Formosa MS

Formosa MS
Chip Schottky Barrier Rectifier
FM320-B THRU FM3100-B
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
DS-121630
2008/02/10
Revised Date
2010/03/10
Revision
D
Page.
7
Formosa MS
Chip Schottky Barrier Rectifier
FM320-B THRU FM3100-B
3.0A Surface Mount Schottky Barrier
Rectifiers - 20V-100V
Package outline
Features
SMB
• Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
•
•
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
Low power loss, high efficiency.
High current capability, low forward voltage drop.
High surge capability.
Guardring for overvoltage protection.
Ultra high-speed switching.
Silicon epitaxial planar chip, metal silicon junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Suffix "-H" indicates Halogen free parts, ex. FM320-Β-H.
0.213(5.4)
0.197(5.0)
0.016(0.4) Typ.
0.142(3.6)
0.126(3.2)
0.075(1.9)
0.067(1.7)
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AA / SMB
• Terminals : Solder plated, solderable per
0.032(0.8) Typ.
0.032 (0.8) Typ.
Dimensions in inches and (millimeters)
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.09 gram
Maximum ratings and Electrical Characteristics (AT
PARAMETER
T A=25 oC unless otherwise noted)
Symbol
CONDITIONS
Forward rectified current
See Fig.1
Forward surge current
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V R = V RRM T J = 25 OC
Reverse current
Diode junction capacitance
V R = V RRM T J = 100 OC
f=1MHz and applied 4V DC reverse voltage
Storage temperature
MIN.
*1
V RRM
(V)
V RMS*2
(V)
*3
VR
(V)
FM320-B
20
14
20
FM330-B
30
21
30
FM340-B
40
28
40
FM350-B
50
35
50
FM360-B
60
42
60
FM380-B
80
56
80
FM3100-B
100
70
100
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
*4
VF
(V)
Operating
temperature
T J, ( OC)
0.50
-55 to +125
MAX.
UNIT
IO
3.0
A
I FSM
80
A
0.5
IR
20
mA
250
CJ
-65
T STG
SYMBOLS
TYP.
pF
+175
O
C
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
0.70
-55 to +150
*4 Maximum forward voltage@I F=3.0A
0.85
Page 2
Document ID
Issued Date
DS-121630
2008/02/10
Revised Date
2010/03/10
Revision
D
Page.
7
Rating and characteristic curves (FM320-B THRU FM3100-B)
FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE
FIG.2-TYPICAL FORWARD
0
20
40
60
80
100
120
140
160
180
200
LEAD TEMPERATURE,(°C)
PEAK FORWAARD SURGE CURRENT,(A)
FIG.3-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
0-
M
B
31
00
-B
M
34
M
36
0-
B~
F
0-
~F
~F
38
0B
FM
32
FM
0
3.0
35
0B
0.5
10
FM
-B
00
31
FM
0-B
34
FM
1.0
~
0-B
35
FM
1.5
INSTANTANEOUS FORWARD CURRENT,(A)
2.0
B
50
2.5
~
0-B
32
FM
AVERAGE FORWARD CURRENT,(A)
CHARACTERISTICS
3.0
1.0
TJ=25 C
Pulse Width 300us
1% Duty Cycle
0.1
100
.01
80
.1
.3
.5
.7
.9
1.1
1.3
1.5
FORWARD VOLTAGE,(V)
60
8.3ms Single Half
TJ=25 C
Sine Wave
40
JEDEC method
20
FIG.5 - TYPICAL REVERSE
CHARACTERISTICS
0
1
5
50
10
100
100
NUMBER OF CYCLES AT 60Hz
REVERSE LEAKAGE CURRENT, (mA)
FIG.4-TYPICAL JUNCTION CAPACITANCE
JUNCTION CAPACITANCE,(pF)
700
600
500
400
300
200
10
1.0
TJ=75 C
TJ=25 C
.1
100
0
.01
.05
.1
.5
1
5
10
50
100
REVERSE VOLTAGE,(V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
.01
0
20
40
60
80
100 120 140
PERCENT OF RATED PEAK REVERSE VOLTAGE,(%)
Page 3
Document ID
Issued Date
DS-121630
2008/02/10
Revised Date
2010/03/10
Revision
D
Page.
7
Formosa MS
Chip Schottky Barrier Rectifier
FM320-B THRU FM3100-B
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Marking
Type number
Marking code
FM320-B
FM330-B
FM340-B
FM350-B
FM360-B
FM380-B
FM3100-B
SS32
SS33
SS34
SS35
SS36
SS38
S310
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SMB
0.142 (3.60)
0.059 (1.50)
0.118 (3.00)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
DS-121630
2008/02/10
Revised Date
2010/03/10
Revision
D
Page.
7
Formosa MS
Chip Schottky Barrier Rectifier
FM320-B THRU FM3100-B
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SMB
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
3.81
5.74
2.24
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
8.00
4.00
2.00
0.23
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
DS-121630
2008/02/10
Revised Date
2010/03/10
Revision
D
Page.
7
Formosa MS
Chip Schottky Barrier Rectifier
FM320-B THRU FM3100-B
Reel packing
PACKAGE
REEL SIZE
SMB
13"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
4,000
8.0
8,000
337*337*37
330
CARTON
SIZE
(m/m)
350*330*360
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
16.9
64,000
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 6
Document ID
Issued Date
DS-121630
2008/02/10
Revised Date
2010/03/10
Revision
D
Page.
7
Formosa MS
Chip Schottky Barrier Rectifier
FM320-B THRU FM3100-B
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=80% rate at T J=125 OC for 168 hrs.
MIL-STD-750D
METHOD-1038
4. Forward Operation Life
Rated average rectifier current at T A=25 OC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25 OC, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
5. Intermittent Operation Life
6. Pressure Cooker
JESD22-A102
15P SIG at T A=121 OC for 4 hrs.
7. Temperature Cycling
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Thermal Shock
0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-1056
9. Forward Surge
8.3ms single half sine-wave superimposed
on rated load, one surge.
MIL-STD-750D
METHOD-4066-2
10. Humidity
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1021
11. High Temperature Storage Life
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 7
MIL-STD-750D
METHOD-1051
Document ID
Issued Date
DS-121630
2008/02/10
Revised Date
2010/03/10
Revision
D
Page.
7