)
Figure-14 Ø 3Mold (Type 36)
Typical Performance Curves
Forward Current – Forward Voltage
21.11.2011
Relative Radiant Intensity – Pulsed Forward
Current
LED1450-series
5 of 8
Forward Current – Pulse Duration
Forward Voltage – Ambient Temperature
Relative Radiant Intensity – Ambient
Temperature
Allowable Forward Current – Ambient
Temperature
21.11.2011
LED1450-series
6 of 8
Peak Wavelength
Peak Wavelength – Ambient Temperature
Precaution for Use
1. Cautions
• DO NOT look directly into the emitted light or look through the optical system. To prevent in
adequate exposure of the radiation, wear protective glasses.
• The LEDs are emitting invisible light.
2. Lead Forming
• When forming leads, the leads should be bent at a point at least 3 mm from the base of the
lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.
• Lead forming should be done before soldering.
• DO NOT apply any bending stress to the base of the lead. The stress to the base may
damage the LED’s characteristics or it may break the LEDs.
• When mounted the LEDs onto the printed circuit board, the holes on the circuit board should
be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it
causes deterioration of the lead and it will degrade the LEDs.
21.11.2011
LED1450-series
7 of 8
Recommended Land Layout (Unit: mm)
3. Soldering Conditions
• Solder the LEDs no closer than 3 mm from the base of the lead.
• DO NOT apply any stress to the lead particularly when heat.
• The LEDs must not be reposition after soldering.
• After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
• When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
• Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
Soldering Conditions
4. Static Electricity
• The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
• All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
21.11.2011
LED1450-series
8 of 8