Formosa MS FM4001-M H THRU FM4007-M H Chip General Purpose Rectifiers List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-121104 2008/02/10 2010/11/10 E 7 Formosa MS FM4001-M H THRU FM4007-M H Chip General Purpose Rectifiers 1.0A Surface Mount General Purpose Rectifiers - 50V-1000V Package outline Features • Batch process design, excellent power dissipation offers • • • • • • • SOD-123H better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Tiny plastic SMD package. High current capability. High surge capability. Glass passivated chip junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free parts, ex. FM4001-MH-H. 0.146(3.7) 0.130(3.3) 0.012(0.3) Typ. 0.071(1.8) 0.056(1.4) Mechanical data • • • 0.040(1.0) 0.024(0.6) Epoxy : UL94-V0 rated flame retardant Case : Molded plastic, SOD-123H 0.031(0.8) Typ. 0.031(0.8) Typ. Terminals :Plated terminals, solderable per MIL-STD-750, Method 2026 • • • Polarity : Indicated by cathode band Dimensions in inches and (millimeters) Mounting Position : Any Weight : Approximated 0.011 gram Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) CONDITIONS Forward rectified current See Fig.2 Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) V R = V RRM T J = 25 OC Reverse current V R = V RRM T J = 125 OC Diode junction capacitance f=1MHz and applied 4V DC reverse voltage Storage temperature SYMBOLS *1 V RRM (V) Symbol *3 VR (V) FM4001-MH 50 35 50 FM4002-MH 100 70 100 FM4003-MH 200 140 200 FM4004-MH 400 280 400 FM4005-MH 600 420 600 FM4006-MH 800 560 800 FM4007-MH 1000 700 1000 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 *4 VF (V) TYP. MAX. UNIT IO 1.0 A I FSM 25 A 5.0 IR μA 50 CJ T STG V RMS*2 (V) MIN. pF 15 O +175 -65 C Operating temperature T J, ( OC) *1 Repetitive peak reverse voltage *2 RMS voltage 1.10 -55 to +150 *3 Continuous reverse voltage *4 Maximum forward voltage@I F=1.0A Page 2 Document ID Issued Date Revised Date Revision Page. DS-121104 2008/02/10 2010/11/10 E 7 Rating and characteristic curves (FM4001-MH THRU FM4007-MH) FIG.1-TYPICAL FORWARD FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 10 3.0 1.0 1.2 1.0 0.8 0.6 P.C.B. Mounted on 0.2" x 0.2" (5 mm x 5 mm) Copper Pad Areas 0.4 0.2 0 0 20 40 TJ=25 C 60 80 100 120 140 160 180 200 LEAD TEMPERATURE (°C) Pulse Width 300us 1% Duty Cycle 0.1 FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT .01 .6 .7 .8 .9 1.0 1.1 1.2 1.3 FORWARD VOLTAGE,(V) FIG.3 - TYPICAL REVERSE CHARACTERISTICS PEAK FORWAARD SURGE CURRENT,(A) INSTANTANEOUS FORWARD CURRENT,(A) 50 50 40 30 8.3ms Single Half TJ=25 C JEDEC method 10 0 1 100 Sine Wave 20 5 50 10 100 FIG.5-TYPICAL JUNCTION CAPACITANCE 10 35 TJ=125 C JUNCTION CAPACITANCE,(pF) REVERSE LEAKAGE CURRENT, (m A) NUMBER OF CYCLES AT 60Hz 1.0 TJ=25 C .1 30 25 20 15 10 5 .01 0 0 20 40 60 80 .01 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) PERCENTAGE RATED PEAK REVERSE VOLTAGE,(%) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 .05 100 120 140 Page 3 Document ID Issued Date Revised Date Revision Page. DS-121104 2008/02/10 2010/11/10 E 7 Formosa MS FM4001-M H THRU FM4007-M H Chip General Purpose Rectifiers Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FM4001-MH FM4002-MH FM4003-MH FM4004-MH FM4005-MH FM4006-MH FM4007-MH A1 A2 A3 A4 A5 A6 A7 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-123H 0.071 (1.80) 0.051 (1.30) 0.067 (1.70) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision Page. DS-121104 2008/02/10 2010/11/10 E 7 Formosa MS FM4001-M H THRU FM4007-M H Chip General Purpose Rectifiers Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-123H Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.00 3.85 1.10 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-121104 2008/02/10 2010/11/10 E 7 Formosa MS FM4001-M H THRU FM4007-M H Chip General Purpose Rectifiers Reel packing PACKAGE SOD-123H REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) 3,000 4.0 BOX (pcs) 30,000 INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (m/m) (m/m) (m/m) (pcs) (kg) 183*183*123 178 382*262*387 240,000 8.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-121104 2008/02/10 2010/11/10 E 7 Formosa MS FM4001-M H THRU FM4007-M H Chip General Purpose Rectifiers High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 9. Forward Surge 8.3ms single half sine-wave superimposed on rated load, one surge. MIL-STD-750D METHOD-4066-2 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 MIL-STD-750D METHOD-1051 Document ID Issued Date Revised Date Revision Page. DS-121104 2008/02/10 2010/11/10 E 7